IP Library Granted Patent US 11,157,049
Granted Patent B2
US 11,157,049 · App. 16/835,743 · Granted Oct 26, 2021

Storage drive carrier and chassis

Inventors: Haifang Zhai (Shanghai, CN); Yujie Zhou (Shanghai, CN); Xiaoping Wu (Shanghai, CN); Wei Dong (Shanghai, CN)
Assignee: EMC IP Holding Company LLC
G06F1/187G11B33/04
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Quick Facts
Patent No.
US 11,157,049
App. No.
16/835,743
Granted
Oct 26, 2021
Kind
B2
Abstract

Techniques provide for a storage drive carrier. The carrier may include a body configured to receive a storage drive, the body having a first length in a first direction, a second length in a second direction, and a third length in a third direction. The third length is below the first length, the first length is below the second length, and the first direction, the second direction, and the third direction are perpendicular to one another. The storage drive carrier may further include a protrusion configured to receive a first circuit board for transmitting data, the protrusion being arranged together with the body in the third direction. The protrusion is positioned within an area delimited by a center line of a face of the body on which the protrusion is provided and sides of the face, the center line bisecting the face and being parallel with the second direction.

Claims (25)

1. A storage drive carrier, comprising:

a body configured to receive a storage drive, the body having a first length in a first direction, a second length in a second direction, and a third length in a third direction, the third length being less than the first length, the first length being less than the second length, and the first direction, the second direction, and the third direction being perpendicular to one another; and

a protrusion configured to receive both a first circuit board for transmitting data and an additional second circuit board for supplying power, the protrusion being arranged together with the body in the third direction, wherein the first circuit board includes a first interface configured to transmit the data, wherein the first circuit board is arranged at a side of the storage drive carrier perpendicular to the third direction, wherein a length of the first circuit board is less than half the length of the storage drive carrier in the first direction, and wherein the second circuit board is superimposed over the first circuit board and arranged together with the first circuit board within the protrusion;

wherein the protrusion is positioned within an area delimited by a center line of a face of the body and sides of the face, the protrusion is provided on the face, and wherein the center line bisects the face and is parallel with the second direction.

2. The storage drive carrier according to claim 1 , wherein the first interface is configured to plug, in the second direction, to a backplate of a chassis for receiving the storage drive carrier.

3. The storage drive carrier according to claim 1 , wherein the second circuit board includes a second interface configured to transfer power.

4. The storage drive carrier according to claim 3 , wherein the second interface is configured to plug, in the second direction, to a backplate of a chassis for receiving the storage drive carrier.

5. The storage drive carrier according to claim 3 , wherein the second interface is configured to connect to the first interface to supply power for the first circuit board.

6. The storage drive carrier according to claim 1 , wherein the body further comprises an intermediate connector, and the first interface is connected to the storage drive via the intermediate connector.

7. The storage drive carrier according to claim 1 , wherein the storage drive is a 3.5″ storage drive.

8. The storage drive carrier according to claim 1 , wherein the storage drive carrier is configured to be stacked with an additional storage drive carrier, the protrusion of the storage drive carrier facing another area of the additional storage drive carrier except for an area provided with an additional protrusion.

9. A chassis comprising:

multiple storage drive carriers, each storage drive carrier including:

a body configured to receive a storage drive, the body having a first length in a first direction, a second length in a second direction, and a third length in a third direction, the third length being less than the first length, the first length being less than the second length, and the first direction, the second direction, and the third direction being perpendicular to one another, and

a protrusion configured to receive both a first circuit board for transmitting data and an additional second circuit board for supplying power, the protrusion being arranged together with the body in the third direction, wherein the first circuit board includes a first interface configured to transmit the data, wherein the first circuit board is arranged at a side of the storage drive carrier perpendicular to the third direction, wherein a length of the first circuit board is less than half the length of the storage drive carrier in the first direction, and wherein the second circuit board is superimposed over the first circuit board and arranged together with the first circuit board within the protrusion,

wherein the protrusion is positioned within an area delimited by a center line of a face of the body and sides of the face, the protrusion is provided on the face, and wherein the center line bisects the face and is parallel with the second direction;

wherein a first storage drive carrier is configured to be stacked with a second storage drive carrier, the protrusion of the first storage drive carrier facing another area of the second storage drive carrier except for an area provided with an additional protrusion;

wherein the chassis further comprises:

a third storage drive carrier stacked, in the third direction, near the first and second storage drive carriers, wherein the third storage drive carrier is configured to receive a third storage drive having a different type than storage drives received in the first and second storage drive carriers; and

a shell configured to receive the first and second storage drive carriers and the third storage drive carrier.

10. The chassis according to claim 9 , wherein the at least two storage drive carriers are configured to receive a 3.5″ storage drive while the further storage drive carrier is configured to receive a 2.5″ storage drive, and the chassis has a standard chassis height of 2U.

11. A method for manufacturing a storage drive carrier, the method comprising:

providing a body configured to receive a storage drive, the body having a first length in a first direction, a second length in a second direction, and a third length in a third direction, the third length being less than the first length, the first length being less than the second length, and the first direction, the second direction, and the third direction being perpendicular to one another; and

configuring the body with a protrusion to receive both a first circuit board for transmitting data and an additional second circuit board for supplying power, the protrusion being arranged together with the body in the third direction, wherein the first circuit board includes a first interface configured to transmit the data, wherein the first circuit board is arranged at a side of the storage drive carrier perpendicular to the third direction, wherein a length of the first circuit board is less than half the length of the storage drive carrier in the first direction, and wherein the second circuit board is superimposed over the first circuit board and arranged together with the first circuit board within the protrusion;

wherein the protrusion is positioned within an area delimited by a center line of a face of the body and sides of the face, the protrusion is provided on the face, and wherein the center line bisects the face and is parallel with the second direction.

Assignments (11)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0081) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0441 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0917) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0509 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052852/0022) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0582 →
RELEASE OF SECURITY INTEREST AT REEL 052771 FRAME 0906 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0298 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0917 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0081 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052852/0022 →
SECURITY AGREEMENT Recorded May 28, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052771/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2020
From: ZHAI, HAIFANG; ZHOU, YUJIE; WU, XIAOPING; DONG, WEI
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 052725/0393 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
Priority Claims (1)
CN 201910364319.5 · Apr 30, 2019 · national
Continuity (1)
Related Publication 20200348735A1 · Nov 5, 2020