Packaging for fingerprint sensors and methods of manufacture
A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.
1. A sensor device comprising:
a sensor die comprising:
a die top side comprising circuitry, the die top side facing an upward vertical direction;
a die bottom side facing a downward vertical direction; and
a plurality of die lateral sides between the die top side and the die bottom side;
a sensing area on the die top side;
a top side conductor, where at least a portion of the top side conductor is above the die top side;
a bottom side connection point;
a conductive via that electrically connects the top side conductor to the bottom side connection point, where the conductive via is laterally displaced from the sensor die; and
an encapsulant that covers at least the die lateral sides.
2. The sensor device of claim 1 , wherein the bottom side connection point comprises a solder ball connection point that is separated from the sensor die and is vertically at least as low as the die bottom side.
3. The sensor device of claim 1 , comprising a protective material that covers the sensing area and is configured to allow fingerprint sensing through the protective material, and wherein the protective material covers an entirety of the top die side.
4. The sensor device of claim 1 , comprising:
a protective material that covers the sensing area; and
an intervening dielectric material, and wherein an entirety of the protective material is separated from the die top side by at least the intervening dielectric material, and
wherein the sensor device is configured to sense fingerprints through the protective material and the intervening dielectric material.
5. The sensor device of claim 1 , wherein:
an entirety of the conductive via is laterally displaced from the sensor die; and
at least a portion of the conductive via is directly laterally displaced from the sensor die.
6. The sensor device of claim 1 , wherein the sensing area is vertically lower than the top side conductor.
7. The sensor device of claim 1 , wherein:
the top side conductor comprises a metal redistribution layer; and
the encapsulant covers an entirety of the die bottom side.
8. The sensor device of claim 1 , wherein:
the encapsulant covers an entirety of the die bottom side; and
a top side of the encapsulant is substantially coplanar with the die top side.
9. The sensor device of claim 1 , comprising a conductive ball coupled to the bottom side connection point, where at least a portion of the conductive ball is embedded in the encapsulant.
10. The sensor device of claim 1 , wherein the sensing area is directly on the die top side.
11. A sensor device comprising:
a sensor die comprising:
a die top side facing an upward vertical direction;
a die bottom side facing a downward vertical direction; and
a plurality of die lateral sides between the die top side and the die bottom side;
a sensing area on the die top side;
a top side conductor, where at least a portion of the top side conductor is above the die top side;
a bottom side connection point that is lower than the die bottom side;
a first interposer positioned laterally in relation to the sensor die, wherein:
the first interposer comprises a first interposer board that comprises a conductive via, the conductive via electrically connecting the top side conductor to the bottom side connection point;
at least a portion of the conductive via is positioned directly laterally from the sensor die; and
the first interposer board comprises an interior lateral surface that faces directly toward the sensor die; and
an encapsulant that covers at least the die lateral sides and contacts the interior lateral surface of the first interposer board.
12. The sensor device of claim 11 , wherein the conductive via spans an entirety of a vertical height of the sensor die.
13. A sensor device comprising:
a sensor die having a die top side, a die bottom side, and die lateral sides;
a sensing area on the die top side;
a top side conductor, where at least a portion of the top side conductor is above the die top side;
a bottom side connection point;
a first interposer positioned laterally in relation to the sensor die, wherein:
the first interposer comprises a conductive via that electrically connects the top side conductor to the bottom side connection point; and
at least a portion of the conductive via is positioned directly laterally from the sensor die;
an encapsulant that covers at least the die lateral sides; and
a second interposer positioned laterally in relation to the sensor die and positioned such that the sensor die is laterally between the first interposer and the second interposer, and wherein:
the first interposer laterally covers a first die lateral side of the die lateral sides;
the second interposer laterally covers a second die lateral side of the die lateral sides;
no interposer covers a third die lateral side of the die lateral side; and
no interposer covers a fourth die lateral side of the die lateral sides.
14. A sensor device comprising:
a sensor die having a die top side, a die bottom side, and die lateral sides;
a sensing area on the die top side;
a top side conductor, where at least a portion of the top side conductor is above the die top side;
a bottom side connection point;
a first interposer positioned laterally in relation to the sensor die, wherein:
the first interposer comprises a conductive via that electrically connects the top side conductor to the bottom side connection point; and
at least a portion of the conductive via is positioned directly laterally from the sensor die;
an encapsulant that covers at least the die lateral sides; and
a second interposer positioned laterally in relation to the sensor die and positioned such that the sensor die is laterally between the first interposer and the second interposer, and
wherein:
the first interposer comprises a first lateral side that faces in a same direction as a first die lateral side of the die lateral sides;
the second interposer comprises a second lateral side that faces in a same direction as a second die lateral side of the die lateral sides; and
the first lateral side of the first interposer and the second lateral side of the second interposer are exposed from the encapsulant.
15. The sensor device of claim 11 , wherein:
the encapsulant covers a bottom side of the first interposer and the die bottom side; and
the encapsulant laterally spans an entirety of the first interposer.
16. The sensor device of claim 15 , wherein
a top side of the first interposer and the die top side are not covered by the encapsulant.
17. The sensor device of claim 11 , wherein a top side of the first interposer, the die top side, and a top side of the encapsulant are coplanar.
18. The sensor device of claim 11 , wherein the sensing area is directly on the die top side.
19. The sensor device of claim 11 , wherein
the interposer board comprises an outer lateral surface that faces directly away from the sensor die and is not covered by the encapsulant.
20. The sensor device of claim 1 , comprising a first interposer positioned laterally in relation to the sensor die, wherein:
the first interposer comprises a first interposer board that comprises the conductive via; and
the first interposer board comprises an interior lateral surface that faces directly toward the sensor die and contacts the encapsulant.