Aluminum and aluminum alloy electroplated coatings
In certain aspects, a coated steel substrate comprises a single or multiple-layer electroplated aluminum coating over a steel substrate. The multiple-layer electroplated aluminum coating comprises one or more porous layers and one or more compact layers. The one or more porous layers comprise a material selected from a group consisting of aluminum and aluminum alloys. The one or more compact layers comprise a material selected from a group consisting of aluminum and aluminum alloys. In certain aspects, a method of depositing a multiple-layer aluminum coating over a steel substrate includes electroplating one or more porous aluminum layers over the steel substrate. The one or more porous aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys. One or more compact aluminum layers are electroplated over the steel substrate. The one or more compact aluminum layers comprise a material selected from a group consisting of aluminum and aluminum alloys.
1. A method of depositing a multiple-layer aluminum coating over a steel substrate, comprising:
electroplating one or more porous aluminum layers over the steel substrate from an electroplating bath comprising an ionic liquid of an N-alkyl-N-alkyl′ pyrrolidinium sulfonylimide, the one or more porous aluminum layers comprising a material selected from a group consisting of aluminum and aluminum alloys, one of the one or more porous aluminum layers directly contacting the steel substrate; wherein at least one of the porous aluminum layers comprises a plurality of pores having a pore size of about 2 μm or more, each of the one or more porous aluminum layers having a thickness of about 0.3 μm to about 3 μm,
electroplating one or more compact aluminum layers over the one or more porous aluminum layers from an electroplating bath comprising an ionic liquid of a quaternary ammonium salt, the one or more compact aluminum layers comprising a material selected from a group consisting of aluminum and aluminum alloys; wherein at least one of the compact aluminum layers comprises a plurality of pores having a pore size of about 0.2 μm or less, each of the one or more porous aluminum layers having a thickness from about 0.3 μm to about 3 μm.
2. The method of claim 1 , wherein the one or more compact aluminum layers are electroplated utilizing a direct current.
3. The method of claim 1 , wherein the one or more porous aluminum layers are electroplated utilizing a direct current.
4. The method of claim 1 , wherein the multiple-layer aluminum coating has a total thickness from about 10 μm to about 40 μm.
5. The method of claim 1 , wherein the one or more compact aluminum layers are electroplated utilizing a pulsed current.
6. The method of claim 5 , wherein the pulsed current is a unipolar pulsed current comprising a plurality of ON pulses and a plurality of OFF pulses, each of the plurality of ON pulses having a current density from 5 mA/cm 2 to 25 mA/cm 2 , each of the plurality of ON pulses having a duration from 100 ms to 500 ms, and each of the plurality of OFF pulses having a duration from 100 ms to 500 ms.
7. The method of claim 5 , wherein the pulsed current is a bipolar pulsed current comprising a plurality of deposition pulses and a plurality of etching pulses, each of the plurality of deposition pulses having a current density from 5 mA/cm 2 to 25 mA/cm 2 , each of the plurality of etching pulses having a current density from 0.5 mA/cm 2 to 5 mA/cm 2 , each of the plurality of deposition pulses having a duration from 100 ms to 1,000 ms, and each of the plurality of etching pulses having a duration from 100 ms to 1,000 ms.
8. The method of claim 5 , wherein the pulsed current comprises a waveform selected from the group consisting of rectangular waveform, saw-tooth waveforms, sinusoidal waveforms, curved waveforms, trapezoidal waveforms, and triangular waveforms.
9. The method of claim 1 , wherein the one or more compact aluminum layers comprise an aluminum-manganese alloy electroplated in an electroplating bath including an aluminum salt and a manganese salt.
10. The method of claim 9 , wherein the electroplating bath includes the aluminum salt and the manganese salt in a molar ratio from 9:1 to 4:1.
11. The method of claim 9 , wherein the electroplating bath further comprises a brightening agent.
12. A method of depositing a multiple-layer aluminum coating over a steel substrate, comprising:
electroplating one or more porous aluminum layers over the steel substrate from an electroplating bath comprising an ionic liquid of an N-alkyl-N-alkyl′ pyrrolidinium sulfonylimide, the one or more porous aluminum layers comprising a material selected from a group consisting of aluminum and aluminum alloys; wherein at least one porous aluminum layer comprises a plurality pores having a pore size of about 2 μm or more, each of the one or more porous aluminum layers having a thickness from about 0.3 μm to about 3 μm,
electroplating one or more compact aluminum layers over the porous aluminum layers from an electroplating bath comprising an ionic liquid of a quaternary ammonium salt, and the one or more compact aluminum layers comprising a material selected from a group consisting of aluminum and aluminum alloys; wherein at least one compact aluminum layer comprises a plurality of pores having a pore size of about 0.2 μm or less, each of the one or more porous aluminum layers comprising a thickness from about 0.3 μm to about 3 μm,
at least one of the one or more compact aluminum layers electroplated over at least one of the one or more porous aluminum layers.
13. The method of claim 12 , wherein one of the porous aluminum layers directly contacts the steel substrate.
14. The method of claim 12 , wherein the multiple-layer aluminum coating is configured to provide sacrificial corrosion protection of over 1,000 hrs under ASTM B 117.
15. The method of claim 12 , wherein the multiple-layer aluminum coating passes a hydrogen embrittlement (HE) test performed according to ASTM F 519 using Type 1a.1 specimens having a notch.