IP Library Granted Patent US 11,096,309
Granted Patent B2
US 11,096,309 · App. 16/846,797 · Granted Aug 17, 2021

Chassis and method for manufacturing the same

Inventors: Fajiang Liu (Shanghai, CN); Wei Dong (Shanghai, CN); Haifang Zhai (Shanghai, CN)
Assignee: EMC IP Holding Company LLC
H05K7/1489H05K7/20727
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Quick Facts
Patent No.
US 11,096,309
App. No.
16/846,797
Granted
Aug 17, 2021
Kind
B2
Abstract

Techniques involve providing a chassis and for manufacturing the same. The chassis includes a housing and a partition. The partition is disposed within the housing and adapted to partition a space inside the housing into a first accommodating portion and a second accommodating portion. The partition is configured to be detachably mounted within the housing and a position of the partition in the housing is adjustable, to change respective volumes of the first accommodating portion and the second accommodating portion. In this way, a common chassis for different functional configuration demands is implemented, thereby avoiding the waste of space of the chassis due to changes in the volumes of internal electronic components.

Claims (23)

1. A chassis comprising:

a housing; and

a partition disposed within the housing and adapted to separate a space inside the housing into a first accommodating portion and a second accommodating portion, the partition being configured to be detachably mounted within the housing and a position of the partition in the housing is adjustable, to change respective volumes of the first accommodating portion and the second accommodating portion, wherein the partition comprises an interface for connecting electronic components in the first accommodating portion with electronic components in the second accommodating portion.

2. The chassis according to claim 1 , wherein a central processing unit chip and a memory are disposed in the first accommodating portion.

3. The chassis according to claim 2 , wherein a plurality of fans are disposed in the first accommodating portion for cooling the central processing unit chip and the memory.

4. The chassis according to claim 2 , wherein an I/O interface is disposed in the first accommodating portion, the I/O interface being arranged to be exposed at an edge of the housing and configured to couple the central processing unit chip with a peripheral device.

5. The chassis according to claim 1 , wherein a disk holder for placing a disk is disposed in the second accommodating portion.

6. The chassis according to claim 5 , wherein the disk holder comprises a plurality of pull-out accommodating members, the plurality of pull-out accommodating members being configured to be arranged next to each other in the second accommodating portion, each of the plurality of pull-out accommodating members comprising a tray and a sliding rail, and the tray being configured to accommodate at least one disk and adapted to be pushed in and out of the second accommodating portion along the sliding rail.

7. The chassis according to claim 6 , wherein the tray is adapted to receive a 2.5-inch solid state drive or a 3.5-inch solid state drive.

8. The chassis according to claim 1 , including a plurality of catch slots at different positions of side walls of the chassis, the catch slots being adapted for insertion of the partitions at corresponding different positions to provide the adjustable-position detachable mounting of the partition.

9. The chassis according to claim 1 , wherein the detachable mounting defines at least first and second configurations in which (1) in the first configuration, the first accommodating portion has a larger volume than the second accommodating portion, and (2) in the second configuration, the first accommodating portion has a volume smaller than the second accommodating portion.

10. A method for manufacturing a chassis comprising:

providing a housing; and

disposing a partition within the housing, the partition being adapted to separate a space inside the housing into a first accommodating portion and a second accommodating portion, the partition being configured to be detachably mounted within the housing and a position of the partition in the housing being adjustable, to change respective volumes of the first accommodating portion and the second accommodating portion, wherein the partition comprises an interface for connecting electronic components in the first accommodating portion with electronic components in the second accommodating portion.

11. The method according to claim 10 , wherein a central processing unit chip and a memory are disposed in the first accommodating portion.

12. The method according to claim 11 , wherein a plurality of fans are disposed in the first accommodating portion for cooling the central processing unit chip and the memory.

13. The method according to claim 11 , wherein an I/O interface is disposed in the first accommodating portion, the I/O interface being arranged to be exposed at an edge of the housing and configured to couple the central processing unit chip with a peripheral device.

14. The method according to claim 10 , wherein a disk holder for placing a disk is disposed in the second accommodating portion.

15. The method according to claim 14 , wherein the disk holder comprises a plurality of pull-out accommodating members, the plurality of pull-out accommodating members being configured to be arranged next to each other in the second accommodating portion, each of the plurality of pull-out accommodating members comprising a tray and a sliding rail, and the tray being configured to accommodate at least one disk and adapted to be pushed in and out of the second accommodating portion along the sliding rail.

16. The method according to claim 15 , wherein the tray is adapted to receive a 2.5-inch solid state drive or a 3.5-inch solid state drive.

17. A chassis for use in two hardware products, a first product having a first volume of processing circuitry and a first volume of storage, a second product having a second smaller volume of processing circuitry and a second larger volume of storage, the chassis comprising:

a housing; and

a partition disposed within the housing and adapted to separate a space inside the housing into a first accommodating portion for the processing circuitry and a second accommodating portion for the storage, the partition being configured to be detachably mounted within the housing and a position of the partition in the housing is adjustable between first and second positions such that (1) with the partition in the first position the first accommodating portion contains the first volume of processing circuitry and the second accommodating portion contains the first volume of storage, and (2) with the partition in the second position the first accommodating portion contains the second smaller volume of processing circuitry and the second accommodating portion contains the second larger volume of storage, wherein the partition comprises an interface for connecting the processing circuitry in the first accommodating portion with the storage in the second accommodating portion.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0081) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0441 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0917) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0509 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052852/0022) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0582 →
RELEASE OF SECURITY INTEREST AT REEL 052771 FRAME 0906 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0298 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052852/0022 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0081 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0917 →
SECURITY AGREEMENT Recorded May 28, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052771/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2020
From: LIU, FAJIANG; DONG, WEI; ZHAI, HAIFANG
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 052734/0115 →