Smartcard constructions and methods
Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M 1 , M 2 , M 3 ) each having a slit (S 1 , S 2 , S 3 ) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S 2 ) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.
1. Smartcard capable of operating in at least a contactless mode, comprising:
a module comprising an RFID chip and a module antenna; and
a card body comprising a stackup of at least two metal layers;
wherein at least one of the metal layers has a discontinuity in the form of a slit or nonconductive stripe extending through the layer from an outer edge of the layer to an interior position thereof so that the metal layer functions as a coupling frame; and
wherein the at least one of the metal layers functioning as a coupling frame has an opening to accommodate a transponder chip module.
2. The smartcard of claim 1 , wherein:
the discontinuity in the at least one of the metal layers overlaps the module antenna.
3. The smartcard of claim 1 , wherein:
both metal layers have a discontinuity in the form of a slit or nonconductive stripe extending through the layer from an outer edge of the layer to an interior position thereof.
4. The smartcard of claim 3 , wherein:
the discontinuities in both of the metal layers overlap the module antenna.
5. The smartcard of claim 1 , wherein:
the discontinuity of a given one of the metal layers is positioned or oriented differently than the discontinuity of the other metal layer(s) so that the discontinuities of the at least two metal layers are not aligned with one another.
6. The smartcard of claim 1 , wherein:
at least one of the metal layers extends from edge-to-edge on the card body.
7. The smartcard of claim 1 , wherein:
both of the metal layers extend from edge-to-edge on the card body.
8. The smartcard of claim 1 , wherein:
the interior position is a module opening for receiving the chip module.
9. The smartcard of claim 1 , wherein:
at least two of the metal layers each have a module opening for receiving the chip module.
10. The smartcard of claim 9 , wherein:
the two metal layers are stacked one atop the other;
the module openings in the two metal layers are aligned with one another and are sized to form a stepped recess; and
the chip module is disposed in the stepped recess.
11. The smartcard of claim 1 , further comprising:
a front metal layer which does not have a discontinuity; and
a shielding layer disposed between the front metal layer and the at least two metal layers.
12. The smartcard of claim 1 , wherein:
the chip module further comprises contact pads; and
the smartcard is dual interface, operable in both contact and contactless modes.
13. The smartcard of claim 1 , further comprising:
PVC layers disposed on front and back surfaces of the card body.
14. The smartcard of claim 13 , wherein:
at least one of the PVC layers is digitally printed.
15. The smartcard of claim 1 , wherein the discontinuities in at least some of the metal layers are slits, and wherein at least one of the following:
the metal layer and slit are coated with a decorative or protective layer;
a coating conceals the slit;
at least some of the slits are filled;
at least some of the slits are not filled;
a given slit is hidden (or disguised) with a DLC (diamond-like carbon) coating.
16. The smartcard of claim 1 , wherein:
the discontinuities in at least some of the metal layers are slits; and
at least some of the slits are at least partially filled with a material selected from the group consisting of resin, a dielectric material, diamond like carbon coating, an electrically non-conducting material, a polymer, epoxy resin, a dielectric oxide, and reinforced epoxy resin.