Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materials
The present invention relates to use of an enhanced performance ultraconductive copper composite cylindrical conduit. The ultraconductive copper composite cylindrical conduit has enhanced RF conductivity.
1. An ultraconductive copper composite cylindrical conduit having an outer surface and enhanced RF conductivity, said conduit comprising an inner core, a shell comprising copper placed directly on and surrounding said inner core, a graphene layer directly on said shell, and an outer copper layer being deposited on said graphene layer to form the outer surface, wherein said shell, graphene layer and outer copper layer are sufficiently close to the outer surface thereby enhancing the RF conductivity of the conduit over a cylindrical conduit comprising copper alone.
2. The ultraconductive copper composite cylindrical conduit according to claim 1 , wherein said inner core is formed of copper.
3. The ultraconductive copper composite cylindrical conduit according to claim 1 , wherein said inner core is copper nickel silicon alloy.
4. The ultraconductive copper composite cylindrical conduit according to claim 1 , wherein said inner core is stainless steel.
5. A method of forming an ultraconductive copper composite cylindrical conduit having an outer surface, said method comprising placing a shell comprising copper directly on an inner core, growing a graphene layer on said shell, and depositing a copper layer on said graphene layer to form the outer surface, wherein said shell, said graphene layer and said outer copper layer are sufficiently close to the outer surface, thereby enhancing the RF conductivity of said conduit.
6. The method according to claim 5 , wherein said inner core is a copper nickel silicon alloy.
7. The method according to claim 5 , wherein said inner core is stainless steel.