Methods used in forming an array of memory cells
In some embodiments, a method used in forming an array of memory cells comprises uses no more than two photolithographic masking steps are used in forming both: (a) sense lines longitudinally extending in a column direction that are individually directly above and electrically coupled to the upper source/drain regions of multiple of the second pedestals in the column direction; and (b) spaced elevationally-extending vias laterally between immediately-adjacent of the sense lines directly above and electrically coupled to the upper source/drain regions of multiple of the first pedestals. Other embodiments are disclosed.
1. A method used in forming an array of memory cells, comprising:
providing a substrate comprising rows and columns of transistors, an access line interconnecting multiple of the transistors along individual of the rows in a row direction, the transistors individually comprising first and second pedestals joined to one another through a valley region, each of the first pedestals comprising a first upper source/drain region and each of the second pedestals comprising a second upper source/drain region, the valley region comprising a channel region, a transistor gate operatively laterally proximate at least one side of the channel region and comprising a portion of an individual of the access lines;
forming a conductive material over the first and second upper source/drain regions;
forming sense lines longitudinally extending in a column direction that are individually directly above and electrically coupled to multiple of the second upper source/drain regions through the conductive material;
using the sense lines in forming conductor-material lines in the column direction that are self-aligned in the row direction by and between immediately-adjacent of the sense lines, the conductor-material lines comprising a conductor material, being individually continuous in the column direction and being directly above and electrically coupled to multiple of the first upper source/drain regions through the conductive material, sacrificial material being laterally between the conductor-material lines and the sense lines; and
patterning through the conductor material of the conductor-material lines to form spaced elevationally-extending vias from the conductor-material lines that are directly above and electrically coupled to the upper source/drain regions of multiple of the first pedestals, the sacrificial material being laterally between remaining of the conductor material and the sense lines after patterning through the conductor material.
2. The method of claim 1 wherein patterning through the conductor material comprises using patterned masking material in a masking step, and further comprising also patterning through the sacrificial material using the patterned masking material in the masking step.
3. The method of claim 1 wherein the sacrificial material is dielectric.
4. The method of claim 1 comprising replacing the sacrificial material with dielectric material, the dielectric material comprising an elevationally-elongated void space.
5. The method of claim 1 wherein the patterning uses photoresist.
6. The method of claim 1 wherein the channel region comprises lowest portions of the first and second pedestals.
7. A method used in forming an array of memory cells, comprising:
providing a substrate comprising rows and columns of transistors, the transistors individually comprising first and second pedestals joined to one another through a valley region, each of the first pedestals comprising a first upper source/drain region and each of the second pedestals comprising a second upper source/drain region, the valley region comprising a channel region, a transistor gate operatively laterally proximate at least one side of the channel region;
forming sense lines longitudinally extending in a column direction that are individually directly above and electrically coupled to multiple of the second upper source/drain regions, the sense lines comprising a first metal material over a second metal material that differs from the first metal material;
using the sense lines in forming conductor-material lines in the column direction that are self-aligned in the row direction by and between immediately-adjacent of the sense lines, the conductor-material lines comprising a conductor material, being individually continuous in the column direction and being directly above and electrically coupled to multiple of the first upper source/drain regions, sacrificial material being laterally between the conductor-material lines and the sense lines; and
patterning through the conductor material of the conductor-material lines to form spaced elevationally-extending vias from the conductor-material lines that are directly above and electrically coupled to the upper source/drain regions of multiple of the first pedestals, the elevationally-extending vias extending to elevationally above an uppermost surface of the sense lines, the sacrificial material being laterally between remaining of the conductor material and the sense lines after patterning through the conductor material.
8. The method of claim 7 further comprising forming an access line interconnecting multiple of the transistors along individual of the rows in a row direction.
9. The method of claim 8 wherein the transistor gate comprises a portion of the access line.
10. The method of claim 7 further comprising replacing the sacrificial material with dielectric material.
11. The method of claim 10 wherein the dielectric material comprises an elevationally-elongated void space.
12. The method of claim 7 wherein the conductor-material lines comprise conductively-doped semiconductor material.
13. The method of claim 7 wherein the channel region extends partially up the first and second pedestals.