High performance two-phase cooling apparatus for portable applications
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.
1. A portable device having an enclosure, comprising:
a thermal ground plane disposed within the enclosure wherein the thermal ground plane contains a vapor region and a liquid region for a working fluid, disposed within the enclosure of the portable device, wherein the thermal ground plane comprises a metal plane,
a vapor cavity and wicking structure formed on a metal substrate and wherein the thermal ground plane further comprises at least one intermediate substrate with a plurality of protrusions disposed in the vapor cavity adjacent to the wicking structure, wherein the plurality of protrusions are coupled to each other by at least one cross-member and wherein the protrusions fit conformally into the wicking structure and wherein the metal plane includes supporting pillars that mechanically support a spacing between the metal plane, the wicking structure and the intermediate substrate, and structurally support the thermal ground plane;
an integrated circuit chip disposed within the enclosure, wherein the integrated circuit chip is in thermal communication with the thermal ground plane such that heat generated by the chip is distributed throughout the portable device by the thermal ground plane; and
wherein the thermal ground plane is in thermal communication with at least one structural element of the portable device, and wherein the thermal ground plane is mechanically coupled to the portable device such that it provides mechanical strength and robustness to the enclosure.