Printed circuit board and light guide for electronics assembly

1. A trim panel assembly, comprising: a printed foil extending for a first area; a printed circuit board disposed overtop the printed foil, the printed circuit board extending for a second area smaller than the first area; a light guide disposed overtop the printed circuit board and having a perimeter, wherein the perimeter of the light guide is inset from the printed foil, and the perimeter of the light guide surrounds the printed circuit board and forms a sealed interface with the printed foil, and wherein at least a portion of the perimeter of the light guide is beveled; a reflector disposed overtop the light guide; and wherein in an electronic assembly the reflector, the light guide, the printed circuit board, and the printed foil are disposed at least partially in a cavity of a molded support panel, wherein the molded support panel is substantially planar, and wherein a semi-transparent material is overmolded directly onto and overtop the electronic assembly and at least some of the molded support panel, wherein the perimeter of the light guide has a beveled portion, wherein when the semi-transparent material is overmolded onto the electronic assembly, the semi-transparent material is injected in a direction substantially parallel the molded support panel, the molded support panel being substantially planar, and the beveled portion of the perimeter of the light guide generates a force in a direction orthogonal to the substantially planar molded support panel, wherein the force creates the sealed interface between the light guide and the printed foil.

2. The trim panel assembly of claim 1 wherein the semi-transparent material is overmolded in an injection direction.

3. The trim panel assembly of claim 1 wherein the beveled portion faces towards the injection direction.

4. The trim panel assembly of claim 1 wherein the beveled portion of the perimeter of the light guide defines a curvilinear cross-section extending from a lateral edge having a first thickness to an inboard shoulder having a second thickness greater than the first thickness.

5. The trim panel assembly of claim 1 wherein the beveled portion of the perimeter of the light guide defines an angular cross-section extending from a lateral edge having a first thickness to an inboard shoulder having a second thickness greater than the first thickness.

6. The trim panel assembly of claim 1 wherein the beveled portion of the perimeter of the light guide is inset from edges of the printed foil by a distance of at least one millimeter.

7. The trim panel assembly of claim 1 wherein the light guide, the printed circuit board, and the printed foil define an air gap located at an outer edge of the printed circuit board.

8. The trim panel assembly of claim 1 wherein an angle of the beveled portion defines a quantity of the force generated by the light guide when the semi-transparent material is overmolded onto the electronic assembly.

9. A trim panel assembly comprising: a molded support panel, the molded support panel including an exterior surface and a cavity defined in the exterior surface; an electronic assembly located in the cavity, the electronic assembly including: a printed foil extending for a first area; a printed circuit board disposed overtop the printed foil, the printed circuit board extending for a second area smaller than the first area; a light guide disposed overtop the printed circuit board and having a perimeter, wherein the perimeter of the light guide is inset from the printed foil, and the perimeter of the light guide surrounds the printed circuit board and forms a sealed interface with the printed foil, and wherein at least a portion of the perimeter of the light guide is beveled; a reflector disposed overtop the light guide; and wherein the molded support panel is substantially planar, and wherein a semi-transparent material is overmolded directly onto and overtop the electronic assembly and at least some of the molded support panel, wherein the perimeter of the light guide includes a beveled portion, wherein the beveled portion faces towards the injection direction, wherein when the semi-transparent material is overmolded onto the electronic assembly, the semi-transparent material is injected in a direction substantially parallel to the molded support panel, the molded support panel being substantially planar, and the beveled portion of the perimeter of the light guide generates force in a direction orthogonal to the molded support panel, the molded support panel being substantially planar, wherein the force creates the sealed interface between the light guide and the printed foil.

10. The trim panel assembly of claim 9 wherein the semi-transparent material is overmolded in an injection direction.

11. The trim panel assembly of claim 9 wherein the beveled portion of the perimeter of the light guide defines one or more of a curvilinear cross-section and an angular cross-section.

12. The trim panel assembly of claim 9 wherein the beveled portion of the perimeter of the light guide is inset from edges of the printed foil by a distance of at least one millimeter.

13. The trim panel assembly of claim 9 wherein the light guide, the printed circuit board, and the printed foil define an air gap located at an outer edge of the printed circuit board.

14. The trim panel assembly of claim 9 wherein an angle of the beveled portion defines a quantity of the force generated by the light guide when the semi-transparent material is overmolded onto the electronic assembly.

15. A method of forming a trim panel assembly, comprising:

assembling an electronic assembly having a printed foil extending for a first area, a printed circuit board (PCB) disposed overtop the printed foil, the PCB extending for a second area smaller than the first area, a light guide disposed overtop the printed circuit board and having a perimeter, wherein the perimeter of the light guide is inset from the printed foil, and the perimeter of the light guide surrounds the PCB and forms a sealed interface with the printed foil, and wherein the perimeter of the light guide includes a beveled portion, and a reflector disposed overtop the light guide;

arranging the electronic assembly within a cavity defined in an exterior surface of a molded support panel, the molded support panel being substantially planar;

overmolding a semi-transparent material directly onto and overtop the electronic assembly and at least some of the molded support panel, and

wherein the semi-transparent material is overmolded in an injection direction, and wherein the beveled portion of the perimeter of the light guide is inset from edges of the printed foil by a distance of at least one millimeter; and the light guide, the PCB, and the printed foil define an air gap located at an outer edge of the printed circuit board; and wherein the beveled portion faces towards the injection direction and defines one or more of a curvilinear cross-section and an angular cross-section.

16. The method of claim 15 overmolding a semi-transparent material further comprises:

injecting the semi-transparent material in a direction substantially parallel to the molded support panel; and

causing the beveled portion of the perimeter of the light guide to generate force in a direction orthogonal to the molded support panel, wherein the force creates the sealed interface between the light guide and the printed foil, and wherein an angle of the beveled portion defines a quantity of the force generated by the light guide when the semi-transparent material is overmolded onto the electronic assembly.