IP Library Granted Patent US 11,017,823
Granted Patent B1
US 11,017,823 · App. 16/824,807 · Granted May 25, 2021

System and method for dynamic adjustment of SSD critical temperature threshold based on memory size

Inventors: Srinivas Kamepalli (Austin, TX); Kan Lip Vui (Singapore, SG); Travis North (Cedar Park, TX)
Assignee: Dell Products L.P.
G11C7/04G01K7/425G06F12/0246G06F12/16
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Quick Facts
Patent No.
US 11,017,823
App. No.
16/824,807
Granted
May 25, 2021
Kind
B1
Abstract

A system and method for dynamically adjusting a critical temperature threshold of non-volatile memory to ensure full capture of information to non-volatile memory before the information handling system hibernates. If the operating temperature of the non-volatile memory reaches a critical temperature threshold, a controller determines the memory size of information in volatile memory. If there is a maximum memory size, the controller uses the default critical temperature threshold as the critical temperature threshold and initiates a process to write information to the non-volatile memory and hibernates the system. If there is less than the maximum memory size, the controller may dynamically increase the critical temperature threshold based on the memory size such that the information in volatile memory can be written to the non-volatile memory before the information handling system hibernates.

Claims (68)

1. An information handling system with a platform management system, the information handling system comprising:

a volatile memory;

a non-volatile memory;

a processor communicatively coupled to the volatile memory and the non-volatile memory; and

a platform management system comprising:

a controller; and

a memory medium communicatively coupled to the controller, the memory medium storing a first critical temperature threshold and comprising a set of instructions executable by the controller to:

determine an operating temperature of a non-volatile memory;

if the operating temperature is equal to the first critical temperature threshold of the non-volatile memory:

determine a memory size of information in the volatile memory;

if the memory size is equal to a maximum memory size:

communicate with the processor to write the information from the volatile memory to the non-volatile memory; and

transition the information handling system to a lower power state;

if the memory size is less than the maximum memory size:

determine a second critical temperature threshold based on the memory size;

store the second critical temperature threshold in the platform management memory.

2. The information handling system of claim 1 , wherein the set of instructions are executable by the controller to:

determine a time period needed to write the memory size to the non-volatile memory; and

calculate the second critical temperature threshold based on a difference between an amount of heat generated by the non-volatile memory over the time period and an amount of heat removed from the information handling system over the time period.

3. The information handling system of claim 2 , wherein the set of instructions are executable by the controller to communicate with a power usage sensor associated with the non-volatile memory to calculate the amount of heat generated by the non-volatile memory over the time period.

4. The information handling system of claim 1 , wherein the set of instructions are executable by the controller to select a parameter block from a plurality of parameter blocks, each parameter block specifying a second critical temperature threshold based on the memory size and the operating temperature of the non-volatile memory.

5. The information handling system of claim 4 , wherein:

the set of instructions are further executable by the controller to update the second critical temperature threshold in one or more of the plurality of parameter blocks based on a time period required to write a previous memory size to the non-volatile memory.

6. The information handling system of claim 1 , wherein the set of instructions are executable by the controller to communicate with a temperature sensor associated with the non-volatile memory to determine the operating temperature of the non-volatile memory.

7. The information handling system of claim 1 , wherein the first critical temperature threshold is a default critical temperature threshold loaded during a startup of the information handling system.

8. An information handling system, comprising:

a volatile memory;

a non-volatile memory;

a processor communicatively coupled to the volatile memory and the non-volatile memory, the processor configured to execute a set of instructions to load a default critical temperature threshold for a component during a startup process;

a platform management system comprising:

a controller; and

a memory medium communicatively coupled to the controller, the memory medium storing the default critical temperature threshold and comprising a set of instructions executable by the controller to:

determine an operating temperature of a non-volatile memory;

if the operating temperature is equal to the default critical temperature threshold of the non-volatile memory:

determine a memory size of information in the volatile memory;

if the memory size is equal to a maximum memory size:

 communicate with the processor to write the information from the volatile memory to the non-volatile memory; and

 transition the information handling system to a lower power state;

if the memory size is less than the maximum memory size:

 determine an adjusted critical temperature threshold based on the memory size;

 replace the default critical temperature threshold with the adjusted critical temperature threshold in the platform management memory.

