IP Library Granted Patent US 11,545,600
Granted Patent B2
US 11,545,600 · App. 16/846,059 · Granted Jan 3, 2023

LED package

Inventors: Tsung-Hong Lu (Hsinchu, TW); Pao-Yu Liao (Hsinchu, TW); Ching-Tai Cheng (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/505H01L33/06H01L33/10H01L33/504H01L33/54H01L33/56
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Quick Facts
Patent No.
US 11,545,600
App. No.
16/846,059
Granted
Jan 3, 2023
Kind
B2
Abstract

A LED package comprises an LED chip, a reflective structure which encloses the LED chip, a wavelength conversion structure placed on the LED chip, and an absorbing structure which encloses or is placed on the reflective structure.

Claims (35)

1. An LED package, comprising:

an LED chip;

a reflective structure laterally enclosing the LED chip;

a wavelength conversion structure placed on the LED chip; and

an absorbing structure arranged between the reflective structure and the wavelength conversion structure, and entirely arranged above the reflective structure.

2. The LED package as claimed in claim 1 , wherein the absorbing structure is made of flake graphite powder, artificial graphite powder, expanded graphite powder, vermicular graphite powder, amorphous graphite powder, or graphite compound.

3. The LED package as claimed in claim 1 , wherein when the absorbing structure is placed on the reflective structure, a proportion of a first longitudinal height of the absorbing structure to a second longitudinal height of the reflective structure is from 1:3 to 1:10.

4. The LED package as claimed in claim 1 , further comprising a patterned structure on the wavelength conversion structure.

5. The LED package as claimed in claim 1 , wherein the wavelength conversion structure is entirely placed on the absorbing structure, the reflective structure, and the LED chip.

6. The LED package as claimed in claim 1 , wherein the reflective structure and the absorbing structure directly contact the LED chip.

7. An LED package, comprising:

an LED chip having a bottom horizontal width;

a reflective structure enclosing the LED chip, and comprising an inner surface, an outer surface opposite to the inner surface, a bottom surface, and an angle formed between the inner surface and the bottom surface;

an absorbing structure enclosing the reflective structure, and entirely located outside the outer surface; and

a wavelength conversion structure having a bottom horizontal width, and directly connected to the absorbing structure.

8. The LED package as claimed in claim 7 , wherein the absorbing structure is made of flake graphite powder, artificial graphite powder, expanded graphite powder, vermicular graphite powder, amorphous graphite powder, or graphite compound.

9. The LED package as claimed in claim 7 , wherein the angle is between 60 degree to 70 degree.

10. The LED package as claimed in claim 7 , further comprising a patterned structure on the wavelength conversion structure.

11. The LED package as claimed in claim 7 , wherein the bottom horizontal width of the wavelength conversion structure is larger than the bottom horizontal width of the LED chip.

12. The LED package as claimed in claim 7 , wherein the reflective structure and the absorbing structure have topmost surfaces which are flush with each other.

13. The LED package as claimed in claim 7 , wherein the wavelength conversion structure and the absorbing structure have outermost surfaces which are flush with each other.

14. A sensing device, comprising:

an LED package comprising:

a reflective structure including an inner surface and an outer surface opposite to the inner surface;

an LED chip fully or partially enclosed by the reflective structure;

a wavelength conversion structure placed on the LED chip; and

an absorbing structure entirely arranged above the reflective structure or entirely located outside the outer surface of the reflective structure; and

a sensing detector arranged to receive light emitted from the LED package.

15. The sensing device as claimed in claim 14 , wherein the absorbing structure is made of flake graphite powder, artificial graphite powder, expanded graphite powder, vermicular graphite powder, amorphous graphite powder, or graphite compound.

16. The sensing device as claimed in claim 14 , wherein the reflective structure comprises:

a bottom surface; and

an angle formed between the inner surface and the bottom surface,

wherein the angle is between 60 degree to 70 degree.

17. The sensing device as claimed in claim 14 , wherein the wavelength conversion structure is made of a gum with phosphors or quantum dot, a phosphor, or a membrane having nano particles.

18. The LED package as claimed in claim 14 , wherein, if the absorbing structure is entirely arranged above the reflective structure, the reflective structure is lower than the LED chip.

Assignments (2)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2020
From: LU, TSUNG-HONG; LIAO, PAO-YU; CHENG, CHING-TAI
To: EPISTAR CORPORATION
Reel/Frame 052416/0520 →