Method of mask layout

1. A method of a mask layout, comprising:

providing a frame with preset areas arranged at intervals, a positioning area between two adjacent preset areas, and a fixed area provided to offset from the positioning area and each of the preset areas, and a distance between two adjacent preset areas being a first predetermined distance L 1 ;

providing a cover mask corresponding to the positioning area, and a distance between an edge of the cover mask and the center of the positioning area being a second predetermined distance L 2 ; and

providing an evaporation mask on the fixed area according to preset conditions, a distance between two adjacent fixed areas being a third predetermined distance L 3 , and the third predetermined distance L 3 being equal to a difference between the first predetermined distance L 1 and the second predetermined distance L 2 ;

wherein the preset conditions comprise that the frame comprises a connection area for connecting the evaporation mask, the connection area is within each of the fixed areas, a distance between an edge of the connection area and an edge of the evaporation mask is a first distance D 1 , a distance between an edge of an evaporation area of the evaporation mask and the edge of the evaporation mask is a second distance D 2 , and the first distance D 1 is smaller than the second distance D 2 .

2. The method of a mask layout according to claim 1 , wherein the first distance D 1 is 1 to 1.5 mm.

3. The method of a mask layout according to claim 1 , wherein the second distance D 2 is greater than 1.5 mm.

4. The method of a mask layout according to claim 1 , wherein the preset conditions further comprise that there is a partial overlap between the cover mask and the evaporation mask, a distance between the edge of the cover mask near the evaporation area and the edge of the evaporation area is a third distance D 3 , a distance between an edge of the positioning area and the edge of the cover mask is a fourth distance D 4 , and the third distance D 3 is greater than or equal to the fourth distance D 4 .

5. The method of a mask layout according to claim 4 , wherein the third distance D 3 is 0.3 to 0.5 mm.

6. The method of a mask layout according to claim 4 , wherein the fourth distance D 4 is 0.3 mm.

7. The method of a mask layout according to claim 1 , wherein a width of each of the fixed areas is smaller than a width of each of the preset areas.

8. The method of a mask layout according to claim 1 , wherein a width of the evaporation mask equals to a width of each of the fixed areas.

9. The method of a mask layout according to claim 1 , wherein the evaporation area comprises an auxiliary pixel evaporation area, and a distance between an edge of the auxiliary pixel evaporation area and the edge of the evaporation mask is the second distance D 2 .

10. The method of a mask layout according to claim 1 , wherein the frame comprises a protrusion provided in each of the fixed areas and a groove provided in the positioning area, the evaporation mask is fixed on the protrusion, and the cover mask is provided in the groove.

11. The method of a mask layout according to claim 10 , wherein a solder joint is provided within the connection area, the evaporation mask is fixed to the protrusion by the solder joint, and a distance between an edge of the solder joint and the edge of the evaporation mask is the first distance D 1 .

12. The method of a mask layout according to claim 11 , wherein the number of solder joints is plural, and a distance between the edge of each of the solder joints closest to the cover mask and the edge of the evaporation mask is the first distance D 1 .

13. The method of a mask layout according to claim 11 , wherein the number of protrusions is plural, and a plurality of protrusions are arranged along a width direction of the evaporation mask, the groove is provided between two adjacent protrusions, and a plurality of evaporation masks are fixed on the plurality of protrusions, respectively.

14. The method of a mask layout according to claim 1 , wherein the evaporation mask is in a shape of a strip.

15. The method of a mask layout according to claim 14 , wherein a plurality of preset areas are disposed at intervals in a width direction of the evaporation mask.

16. The method of a mask layout according to claim 14 , wherein a plurality of evaporation masks are sequentially disposed on the frame in its width direction, there is a gap between two adjacent evaporation masks, and the covering mask is used to cover the gap.

17. The method of a mask layout according to claim 16 , wherein the gap between the two adjacent evaporation masks is smaller than the first predetermined distance L 1 .

18. The method of a mask layout according to claim 2 , wherein the preset conditions further comprise that there is a partial overlap between the cover mask and the evaporation mask, a distance between the edge of the cover mask near the evaporation area and the edge of the evaporation area is a third distance D 3 , a distance between an edge of the positioning area and the edge of the cover mask is a fourth distance D 4 , and the third distance D 3 is greater than or equal to the fourth distance D 4 .

19. The method of a mask layout according to claim 2 , wherein a width of each of the fixed areas is smaller than a width of each of the preset areas.

20. The method of a mask layout according to claim 2 , wherein a width of the evaporation mask equals to a width of each of the fixed areas.