IP Library Granted Patent US 11,314,294
Granted Patent B2
US 11,314,294 · App. 16/862,832 · Granted Apr 26, 2022

Modular heat sink supporting expansion card connector

Inventors: Chris M. Helberg (Austin, TX); Travis C. North (Cedar Park, TX)
Assignee: Dell Products, L.P.
G06F1/20G06F1/185G06F13/4282H05K7/20163G06F2213/0042
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Quick Facts
Patent No.
US 11,314,294
App. No.
16/862,832
Granted
Apr 26, 2022
Kind
B2
Abstract

Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.

Claims (32)

1. A heat sink for dissipating heat within an IHS (Information Handling System), the heat sink comprising:

a first fin set that is permanently fixed to the heat sink;

a second fin set that is removably coupled to a first location on a base of the heat sink; and

an expansion card connector that is removably coupled to the first location on the base of the heat sink.

2. The heat sink of claim 1 , wherein the expansion card connector comprises a third fin set, and wherein the expansion card connector is fastened on top of the third fin set.

3. The heat sink of claim 2 , wherein the third fin set of the expansion card connector comprises of a plurality of tiers of fins.

4. The heat sink of claim 3 , wherein the expansion card connector is fastened on top of a lowest tier of the third fin set.

5. The heat sink of claim 1 , wherein the base of the heat sink comprises a plurality of channels that receive a corresponding plurality of rails of the second fin set.

6. The heat sink of claim 5 , wherein the plurality of channels of the heat sink base further receive a corresponding plurality of rails of the expansion card connector.

7. The heat sink of claim 5 , wherein the second fin set is coupled to the base of the heat sink by sliding the plurality of rails of the second fin set into the corresponding channels of the base.

8. The heat sink of claim 1 , wherein the expansion card connector comprises an M.2 connector.

9. The heat sink of claim 1 , wherein the expansion card connector comprises a USB-C connector.

10. A heat sink for dissipating heat within an IHS (Information Handling System), the heat sink comprising:

a first fin set that is removably coupled to a first location on a base of the heat sink;

a second fin set that is removably coupled to a second location on the base of the heat sink; and

an expansion card connector that is removably coupled to the first location or to the second location on the base of the heat sink.

11. The heat sink of claim 10 , wherein the expansion card connector comprises a third fin set, and wherein the expansion card connector is fastened on top of the third fin set.

12. The heat sink of claim 11 , wherein the third fin set of the expansion card connector comprises of a plurality of tiers of fins, and wherein the expansion card connector is fastened on top of a lowest tier of the third fin set.

13. The heat sink of claim 10 , wherein the base of the heat sink comprises a plurality of channels that receive a corresponding plurality of rails of the first fin set and a corresponding plurality of rails of the second fin set.

14. The heat sink of claim 10 , wherein the expansion card connector comprises an M.2 connector or a USB-C connector.

15. An IHS (Information Handling System) comprising:

a processor;

a plurality of cooling fans directing airflow towards a heat sink; and

the heat sink comprising:

a first fin set that is permanently fixed to the heat sink;

a second fin set that is removably coupled to a first location on a base of the heat sink; and

an expansion card connector that is removably coupled to the first location on the base of the heat sink.

16. The IHS of claim 15 , wherein the expansion card connector comprises a third fin set, and wherein the expansion card connector is fastened on top of the third fin set.

17. The IHS of claim 16 , wherein the third fin set of the expansion card connector comprises of a plurality of tiers of fins, and wherein the expansion card connector is fastened on top of a lowest tier of the third fin set.

18. The IHS of claim 15 , wherein the base of the heat sink comprises a plurality of channels that receive a corresponding plurality of rails of the second fin set.

19. The IHS of claim 15 , wherein the expansion card connector comprises an M.2 connector or a USB-C connector.

20. The IHS of claim 15 , wherein an expansion card is coupled to the IHS by coupling the expansion card to the expansion card connector.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0917) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0509 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0081) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0441 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052852/0022) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0582 →
RELEASE OF SECURITY INTEREST AT REEL 052771 FRAME 0906 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0298 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052852/0022 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0081 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0917 →
SECURITY AGREEMENT Recorded May 28, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052771/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2020
From: HELBERG, CHRIS M.; NORTH, TRAVIS C.
To: DELL PRODUCTS, L.P.
Reel/Frame 052536/0084 →
Continuity (1)
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Cited By (1)
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