THERMAL BARRIER COATING
An electron beam vapor deposition process for depositing coatings comprises placing a source coating material in a crucible of a vapor deposition apparatus having a coating chamber; pressurizing said coating chamber from about 0.5 microbar to about 40 microbar; heating a work piece surface to a temperature of from 1800 degrees Fahrenheit to 2000 degrees Fahrenheit; energizing said source coating with an electron beam that delivers a power density to the material in the crucible forming a vapor cloud from said source coating material; and depositing said source coating material onto a surface of a work piece.
1 . An electron beam vapor deposition process for depositing coatings comprising:
placing a source coating material in a crucible of a vapor deposition apparatus having a coating chamber;
pressurizing said coating chamber from about 0.5 microbar to about 40 microbar;
heating a work piece surface to a temperature of from 1800 degrees Fahrenheit to 2000 degrees Fahrenheit;
energizing said source coating with an electron beam that delivers a power density to the material in the crucible forming a vapor cloud from said source coating material; and
depositing said source coating material onto a surface of a work piece.
2 . The process according to claim 1 , further comprising:
pressurizing said coating chamber from about 0.5 microbar to about 20 microbar with a corresponding lower temperature limit of the work piece of from 1890-1920 degrees Fahrenheit.
3 . The process according to claim 1 , further comprising:
pressurizing said coating chamber from about 0.5 microbar to about 20 microbar.
4 . The process according to claim 1 , further comprising:
pressurizing said coating chamber from about 0.5 microbar to about 8 microbar.
5 . The process according to claim 1 , further comprising:
heating said work piece surface to a lower temperature limit of from about 1838 degrees Fahrenheit to about 1850 degrees Fahrenheit with a corresponding chamber pressure of 13.0 microbar.
6 . The process according to claim 1 , further comprising:
shortening a mean free path of molecules within said vapor cloud thereby reducing the kinetic energy of said molecules.
7 . A vapor deposition system comprising:
a coating chamber having a crucible;
a source coating material located in said crucible;
an electron beam source configured to direct an electron beam onto said source coating material;
a work piece located in said coating chamber; wherein said electron beam creates a vapor cloud to form a columnar coating on said work piece under a coating chamber pressure of from about 0.5 microbar to about 40 microbar with a corresponding temperature of said work piece from 1800 degrees Fahrenheit to 2000 degrees Fahrenheit.
8 . The vapor deposition system according to claim 7 , wherein said coating chamber pressure comprises 13 microbar.
9 . The vapor deposition system according to claim 7 , wherein said coating deposition system is configured to heat said work piece surface to a temperature from about 1800 degrees Fahrenheit to about 2000 degrees Fahrenheit.
10 . The vapor deposition system according to claim 7 , wherein said coating deposition system is configured to pressurize said coating chamber from about 0.5 microbar to about 20 microbar.
11 . The vapor deposition system according to claim 7 , wherein said coating deposition system is configured to pressurize said coating chamber from about 0.5 microbar to about 8 microbar.
12 . The vapor deposition system according to claim 7 , wherein said coating deposition system is configured to heat said work piece surface to a lower temperature limit of from about 1838 degrees Fahrenheit to about 1850 degrees Fahrenheit with a chamber pressure of 13.0 microbar.