Electrically functional structure integration in ultrathin foldable device
Systems and methods are disclosed for integration of an electrically functional structure in an information handling system. An information handling system may include may include a housing including a first housing portion coupled to a second housing portion. The first housing portion may include an electrically functional structure integrated within the first housing portion. The first housing portion may also include a first layer and a structural adhesive applied to the first layer. The first housing portion may further include a second layer and a thermally conductive adhesive applied to the second layer to bond the second layer to the first layer. The first housing portion may also include a PCB layer coupled between a first PCB and a second PCB, the PCB layer bonded to the second layer, and the electrically functional structure includes the first PCB and the second PCB.
1. An information handling system, comprising:
a housing including a first housing portion coupled to a second housing portion, the first housing portion comprising:
an electrically functional structure integrated within the first housing portion;
a first layer having a first flexible portion, a first edge portion, and a second edge portion, the first flexible portion between the first edge portion and the second edge portion, the first layer comprising a graphene sheet;
a structural adhesive applied to the first edge portion and the second edge portion of the first layer, wherein the structural adhesive includes a graphene filler;
a second layer having a second flexible portion, the second layer comprising a graphene sheet;
a thermally conductive adhesive applied to the second layer to bond the second layer to the first layer; and
a printed circuit board (PCB) layer including a third flexible portion coupled between a first PCB and a second PCB, the PCB layer bonded to the second layer, wherein the electrically functional structure comprises the first PCB and the second PCB,
wherein the second layer is positioned between the PCB layer and the first layer.
2. The information handling system of claim 1 , wherein the first flexible portion, the second flexible portion, and the third flexible portion corresponding to a flexible portion of a display of the information handling system.
3. The information handling system of claim 1 , wherein the first layer comprises one or more of an Aramid fiber, a carbon fiber, and a thermoplastic elastomer including a carbon nanotube fiber.
4. The information handling system of claim 1 , wherein the second layer comprises one or more of a glass fiber, an Aramid fiber, and a carbon fiber.
5. The information handling system of claim 1 , wherein the PCB layer comprises one or more of a flexible circuit polymer and a polyamide based polymer.
6. The information handling system of claim 1 , wherein the information handling system is configured to allow the first housing portion to fold in relation to the second housing portion.
7. The information handling system of claim 1 , wherein the housing further includes:
a groove;
a fiber coupled to a display;
a cable placed in the groove and coupled to the display; and
a resin applied to the fiber and the cable to bond the cable to the fiber.
8. The information handling system of claim 7 , wherein the fiber comprises one or more of an Aramid fiber, a carbon fiber, and a TPE including a carbon nanotube fiber.
9. The information handling system of claim 1 , wherein the housing further includes:
a cover portion including:
a surface mount device coupled to a PCB; and
a fiber layer, the PCB and the surface mount device insert molded to the fiber layer using an insert mold polyamide.
10. The information handling system of claim 9 , wherein the cover portion is laminated with one or more of a polymer fiber, a glass fiber, a basalt fiber, an ultra-high-molecular-weight polyethylene (UHMWPE) fiber, a high-modulus polyethylene (HMPE) fiber, a high-performance polyethylene (HPPE) fiber, a polybenzoxazole (PBO) fiber, a para-aramid fiber, and a polyhydroquinone diimidazopyridine (MS) fiber.
11. The information handling system of claim 9 , wherein the surface mount device is an antenna.
12. The information handling system of claim 1 , wherein the structural adhesive includes i) a first structural adhesive applied to the first edge portion of the first layer, and ii) a second structural adhesive applied to the second edge portion of the first layer, wherein the thermally conductive adhesive is positioned between the first structural adhesive and the second structural adhesive.
13. The information handling system of claim 1 , wherein a thermal conduction of the graphene sheets of the first and the second layers meets thermal specifications of the information handling system.
14. The information handling system of claim 1 , wherein the thermal conduction is approximately 1000 Watts/Kelvin-meters.