9. The information handling system of claim 8 , wherein the set of instructions are executable by the controller to communicate with a temperature sensor associated with the non-volatile memory to determine the operating temperature of the non-volatile memory.

10. The information handling system of claim 8 , wherein the set of instructions are executable by the processor to:

determine a time period needed to write the memory size to the non-volatile memory; and

calculate the adjusted critical temperature threshold based on a difference between an amount of heat generated by the non-volatile memory over the time period and an amount of heat removed from the information handling system over the time period.

11. The information handling system of claim 10 , wherein the set of instructions are executable by the controller to communicate with a power usage sensor associated with the non-volatile memory to calculate the amount of heat generated by the non-volatile memory over the time period.

12. The information handling system of claim 8 , wherein the set of instructions are executable by the controller to select a parameter block from a plurality of parameter blocks, each parameter block containing specifying an adjusted critical temperature threshold based on the memory size and the operating temperature of the non-volatile memory.

13. The information handling system of claim 12 , wherein:

the set of instructions are further executable by the controller to update the adjusted critical temperature threshold in one or more of the plurality of parameter blocks based on a time period required to write a previous memory size to the non-volatile memory.

14. The information handling system of claim 8 , wherein the adjusted critical temperature threshold is removed from the memory medium when the information handling system powers down.

15. A computer-implemented method for dynamically adjusting a critical temperature threshold of non-volatile memory based on a memory size of information in a volatile memory in an information handling system, the method comprising:

determining an operating temperature of the non-volatile memory;

if the operating temperature of the non-volatile memory is equal to a critical temperature threshold of the non-volatile memory:

determining a memory size of information in the volatile memory;

if the memory size is equal to a maximum memory size:

communicating with a processor to write the information from the volatile memory to the non-volatile memory; and

transitioning the information handling system to a lower power state;

if the memory size is less than the maximum memory size:

determining an adjusted critical temperature threshold corresponding to the memory size; and

replacing the critical temperature threshold with the adjusted critical temperature threshold; and

storing a parameter block with the adjusted critical temperature threshold to the platform management memory.

16. The method of claim 15 , wherein determining the operating temperature of the non-volatile memory comprises communicating with a temperature sensor associated with a Solid-State Device (SSD).

17. The method of claim 15 , wherein determining an adjusted critical temperature threshold corresponding to the memory size comprises:

determining a time period needed to write the memory size to the non-volatile memory; and

calculating the adjusted critical temperature threshold based on a difference between an amount of heat generated by the non-volatile memory over the time period and an amount of heat removed from the information handling system over the time period.

18. The method of claim 17 , wherein calculating the adjusted critical temperature threshold comprises communicating with a power usage sensor associated with the non-volatile memory to calculate the amount of heat generated by the non-volatile memory over the time period.

19. The method of claim 15 , wherein determining the adjusted critical temperature comprises selecting a parameter block from a plurality of parameter blocks, each parameter block containing an adjusted critical temperature threshold based on the memory size and the operating temperature of the non-volatile memory.

20. The method of claim 19 , further comprising updating the adjusted critical temperature threshold in one or more of the plurality of parameter blocks based on a time period required to write a previous memory size to the non-volatile memory.

Assignments (13)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0917) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0509 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052852/0022) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0582 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0081) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0441 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052771 FRAME 0906 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0298 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052852/0022 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0081 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0917 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY AGREEMENT Recorded May 28, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052771/0906 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2020
From: KAMEPALLI, SRINIVAS; VUI, KAN LIP; NORTH, TRAVIS
To: DELL PRODUCTS L.P.
Reel/Frame 052174/0062 →
Cited By (6)
US 12,223,198 US 12,260,895 US 12,429,933 US 12,632,268 US 12,675,221 US 12,693,719