Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture
Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.
1. A panel of light-emitting diode (LED) arrays, the panel comprising:
a substrate having a top surface and a bottom surface;
a plurality of backplanes embedded in the substrate, each of the plurality of backplanes having a top surface and a bottom surface;
a plurality of arrays of first electrically conductive structures extending at least from the top surface of each of the plurality of backplanes to the top surface of the substrate;
a plurality of LED arrays, each electrically coupled to one of the plurality of arrays of first electrically conductive structures;
a plurality of second electrically conductive structures extending from each of the plurality of backplanes to at least the bottom surface of the substrate, at least some of the second electrically conductive structures electrically coupled to at least one of the plurality of LED arrays; and
a plurality of thermal conductors, at least one of the plurality of thermal conductors in contact with the bottom surface of one of the plurality of backplanes and extending to at least the bottom surface of the substrate.
2. The panel of claim 1 , wherein the plurality of backplanes comprise a non-organic material.
3. The panel of claim 1 , wherein the substrate comprises an organic material.
4. The panel of claim 1 , wherein the plurality of arrays of first electrically conductive structures comprise a plurality of arrays of metal pillars.
5. The panel of claim 1 , wherein the plurality of arrays of first electrically conductive structures extend above the top surface of the substrate.
6. The panel of claim 1 , wherein the plurality of second electrically conductive structures at least partially comprise conductive vias in the substrate.
7. The panel of claim 6 , wherein the plurality of second electrically conductive structures further comprise surface traces on the backplane that are electrically coupled to the conductive vias in the substrate.
8. The panel of claim 6 , wherein the substrate comprises at least one layer of dielectric material, and the conductive vias are formed in the at least one layer of dielectric material.
9. The panel of claim 1 , wherein the plurality of LED arrays are monolithic LED arrays, each comprising a plurality of emitters, each of the plurality of emitters having a width of 100 μm or less and arranged in rows and columns with lanes between adjacent rows and columns having a width of 20 μm or less.
10. A light-emitting diode (LED) lighting system comprising:
a substrate portion having a top surface and a bottom surface;
a backplane embedded in the substrate portion, the backplane having a top surface and a bottom surface;
an array of first electrically conductive structures extending at least from the top surface of the backplane to the top surface of the substrate portion;
an LED array electrically coupled to the array of first electrically conductive structures;
a plurality of second electrically conductive structures extending from the backplane to at least the bottom surface of the substrate, at least some of the second electrically conductive structures electrically coupled to the array of first electrically conductive structures via the backplane; and
a thermal conductor in contact with the bottom surface of the backplane and extending to at least the bottom surface of the substrate.
11. The system of claim 10 , wherein the backplane comprises a non-organic material.
12. The system of claim 10 , wherein the substrate comprises an organic material.
13. The system of claim 10 , wherein the array of first electrically conductive structures comprises an array of metal pillars.
14. The system of claim 10 , wherein the array of first electrically conductive structures extend above the top surface of the substrate.
15. The system of claim 10 , wherein the plurality of second electrically conductive structures at least partially comprise conductive vias in the substrate.
16. The system of claim 15 , wherein the plurality of second electrical conductors further comprise surface traces on the backplane that are electrically coupled to the conductive vias in the substrate.
17. The system of claim 15 , wherein the plurality of second electrically conductive structures further comprise surface traces on the backplane that are electrically coupled to the conductive vias in the substrate.
18. The system of claim 15 , wherein the substrate comprises at least one layer of dielectric material, and the conductive vias are formed in the at least one layer of dielectric material.
19. The system of claim 10 , wherein the LED array is a monolithic LED array.
20. The system of claim 19 , wherein the monolithic LED array comprises a plurality of emitters, each of the plurality of emitters having a width of 100 μm or less and arranged in rows and columns with lanes between adjacent rows and columns having a width of 20 μm or less.