IP Library Granted Patent US 10,950,771
Granted Patent B2
US 10,950,771 · App. 16/820,393 · Granted Mar 16, 2021

Light-emitting device

Inventors: Min-Hsun Hsieh (Hsinchu, TW); Biing-Jye Lee (Hsinchu, TW); Yih-Hua Renn (Hsinchu, TW); Jai-Tai Kuo (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/62H01L33/52H01L33/54H01L33/56H01L33/60H01L33/642H01L33/486H01L33/50H01L33/507H01L33/641H01L33/647H01L2224/16245H01L2924/181
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Quick Facts
Patent No.
US 10,950,771
App. No.
16/820,393
Granted
Mar 16, 2021
Kind
B2
Abstract

A light-emitting device includes a heat-dissipating structure having a first part and a second part separated from the first part; a light-emitting unit including a light-emitting element with a first pad formed on the first part; and a first transparent enclosing the light-emitting element and having a sidewall; and an adhesive material covering a portion of the sidewall.

Claims (23)

1. A light-emitting device comprising:

a heat-dissipating structure including a first part and a second part, the first part being separated from the second part;

a first metal layer and a second metal layer, the second metal layer being separated from the first metal layer, the first metal layer being placed on the first part, the second metal layer being placed on the second part;

a light-emitting unit having outer sidewalls and a top surface, the light-emitting unit including:

a light-emitting element having a first electrode and a second electrode, the first electrode being separated from the second electrode;

a transparent structure enclosing the light-emitting element;

a first pad electrically connected to the first electrode;

a second pad electrically connected to the second electrode; and

a reflective structure formed on the transparent structure, wherein the first part and second part, the first metal layer and second metal layer, and the light-emitting unit collaboratively define a space; and

an adhesive structure placed between the light-emitting unit and the heat-dissipating structure, a first part of the adhesive structure being filled in the space, and a second part of the adhesive structure covering the outer sidewalls and the top surface of the light-emitting unit to form a dome shape.

2. The light-emitting device of claim 1 , wherein the reflective structure is a single layer.

3. The light-emitting device of claim 1 , wherein the reflective structure includes a plurality of metal layers.

4. The light-emitting device of claim 1 , wherein the adhesive structure is made of an insulation material.

5. The light-emitting device of claim 1 , wherein the light-emitting unit is a flip-chip.

6. A light-emitting device comprising:

a heat-dissipating structure including a first part and a second part separated from the first part;

a first metal layer and a second metal layer separated from the first metal layer, the first metal layer being placed on the first part and the second metal layer being placed on the second part;

a light-emitting unit having outer sidewalls and a top surface, including a first pad and a second pad, the first pad being separated from the second pad, wherein the first part and second part, the first metal layer and second metal layer, and the light-emitting unit collaboratively define a space; and

an adhesive structure placed between the light-emitting unit and the heat-dissipating structure, a first part of the adhesive structure being filled in the space and a second part of the adhesive structure covering the outer sidewalls and the top surface of the light-emitting unit to form a recess at a position right above and vertically aligned with the light-emitting unit.

7. The light-emitting device of claim 6 , wherein the adhesive structure includes a plurality of heat-conductive particles.

8. The light-emitting device of claim 6 , wherein the adhesive structure is transparent or translucent.

9. The light-emitting device of claim 6 , wherein the adhesive structure is made of an insulation material.

10. The light-emitting device of claim 6 , wherein the light-emitting unit is a flip-chip.

Assignments (1)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
Continuity (4)
Continuation 15867315 · Jan 10, 2018
Continuation 14721599 · May 26, 2015
Provisional Application 62003262 · May 27, 2014
Related Publication 20200220061A1 · Jul 9, 2020