Folded heatsink design for thermal challenging LED applications
This specification discloses heatsinks comprising a continuous sheet of thermally conductive material folded into a structure comprising a plurality of fins defined by bends in the sheet and arranged to transfer heat to surrounding air. The sheet may be further folded to form a planar surface defined by one or more bends in the sheet and on which one or more LEDs may be mounted. Optionally, the sheet may be further folded to partially enclose the fins within a tunnel formed by side walls defined by bends in the sheet.
1. A light emitting device comprising:
one or more LEDs; and
a heatsink comprising a continuous sheet of thermally conductive material folded into a structure comprising:
a first planar portion having a length and a width;
a first sidewall directly attached to the first planar portion, the first sidewall substantially perpendicular to the first planar portion;
a second planar portion directly attached to the first sidewall, the second planar portion substantially perpendicular to the first sidewall, the second planar portion substantially parallel to the first planar portion, the second planar portion having a length and a width substantially equal to the length and the width, respectively, of the first planar portion;
a second sidewall directly attached to the second planar portion; the first and second planar portions and the first and second sidewalls forming a tunnel through which air may be forced;
a plurality of fins defined by bends in the sheet and arranged side-by-side, the plurality of fins disposed within the tunnel; and
and the one or more LEDs are disposed on the first planar portion outside the tunnel.
2. The light emitting device of claim 1 , wherein the fins are oriented parallel or substantially parallel to each other and perpendicular or substantially perpendicular to the first planar portion of the sheet on which the one or more LEDs are attached.
3. The light emitting device of claim 1 , wherein the fins are oriented parallel or substantially parallel to each other and parallel or substantially parallel to the first planar portion of the sheet on which the one or more LEDs are attached.
4. The light emitting device of claim 1 , wherein the one or more LEDs are disposed directly on a thermal interface layer disposed directly on the first planar portion of the sheet.
5. The light emitting device of claim 1 , wherein:
the fins are oriented parallel to each other and perpendicular to the first planar portion of the sheet on which the one or more LEDs are attached; and
the one or more LEDs are disposed directly on a thermal interface layer disposed directly on the first planar portion of the sheet.
6. A light emitting device comprising:
one or more LEDs; and
a heatsink comprising:
a continuous sheet of thermally conductive material folded into a structure comprising
a first planar portion having a length and a width;
a first sidewall directly attached to the first planar portion, the first sidewall substantially perpendicular to the first planar portion;
a second planar portion directly attached to the first sidewall, the second planar portion substantially perpendicular to the first sidewall, the second planar portion substantially parallel to the first planar portion, the second planar portion having a length and a width substantially equal to the length and the width, respectively, of the first planar portion;
a second sidewall directly attached to the second planar portion; the first and second planar portions and the first and second sidewalls forming a tunnel through which air may be forced;
a plurality of fins defined by bends in the sheet and arranged side-by-side, the plurality of fins disposed within the tunnel; and
one or more LEDs are disposed on the first planar sheet outside the tunnel.
7. The light emitting device of claim 6 , wherein the first planar portion is attached to the fins by solder, glue, or mechanical fasteners.
8. The light emitting device of claim 6 , wherein the fins are oriented parallel or substantially parallel to each other and perpendicular or substantially perpendicular to the first planar portion on which the one or more LEDs are attached.
9. The light emitting device of claim 6 , wherein the fins are oriented parallel or substantially parallel to each other and parallel or substantially parallel to the first planar portion on which the one or more LEDs are attached.
10. The light emitting device of claim 6 , wherein the one or more LEDs are disposed directly on a thermal interface layer disposed directly on the first planar portion.
11. The light emitting device of claim 6 , wherein:
the fins are oriented parallel to each other and perpendicular to the first planar portion on which the one or more LEDs are attached; and
the one or more LEDs are disposed directly on a thermal interface layer disposed directly on the first planar portion of the sheet.
12. A method for assembling a light emitting device comprising an LED and a heatsink, the method comprising:
folding a thermally conductive sheet into a heatsink structure comprising:
bending the sheet to form a plurality of fins, the plurality of fins arranged side-by-side;
after bending the sheet to form the plurality of fins, bending the sheet to form a first sidewall portion;
after bending the sheet to form the first sidewall portion, bending the sheet to form a first planar portion having a length and a width;
after bending the sheet to form the first planar portion, bending the sheet to form a second sidewall portion,
after bending the sheet to form the second sidewall portion, bending the sheet to form a second planar portion, the second planar portion substantially parallel to the first planar portion, the second planar portion having a length and a width substantially equal to the length and the width, respectively, of the first planar portion,
the first and second planar portions and the first and second sidewalls forming a tunnel through which air may be forced;
and attaching one or more LEDs on either the first or the second planar portion outside the tunnel.
13. The method of claim 12 , comprising attaching other components to the thermally conductive sheet before folding it into the heatsink structure.
14. The method of claim 12 , comprising forming openings in or reference marks on the thermally conductive sheet before folding it into the heatsink structure.
15. The method of claim 12 , comprising folding the thermally conductive sheet to form the fins in an orientation parallel or substantially parallel to each other and perpendicular or substantially perpendicular to the first planar portion of the sheet.