METALLIZED COMPONENTS AND SURGICAL INSTRUMENTS
A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.
1 - 10 . (canceled)
11 . A method of manufacture comprising:
forming a metallized tie layer on a surface of a nonmetallic component;
positioning the surface of the nonmetallic component to mate with a metallic surface of a second component; and
joining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.
12 . The method of claim 11 , wherein the nonmetallic component is one of a group consisting of:
a polymeric component;
a ceramic component;
a ceramic-polymer composite component;
a resin plastic injection molded component;
an undoped silicon component;
a glass component; and
an alumina-filled epoxy component.
13 . The method of claim 11 , wherein the metal to metal joining techniques include compression fusion welding.
14 . The method of claim 13 , wherein the surfaces of the nonmetallic component and the metallic surface of the second component are gold plated, wherein the compression fusion welding is made by contacting the two gold plated surfaces and applying an energy source.
15 . The method of claim 14 , wherein the energy source is ultrasonic or megasonic in nature.
16 . The method of claim 14 , wherein the gold is held to the surface of the nonmetallic component by another metal forming the metallized tie layer.
17 . The method of claim 11 , wherein forming a metallized tie layer includes electroplating.
18 . The method of claim 11 , wherein forming a metallized tie layer includes electroless plating.
19 . The method of claim 11 , wherein forming a metallized tie layer includes vacuum deposition.
20 . The method of claim 11 , wherein forming a metallized tie layer includes sputtering of a metal.
21 . The method of claim 20 , wherein the metal includes one or more of Ti, Cr, Ta, Ru, NiChrome and NiV.
22 . The method of claim 20 , wherein the metal is selectively deposited utilizing a shadow mask.
23 . The method of claim 11 , wherein forming a metallized tie layer includes vapor deposition.
24 . The method of claim 11 , further comprising modifying the surface of the nonmetallic component by an ion source containing oxygen, or argon or both prior to forming the metallized tie layer on the surface of the nonmetallic component.
25 . The method of claim 11 , further comprising modifying the surface of the nonmetallic component by an plasma source containing oxygen, or argon or both prior to forming the metallized tie layer on the surface of the nonmetallic component.
26 . The method of any of claim 11 wherein the surface of the nonmetallic component is a 3D surface.
27 . The method of claim 26 , further comprising bonding or adhering a gold layer over the metallized tie layer prior to joining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.
28 . The method of claim 11 , wherein the metal to metal joining techniques include reflow of tin based solder attached to both surfaces.
29 . The method of claim 11 , wherein the nonmetallic component is a resin plastic injection molded component, and the surface of the second component is a metallic 3D curved surface.
30 . The method of claim 11 , wherein the nonmetallic component has a 3D curved surface, and the surface of the second component is a metallic 3D curved surface.
31 . The method of claim 11 , wherein the metal to metal joining techniques include reflow of tin based solder attached to the metallized tie layer.
32 . The method of claim 31 , wherein the solder is bonded to the nonmetallic component with a solderable metal.
33 . The method of claim 32 , wherein the solderable metal includes one or more of Cu, Au, Ag, Ni, Ru, Cd, Sn, Ra, Brass and Pb.
34 . The method of claim 32 , wherein the solderable metal is cohesively bonded to the nonmetallic component by the metallized tie layer.
35 . The method of claim 32 , wherein the solderable metal is chosen from one that forms an intermetallic without fully dissolving into the solder.
36 . The method of claim 32 , wherein the solderable metal is chosen from one that can be electroplated to the metallic surface of the second component.
37 . The method of claim 11 , wherein the second component is a metal component.
38 . The method of claim 11 , wherein the second component is a second nonmetallic component, wherein the mated metallic surface of the second component includes a second metallized tie layer.
39 . The method of claim 38 , wherein the second nonmetallic component is one of a group consisting of:
a polymeric component;
a ceramic component;
a ceramic-polymer composite component;
a glass component; and
a resin plastic injection molded component.
40 - 52 . (canceled)