IP Library Granted Patent US 11,297,712
Granted Patent B2
US 11,297,712 · App. 16/830,451 · Granted Apr 5, 2022

Modular printed circuit board wafer connector with reduced crosstalk

Inventors: Keith Edwin Miller (Manheim, PA); Albert Tsang (Harrisburg, PA)
Assignee: TE CONNECTIVITY SERVICES GmbH
H05K1/0219H01R12/73H01R13/26H01R13/518H01R13/6471
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Quick Facts
Patent No.
US 11,297,712
App. No.
16/830,451
Granted
Apr 5, 2022
Kind
B2
Abstract

A circuit board for use in a modular electrical connector. Signal pathways is provided on a first surface. First ground pathways is provided on the first surface adjacent at least one of the signal pathways. Second ground pathways are provided on a second surface in line with the signal pathways. Vias extend from the first ground pathways through the circuit board to the second ground pathways, thereby placing the first ground pathways in electrical engagement with the second ground pathways. The first ground pathways, the vias and the second ground pathways extend along multiple pairs of the signal pathways and form cavities around the multiple pairs of the signal pathways to provide electrical shielding for the multiple pairs of the signal pathways.

Claims (19)

1. A circuit board for use in a modular electrical connector, the circuit board comprising: a first surface and an oppositely facing second surface; a plurality of signal pathways provided on the first surface; a plurality of first ground pathways provided on the first surface, each of the plurality of first ground pathways positioned adjacent to at least one of the plurality of signal pathways; a plurality of second ground pathways provided on the second surface, the plurality of second ground pathways are positioned in line with the plurality of the signal pathways; vias extend from the first plurality of ground pathways through the circuit board to the second plurality of ground pathways, thereby placing the first plurality of ground pathways in electrical engagement with the second plurality of ground pathways; wherein the first plurality of ground pathways, the vias and the second plurality of ground pathways provide 360 degree shielding along the length of the multiple pairs of the plurality of signal pathways and form cavities around the multiple pairs of the plurality of signal pathways to minimize gaps or spaces, which could allow EMI leakage between pairs of signal pathways to provide electrical shielding for the multiple pairs of the plurality of signal pathways; wherein the first plurality of ground pathways, the vias and the second plurality of ground pathways extend to a mating interface of the circuit board to control electrical characteristics at the mating interface by controlling cross talk, signal radiation and impedance; wherein a contact protection member is provided on the first surface of the circuit board proximate a mating end, the contact protection member extends from the first surface in a direction away from the second surface.

2. The circuit board as recited in claim 1 , wherein the plurality of signal pathways have mating signal contacts, signal traces and mounting signal contacts.

3. The circuit board as recited in claim 2 , wherein the signal pathways extend between the mating end and a mounting end of the circuit board.

4. The circuit board as recited in claim 3 , wherein the plurality of signal pathways are arranged in pairs carrying differential signals.

5. The circuit board as recited in claim 4 , wherein the plurality of first ground pathways have mating ground contacts, first ground traces and mounting ground contacts.

6. The circuit board as recited in claim 5 , wherein the first ground pathways extend between the mating end and the mounting end.

7. The circuit board as recited in claim 6 , wherein the second ground pathways extend between the mating end and the mounting end.

8. The circuit board as recited in claim 7 , wherein the mating signal contacts have first mating contact receiving sections and first securing sections.

9. The circuit board as recited in claim 8 , wherein each of the first mating contact receiving sections has two resilient arms with lead in portions and engagement portions.

10. The circuit board as recited in claim 9 , wherein the mounting signal contacts have first mounting members and first compliant portions.

11. The circuit board as recited in claim 10 , wherein the mating ground contacts have second mating contact receiving sections and second securing sections.

12. The circuit board as recited in claim 11 , wherein each of the second mating contact receiving sections has two resilient arms with lead in portions and engagement portions.

13. The circuit board as recited in claim 12 , wherein the mounting ground contacts have second mounting members and second compliant portions.

14. The circuit board as recited in claim 1 , wherein the contact protection member has a lead-in surface and mounting projections, the mounting projections cooperate with openings of the circuit board to maintain the contact protection member on the circuit board.

15. A modular electrical connector comprising: a housing having modules positioned therein, the modules having circuit boards, the circuit boards comprising: a first surface and an oppositely facing second surface; signal pathways provided on the first surface; first ground pathways provided on the first surface, each of the first ground pathways positioned adjacent at least one of the signal pathways; second ground pathways provided on the second surface, the second ground pathways are positioned in line with the signal pathways; vias extend from the first ground pathways through the circuit board to the second ground pathways, thereby placing the first ground pathways in electrical engagement with the second ground pathways; wherein the combination of the first ground pathways, the vias and the second ground pathways of the circuit boards of the modules entirely peripherally surround pairs of signal pathways to minimize gaps or spaces, which could allow EMI leakage between pairs of signal pathways to provide electrical shielding for the pairs of signal pathways; wherein a contact protection member is provided on the first surface of the circuit board proximate a mating end, the contact protection member extends from the first surface in a direction away from the second surface.

16. The modular electrical connector as recited in claim 15 , wherein the signal pathways extend between the mating end and a mounting end of the circuit board, the signal pathways are arranged in pairs carrying differential signals, the signal pathways have mating signal contacts, signal traces and mounting signal contacts.

17. The modular electrical connector as recited in claim 16 , wherein the first ground pathways extend between the mating end and a mounting end of the circuit board, the first ground pathways have mating ground contacts, first ground traces and mounting ground contacts.

18. The modular electrical connector as recited in claim 17 , wherein the second ground pathways extend between the mating end and the mounting end.

19. The modular electrical connector as recited in claim 18 , wherein the mating signal contacts have first mating contact receiving sections and first securing sections, each of the first mating contact receiving sections has two resilient arms with lead in portions and engagement portions, the mounting signal contacts have first mounting members and first compliant portions.

Assignments (2)
MERGER Recorded Jun 7, 2022
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SOLUTIONS GMBH
Reel/Frame 060305/0923 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2020
From: MILLER, KEITH EDWIN; TSANG, ALBERT
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 052333/0263 →