Heat transport device
A heat transport device is disclosed. The heat transport device includes a heat pipe and a heat spreader. The heat pipe, which is thermally connecting to a heating element, includes a heat receiving surface for receiving heat from the heating element, and a side surface intersecting with the heat receiving surface. The heat spreader, which is thermally connecting to the heat pipe, includes a first plate member having a first side surface thermally connecting to the side surface of the heat pipe, and a second plate member having a side surface thermally connecting to a second side surface of the first plate member opposite to the first side surface in contact with the heat pipe.
1. A heat transport device, comprising: a heat pipe thermally connecting to a heating element, wherein said heat pipe includes a heat-receiving top surface directly contacting said heating element to receive heat from said heating element; and a side surface orthogonal to said heat-receiving top surface; and a heat spreader thermally connecting to said heat pipe to dissipate heat, wherein said heat spreader includes a first plate member having a first-plate side surface directly contacting said side surface of said heat pipe, and a first plate top surface orthogonal to said first-plate side surface, said first-plate top surface does not contact said heating element and said heat pipe; and a second plate member having a second-plate side surface directly contacting said first-plate side surface of said first plate member, and a second plate top surface orthogonal to said second-plate side surface, said second-plate top surface does not contact said heating element and said heat pipe; and a heat-transfer material in opposed contact with a connecting surface of said first plate member, a connecting surface of said second plate member, and an opposed surface of said heat pipe.
2. The heat transport device of claim 1 , wherein said second plate member is thinner than said first plate member.
3. The heat transport device of claim 1 , wherein said heat-transfer material is a chassis of an electronic apparatus for which said heat transport device is provided.
4. The heat transport device of claim 1 , wherein said heat-transfer material is a metallic film provided on an inner surface of a chassis of an electronic apparatus for which said heat transport device is provided.
5. The heat transport device of claim 1 , wherein said first-plate side surface and said second-plate side surface are comb-teeth like surfaces, such that the contacting boundary of said first-plate side surface and said second-plate side surface is zig-zag like.
6. The heat transport device of claim 1 , wherein said first-plate top surface is flushed with said heat-receiving top surface of said heat pipe.
7. An electronic apparatus comprising: a heating element; a heat transport device for transporting heat from said heating element, wherein said heat transport device includes a heat pipe thermally connecting to said heating element, wherein said heat pipe includes a heat-receiving top surface directly contacting said heating element to receive heat from said heating element; and a side surface orthogonal to said heat-receiving top surface; a heat spreader thermally connecting to said heat pipe to radiate heat, wherein said heat spreader includes a first plate member having a first-plate side surface directly contacting said side surface of said heat pipe, and a first plate top surface orthogonal to said first-plate side surface, said first-plate top surface does not contact said heating element and said heat pipe; and a second plate member having a second-plate side surface directly contacting said first-plate side surface of said first plate member, and a second plate top surface orthogonal to said second-plate side surface, said second-plate top surface does not contact said heating element and said heat pipe; a heat-transfer material in opposed contact with a connecting surface of said first plate member, a connecting surface of said second plate member, and an opposed surface of said heat pipe; and a chassis in opposed contact with said heat-transfer material.
8. The electronic apparatus of claim 7 , wherein said second plate member is thinner than said first plate member.
9. The electronic apparatus of claim 7 , wherein said heat-transfer material is a metallic film provided on an inner surface of said chassis.
10. The electronic apparatus of claim 7 , wherein said first-plate side surface and said second-plate side surface are comb-teeth like surfaces, such that the contacting boundary of said first-plate side surface and said second-plate side surface is zig-zag like.
11. The electronic apparatus of claim 7 , wherein said first-plate top surface is flushed with said heat-receiving top surface of said heat pipe.