Magnetic clamping interconnects
A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via magnetized interconnects. The backplane substrate may include circuits for driving the LED array, and each of the magnetized interconnects electrically connect a LED device to a corresponding circuit of the backplane substrate. The magnetized interconnects may be formed by electrically connecting first structures protruding from the backplane substrate to second structures protruding from the LED substrate. At least one of the first structure and the second structure includes ferromagnetic material configured to secure the first structure to the second structure.
1. A device comprising:
a first substrate having a first surface, and a first structure protruding from the first surface, the first substrate including at least a circuit electrically connected to the first structure; and
a second substrate having a second surface, and a second structure protruding from the second surface, the second substrate including at least a semiconductor device electrically connected to the second structure,
wherein at least one of the first structure and the second structure including ferromagnetic material configured to secure the first structure to the second structure, and
wherein the at least one of the first structure and the second structure is composed of an inner body structure formed of non-ferromagnetic material, and the ferromagnetic material coated on at least a part of the inner body structure.
2. The device of claim 1 , wherein the ferromagnetic material includes at least one of iron, cobalt, and nickel.
3. The device of claim 1 , wherein the at least one of the first structure and the second structure is formed of ferromagnetic material.
4. A device comprising:
a first substrate having a first surface, and a first structure protruding from the first surface, the first substrate including at least a circuit electrically connected to the first structure; and
a second substrate having a second surface, and a second structure protruding from the second surface, the second substrate including at least a semiconductor device electrically connected to the second structure,
wherein at least one of the first structure and the second structure includes ferromagnetic material configured to secure the first structure to the second structure, and
wherein the first structure has a cylindrical shape, and is formed with an opening or a groove, and wherein the second structure has a conical shape.
5. A device comprising:
a first substrate having a first surface, and a first clamp protruding from the first surface, the first substrate including at least a circuit, and the first clamp electrically insulated from the circuit;
a second substrate having a second surface, and a second clamp protruding from the second surface, the second substrate including at least a semiconductor device, and the second clamp electrically insulated from the semiconductor device; and
an interconnect between the first substrate and the second substrate, the interconnect electrically connecting the circuit to the semiconductor device,
wherein at least one of the first clamp structure and the second clamp structure including ferromagnetic material configured to secure the at least one to the other one of the first clamp and the second clamp, and
wherein the at least one of the first clamp and the second clamp is composed of an inner body structure formed of non-ferromagnetic material, and the ferromagnetic material coated on at least a part of the inner body structure.
6. The device of claim 5 , wherein the ferromagnetic material includes at least one of iron, cobalt, and nickel.
7. The device of claim 5 , wherein the at least one of the first clamp and the second clamp is formed of the ferromagnetic material.
8. The device of claim 5
wherein each of the first clamp and the second clamp has a cylindrical shape.
9. The device of claim 5 , wherein the first clamp is located at a corner region of the first substrate, and the second clamp is located at another corner region of the second substrate.