IP Library Granted Patent US 11,473,818
Granted Patent B2
US 11,473,818 · App. 16/813,023 · Granted Oct 18, 2022

Cycle enhancement methods, systems, and devices

Inventors: Russell Goldfarbmuren (Denver, CO); Luke Erickson (Denver, CO)
Assignee: Rebound Technologies, Inc.
F25B30/06F25B1/10F25B5/02F25B9/14F25B25/005F25B25/02F25B40/02F25B40/04F25B41/31F25B2400/05F25B2400/13F25B2500/18
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Quick Facts
Patent No.
US 11,473,818
App. No.
16/813,023
Granted
Oct 18, 2022
Kind
B2
Abstract

Methods, systems, and device for cycle enhancement are provided in accordance with various embodiments. Various embodiments generally pertain to refrigeration and heat pumping. Different embodiments may be applied to a variety of heat pump architectures. Some embodiments may integrate with vapor compression heat pumps in industrial, commercial, and/or residential applications. Some embodiments include a method that may include at least: removing a first heat from a vapor compression cycle; utilizing the first removed heat from the vapor compression cycle to drive a thermally driven heat pump; or removing a second heat from the vapor compression cycle utilizing the thermally driven heat pump to reduce a temperature of a refrigerant of the vapor compression cycle below an ambient temperature.

Claims (28)

1. A system comprising:

a compressor of a vapor compression cycle;

a first heat exchanger coupled with the vapor compression cycle and a thermally driven heat pump, wherein the first heat exchanger is positioned between the compressor of the vapor compression cycle and a condenser of the vapor compression cycle and is configured to remove a first heat from the vapor compression cycle and desuperheat a refrigerant of the vapor compression cycle such that the refrigerant from the vapor compression cycle remains above a condensing temperature of the refrigerant from the vapor compression cycle and the thermally driven heat pump is driven utilizing the first removed heat from the vapor compression cycle; and

wherein the condenser is configured to receive the refrigerant from the first heat exchanger and condense the refrigerant from the vapor compression cycle; and

a second heat exchanger coupled with the vapor compression cycle to remove a second heat from the refrigerant from the vapor compression cycle after the condenser condenses the refrigerant from the vapor compression cycle and coupled with the thermally driven heat pump, wherein removing the second heat from the vapor compression cycle utilizing the second heat exchanger reduces a temperature of the refrigerant of the vapor compression cycle below an ambient temperature.

2. The system of claim 1 , wherein the second heat exchanger is positioned between the condenser of the vapor compression cycle and an expansion valve of the vapor compression cycle.

3. The system of claim 1 , wherein the thermally driven heat pump includes a freeze point suppressant cycle.

4. The system of claim 3 , wherein the first removed heat from the vapor compression cycle drives the thermally driven heat pump through separating a freeze point suppressant from a refrigerant of the thermally driven heat pump to form a concentrated freeze point suppressant.

5. The system of claim 4 , wherein the thermally driven heat pump includes a solid maker.

6. The system of claim 5 , wherein:

the thermally driven heat pump is configured to combine a solid from the solid maker with the concentrated freeze point suppressant to form at least a portion of the refrigerant of the thermally driven heat pump; and

the second heat exchanger is configured to receive the portion of the refrigerant of the thermally driven heat pump to reduce the temperature of the refrigerant of the vapor compression cycle below the ambient temperature.

7. The system of claim 2 , further comprising a receiving vessel positioned to receive at least a liquid form of the refrigerant of the vapor compression cycle or a vapor form of the refrigerant of the vapor compression cycle after the refrigerant of the vapor compression cycle passes through the expansion valve of the vapor compression cycle.

8. The system of claim 7 , further comprising a third heat exchanger configured to receive at least a first portion of the liquid form of the refrigerant of the vapor compression cycle, wherein the third heat exchanger is thermally coupled with the refrigerant of the thermally driven heat pump and further cools the first portion of the liquid form of the refrigerant of the vapor compression cycle below the ambient temperature through removing a third heat from the vapor compression cycle.

9. The system of claim 8 , wherein the second heat exchanger and the third heat exchanger are utilized in series.

10. The system of claim 8 , wherein the second heat exchanger and the third heat exchanger are utilized in parallel.

11. The system of claim 7 , wherein the receiving vessel is coupled with the thermally driven heat pump such that at least a second portion of the liquid form of the refrigerant of the vapor compression cycle is directed to a solid maker of the thermally driven heat pump.

12. The system of claim 8 , further comprising a fourth heat exchanger positioned to receive a portion of the refrigerant of the vapor compression cycle that passes through the third heat exchanger to remove a fourth heat from the vapor compression cycle.

13. The system of claim 12 , wherein the fourth heat exchanger and the thermally driven heat pump are coupled with each other such that the fourth removed heat from the vapor compression cycle drives the thermally driven heat pump.

14. The system of claim 13 , wherein the thermally driven heat pump includes a separator configured to receive the fourth removed heat from the vapor compression cycle to separate a freeze point suppressant from the refrigerant of the thermally driven heat pump to form a concentrated freeze point suppressant.

15. The system of claim 14 , wherein:

the thermally driven heat pump is configured to combine a solid from a solid maker with the concentrated freeze point suppressant to form at least a portion of a refrigerant of the thermally driven heat pump; and

the second heat exchanger is configured to receive the portion of the refrigerant of the thermally driven heat pump to reduce the temperature of the refrigerant of the vapor compression cycle below the ambient temperature.

16. The system of claim 12 , wherein the fourth heat exchanger is coupled with the receiving vessel such that the receiving vessel receives the portion of the refrigerant from the vapor compression cycle that has passed through the fourth heat exchanger.

17. The system of claim 16 , further comprising a fifth heat exchanger that is thermally coupled with the refrigerant of the thermally driven heat pump to remove a fifth heat from the vapor compression cycle and is coupled with the receiving vessel to receive at least a third portion of the liquid form of the refrigerant of the vapor compression cycle that is further cooled below the ambient temperature through removing the fifth heat from the vapor compression cycle.

18. The system of claim 17 , wherein:

the fourth heat exchanger is coupled with the compressor to direct the refrigerant of the vapor compression cycle from the fourth heat exchanger to the compressor; and

the fifth heat exchanger is coupled with the compressor to direct the refrigerant of the vapor compression cycle from the fifth heat exchanger to the compressor.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Feb 24, 2026
From: CORNERSTONE COLLATERAL CORP.
To: REBOUND TECHNOLOGIES, INC.
Reel/Frame 073875/0541 →
SECURITY INTEREST Recorded Sep 10, 2024
From: REBOUND TECHNOLOGIES, INC.
To: CORNERSTONE COLLATERAL CORP.
Reel/Frame 068538/0943 →
SECURITY INTEREST Recorded Jul 9, 2024
From: REBOUND TECHNOLOGIES, INC.,
To: CORNERSTONE COLLATERAL CORP.
Reel/Frame 067933/0233 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2020
From: GOLDFARBMUREN, RUSSELL; ERICKSON, LUKE
To: REBOUND TECHNOLOGIES, INC.
Reel/Frame 053035/0131 →
Continuity (3)
Continuation 15935005 · Mar 25, 2018
Provisional Application 62477162 · Mar 27, 2017
Related Publication 20200318867A1 · Oct 8, 2020
Cited By (1)
US 12,188,717