System for discharging heat out of head-mounted display based on hybrid fan

1. A head-mounted display (HMD) comprising:

a fan having a center axis extending from a rear side of the HMD to a front side of the HMD, the fan configured to push air through a slit between a front cover of the HMD and a side cover of the HMD;

a circuit board with at least one processor separated from the fan, the at least one processor generating heat during operation of the HMD; and

a metal frame acting as a heat sink that receives the heat and dissipates the heat, the circuit board directly mounted onto a side of the metal frame.

2. The HMD of claim 1 , wherein the front cover is attached to the side cover with the slit between an outer edge of the front cover and an outer edge of the side cover to discharge the heat out of the HMD.

3. The HMD of claim 1 , wherein the air is pushed to flow at least partially along an inner surface of the front cover and out of the HMD through the slit.

4. The HMD of claim 1 , wherein the metal frame is enclosed within the side cover.

5. The HMD of claim 1 , wherein the side cover encloses the fan and the at least one processor.

6. The HMD of claim 1 , wherein the fan is further configured to pull the air from a cavity between a face of a user wearing the HMD and the front side to cool down a temperature in the cavity.

7. The HMD of claim 1 , wherein the fan is further configured to pull air from the rear side of the HMD to cool the at least one processor.

8. The HMD of claim 1 , wherein the fan is further configured to exhaust air to flow over the at least one processor for cooling the at least one processor.

9. The HMD of claim 1 , wherein the metal frame spreads the heat to facilitate discharging the heat out of the HMD through the slit.

10. The HMD of claim 1 , wherein the metal frame has edges shaped with contours that at least partially match an internal contour of the side cover to support the side cover.

11. The HMD of claim 1 , further comprising:

a heat pipe in an interior space, the heat pipe at least partially surrounding a periphery of the fan and transferring the heat away from the at least one processor.

12. The HMD of claim 11 , wherein an end of the heat pipe is coupled to the at least one processor via a thermal interface material, and the heat pipe transfers the heat away from the at least one processor into the metal frame.

13. The HMD of claim 11 , wherein the heat pipe is horseshoe shaped with a first member coupled to the at least one processor, a second member extending parallel to the first member and a third member connecting the first member and the second member.

14. The HMD of claim 1 , wherein the fan is a hybrid fan that exhausts the air at sides of the fan after pulling the air from the rear side of the HMD.

15. A head-mounted display (HMD) comprising:

a circuit board with at least one processor in an interior space defined by a front cover of the HMD and a side cover of the HMD, the at least one processor generating heat during operation of the HMD;

a fan having a center axis extending from a rear side of the HMD to a front side of the HMD, the fan configured to push air through a slit between the front cover and the side cover to discharge the air and the heat out of the HMD; and

a metal frame in the interior space acting as a heat sink that dissipates the heat generated by the at least one processor, the circuit board directly mounted onto a side of the metal frame.

16. The HMD of claim 15 , wherein the front cover is attached to the side cover with the slit between an outer edge of the front cover and an outer edge of the side cover to discharge the heat out of the HMD.

17. The HMD of claim 15 , wherein the fan is further configured to pull the air from a cavity between a face of a user wearing the HMD and the HMD front side to cool down a temperature in the cavity.

18. The HMD of claim 15 , wherein the metal frame spreads the heat to facilitate discharging the heat out of the HMD through the slit.

19. The HMD of claim 15 , wherein the fan is further configured to exhaust air to flow over the at least one processor for cooling the at least one processor.

20. The HMD of claim 15 , wherein the air is pushed to flow at least partially along an inner surface of the front cover and out of the HMD through the slit.