APPARATUSES, SYSTEMS AND METHODS FOR PROTECTING ELECTRONIC DEVICE ASSEMBLIES
An apparatus for applying a protective coating to a high volume of separate electronic device assemblies includes a treatment element that is configured to prepare the high volume of electronic devices before protective coatings are applied to the electronic devices. The apparatus also includes a coating element configured to apply protective coatings to the high volume of separate electronic device assemblies.
1 - 28 . (canceled)
29 . An apparatus for applying a parylene protective coating to an electronic device assembly, comprising:
a parylene coating application element comprising:
at least one door; and
an interior deposition chamber space,
the coating application element sized to simultaneously apply protective coating to a plurality of electronic device assemblies, wherein the coating application element is cuboid-shaped.
30 . The apparatus of claim 29 , wherein the interior deposition chamber space of the coating application element is cuboid-shaped.
31 . The apparatus of claim 29 , wherein the at least one door comprises an entry door and an exit door.
32 . The apparatus of claim 31 , wherein the entry door and the exit door are flat.
33 . The apparatus of claim 32 , wherein the exit door is positioned at an opposite side of the coating application element from the entry door.
34 . The apparatus of claim 31 , wherein the entry door and the exit door are planar.
35 . The apparatus of claim 34 , wherein the exit door is positioned at an opposite side of the coating application element from the entry door.
36 . The apparatus of claim 29 , wherein the at least one door and a frame of the coating application element form the interior deposition chamber space, wherein the interior deposition chamber space is cuboid-shaped.
37 . The apparatus of claim 29 , wherein the coating application element is cube-shaped.
38 . The apparatus of claim 29 , wherein the interior deposition chamber space is cube-shaped.
39 . An apparatus for applying a parylene protective coating to an electronic device assembly, comprising:
a parylene coating application element comprising:
at least one door; and
an interior deposition chamber space,
the coating application element sized to simultaneously apply protective coating to a plurality of electronic device assemblies, wherein the coating application element is cube-shaped.
40 . The apparatus of claim 39 , wherein the interior deposition chamber space of the coating application element is cube-shaped.
41 . The apparatus of claim 39 , wherein the at least one door comprises an entry door and an exit door.
42 . The apparatus of claim 41 , wherein the entry door and the exit door are flat.
43 . The apparatus of claim 42 , wherein the exit door is positioned at an opposite side of the coating application element from the entry door.
44 . The apparatus of claim 41 , wherein the entry door and the exit door are planar.
45 . The apparatus of claim 44 , wherein the exit door is positioned at an opposite side of the coating application element from the entry door.
46 . The apparatus of claim 39 , wherein the at least one door and a frame of the coating application element form the interior deposition chamber space, wherein the interior deposition chamber space is cube-shaped.
47 . An apparatus for applying a parylene protective coating to an electronic device assembly, comprising:
a parylene coating application element comprising:
at least one door; and
an interior deposition chamber space,
the coating application element sized to simultaneously apply protective coating to a plurality of electronic device assemblies, wherein the coating application element is hexahedron-shaped.
48 . The apparatus of claim 47 , wherein the interior deposition chamber space of the coating application element is hexahedron-shaped.