TE polarizer based on SOI platform
The present application discloses a Transverse Electric (TE) polarizer. The TE polarizer includes a semiconductor substrate having an oxide layer. The TE polarizer further includes a waveguide embedded in the oxide layer. Additionally, the TE polarizer includes a plate structure embedded in the oxide layer substantially in parallel to the waveguide with a gap distance. In an embodiment, the plate structure induces an extra transmission loss to a Transverse Magnetic (TM) mode in a light wave traveling through the waveguide.
1. A polarization-sensitive silicon photonics circuit for polarization sensitive optical communication comprising:
a silicon-on-insulator substrate having a silicon dioxide layer;
at least one passive component configured to deliver or receive a light wave to or from an active device;
a Transverse Electric (TE) polarizer coupled to the at least one passive component and/or the active device to make the light wave substantially in a TE mode, each TE polarizer comprising,
a waveguide embedded in the silicon dioxide layer;
a plate structure embedded in the silicon dioxide layer substantially in parallel to the waveguide with a gap distance;
wherein the plate structure induces an extra transmission loss greater than 6 dB to a Transverse Magnetic (TM) mode in the light wave while keeps a low transmission loss smaller than 2 dB to the TE mode in the light wave of a bandwidth >30 nm traveling through the waveguide.
2. The polarization-sensitive silicon photonics circuit of claim 1 , wherein the waveguide comprises a material which has semiconducting characteristics.
3. The polarization-sensitive silicon photonics circuit of claim 2 , wherein the material which has semiconducting characteristics comprises silicon.
4. The polarization-sensitive silicon photonics circuit of claim 2 , wherein the material which has semiconducting characteristics comprises silicon nitride.
5. The polarization-sensitive silicon photonics circuit of claim 1 , wherein the plate structure comprises a material which has metallic characteristics.
6. The polarization-sensitive silicon photonics circuit of claim 5 , wherein the material which has metallic characteristics comprises titanium nitride.
7. The polarization-sensitive silicon photonics circuit of claim 1 , wherein the waveguide comprises a first length and a rectangular shaped cross section having a first width and a first thickness.
8. The polarization-sensitive silicon photonics circuit of claim 7 , wherein the plate structure comprises a second length, a second width, and a second thickness, the second length being smaller than or equal to the first length, the second width being greater than the first width, and the second thickness being smaller than the first thickness.
9. The polarization-sensitive silicon photonics circuit of claim 7 , wherein the gap distance is optimized for given dimensions of the waveguide and the plate structure such that a transmission loss of the TM mode in the light wave for all wavelengths in a band is greater than a first target loss and a transmission loss of the TE mode in the light wave for all wavelengths in the band is smaller than a second target loss.
10. The polarization-sensitive silicon photonics circuit of claim 9 , wherein the first target loss comprises one of 7 dB, 10 dB, and 12 dB for all wavelengths in C-band from 1525 nm to 1565 nm and the second target loss comprises one of 2 dB, 1.5 dB, 1 dB, 0.5 dB for all wavelengths in the C-band.
11. The polarization-sensitive silicon photonics circuit of claim 10 , wherein the gap distance comprises a value in a range from 0.3 μm to 2 μm.
12. The polarization-sensitive silicon photonics circuit of claim 8 , wherein the second length comprises a value of smaller than 200 μm, smaller than 250 μm, smaller than 300 μm, smaller than 500 μm, smaller than 750 μm, or smaller than 1 mm, yielding a substantially linearly increasing extinction ratio.
13. The polarization-sensitive silicon photonics circuit of claim 9 , wherein the first target loss comprises one of 7 dB, 10 dB, and 12 dB for all wavelengths in O-band from 1270 nm to 1330 nm and the second target loss comprises one of 2 dB, 1.5 dB, 1 dB, 0.5 dB for all wavelengths in the O-band.
14. The polarization-sensitive silicon photonics circuit of claim 1 , wherein the passive component comprises one or more selected from a multiplexer, a demultiplexer, a polarization rotator, and a polarization splitter.
15. The polarization-sensitive silicon photonics circuit of claim 1 , wherein the active device comprises a photodetector or a laser diode.
16. The polarization-sensitive silicon photonics circuit of claim 1 further comprising a dense wavelength division multiplexed (DWDM) communication system for the light wave over a 30 nm C-band or O-band.
17. A method for using a Transverse Electric (TE) polarizer comprising:
providing a silicon-on-insulator substrate having a silicon dioxide layer;
forming a polarization-sensitive silicon photonics circuit including at least one passive component configured to deliver or receive a light wave to or from an active device;
providing a TE polarizer to couple with the at least one passive component and/or the active device to make the light wave substantially in a Transverse Electric (TE) mode, the TE polarizer comprising,
a waveguide embedded in the silicon dioxide layer;
a plate structure embedded in the silicon dioxide layer substantially in parallel to the waveguide with a gap distance;
wherein the plate structure induces an extra transmission loss greater than 6 dB to a Transverse Magnetic (TM) mode in the light wave while keeps a low transmission loss smaller than 2 dB to the TE mode in the light wave of a bandwidth over 30 nm traveling through the waveguide.
18. The method of claim 17 , wherein the waveguide comprises a material with semiconducting characteristics having a first length and a rectangular shaped cross section having a first width and a first thickness.
19. The method of claim 18 , wherein the plate structure comprises a material with metallic characteristics having a second length, a second width, and a second thickness, the second length being smaller than or equal to the first length, the second width being greater than the first width, and the second thickness being smaller than the first thickness.
20. The method of claim 18 , wherein the gap distance is configured to make a transmission loss of the TM mode in the light wave for all wavelengths in C band from 1525 nm to 1565 nm greater than a first target loss selected from 7 dB, 10 dB, and 12 dB and a transmission loss of the TE mode in the light wave for all wavelengths in C band smaller than a second target loss selected from 2 dB, 1.5 dB, 1 dB, 0.5 dB.