ARRAY SUBSTRATES, MANUFACTURING METHODS THEREOF AND DISPLAY PANELS
An array substrate, a manufacturing method thereof and a display panel including the array substrate are provided. The array substrate includes a display region, a border region and a gap region between the display region and the border region, and includes: a first substrate; an OLED display unit on a surface of the display region; a barrier structure on a surface of the gap region; and a protective layer covering the OLED display unit. A boundary of the protective layer and that of the barrier structure toward the display region are connected; and a circuit board on a surface of the border region. With the array substrate, a problem that the protective layer located on a surface of the OLED display unit extends to the border region to cause a negative influence on a subsequent binding process for the circuit board is solved.
1 . A method for manufacturing an array substrate comprising:
a display region, a border region surrounding the display region and a gap region located between the display region and the border region, comprising:
providing, a first substrate;
forming, an OLED display unit, on a surface of the display region on a first side of the first substrate;
forming, a barrier structure, on a surface of the gap region on the first side of the first substrate;
placing, a reticle, on a surface of the border region on the first side of the first substrate and a surface of the barrier structure;
forming, a protective layer covering the OLED display unit, on the first side of the first substrate, by using the reticle as a mask, wherein a boundary of the protective layer and a boundary of the barrier structure toward the display region are connected with each other; and
removing the reticle, and binding a circuit board to the surface of the border region on the first side of the first substrate.
2 . The method for manufacturing the array substrate according to claim 1 , wherein a manufacturing process for the barrier structure is an inkjet printing process or a screen printing process.
3 . The method for manufacturing the array substrate according to claim 1 , wherein a horizontal distance between a central point of the barrier structure and the border region is greater than 0.3 mm.
4 . The method for manufacturing the array substrate according to claim 1 , wherein a horizontal distance between a central point of the barrier structure and a boundary of the circuit board in the border region is greater than 0.3 mm, wherein the boundary of the circuit board is an edge of the circuit board that is nearest to the central point of the barrier structure.
5 . The method for manufacturing the array substrate according to claim 1 , wherein a distance between a boundary of the reticle toward the display region and a central point of the barrier structure is greater than 5 μm.
6 . The method for manufacturing the array substrate according to claim 1 , wherein a height of the barrier structure in a direction perpendicular to a surface of the first substrate ranges from 4 μm to 16 μm, inclusive.
7 . The method for manufacturing the array substrate according to claim 1 , wherein the reticle totally covers the barrier structure and the border region in a direction perpendicular to the first side of the first substrate.
8 . The method for manufacturing the array substrate according to claim 1 , wherein a top surface of the barrier structure is not covered by the protective layer.
9 . The method for manufacturing the array substrate according to claim 1 , wherein the protective layer is a first layer made of inorganic material, or a lamination of the first layer made of inorganic material and a second layer made of organic material.