IP Library Patent Application 16863659
Patent Application
App. No. 16/863,659

Plasma Assisted Parylene Deposition

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Quick Facts
Patent No.
US None
App. No.
16/863,659
Abstract

A method for depositing parylene onto a substrate includes utilizing a vaporization chamber and a pyrolysis chamber to crack a dimer into a monomer gas, directly ionizing the monomer gas by passing the monomer gas through a plasma generation chamber comprising plasma prior to injection of the monomer gas into a deposition chamber, and polymerizing the ionized monomer in the deposition chamber to create a polymer and a protective coating on a substrate.

Claims (30)

1 . A method for depositing parylene onto a substrate, comprising:

utilizing a vaporization chamber and a pyrolysis chamber to crack a dimer into a monomer gas;

directly ionizing the monomer gas by passing the monomer gas through a plasma generation chamber comprising plasma prior to injection of the monomer gas into a deposition chamber;

polymerizing the ionized monomer in the deposition chamber to create a polymer and a protective coating on a substrate.

2 . The method of claim 1 , further comprising modifying radicals of the monomer gas with the plasma, wherein the modification increases the reactivity of the radicals.

3 . The method of claim 1 , wherein the monomer gas is ionized between the pyrolysis chamber and the deposition chamber.

4 . The method of claim 1 , wherein the plasma is generated by a plasma generation system, where the plasma generation system is a radio frequency plasma generation system.

5 . The method of claim 1 , wherein the plasma is generated by a plasma generation system, where the plasma generation system is a pulsed direct current plasma generation system.

6 . The method of claim 1 , wherein the polymer on the substrate is a parylene N coating.

7 . The method of claim 1 , wherein the polymer on the substrate is a parylene F coating.

8 . The method of claim 8 , wherein the monomer is a parylene monomer.

9 . A method for depositing parylene onto a substrate, comprising:

injecting a monomer gas into a deposition chamber;

injecting a plasma into the deposition chamber, the plasma generated in a plasma generation chamber;

ionizing the monomer gas with the plasma to generate ionized monomer; and

polymerizing the ionized monomer to create a polymer and a protective coating on a substrate.

10 . The method of claim 9 , further comprising modifying radicals of the monomer gas with the plasma, wherein the modification increases the reactivity of the radicals.

11 . The method of claim 9 , wherein the plasma is generated by a plasma generation system, where the plasma generation system is a radio frequency plasma generation system.

12 . The method of claim 9 , wherein the plasma is generated by a plasma generation system, where the plasma generation system is a pulsed direct current plasma generation system.

13 . The method of claim 9 , wherein the polymer on the substrate is a parylene N or parylene F coating.

14 . The method of claim 9 , further comprising energizing the monomer gas after cracking dimer.

15 . The method of claim 9 , further comprising utilizing a vaporization chamber and a pyrolysis chamber to crack a dimer into a monomer gas, and wherein the monomer is a parylene monomer.

16 . A system comprising:

a pyrolysis chamber configured to crack a dimer into a monomer gas;

a plasma generation system configured to generate a plasma;

a deposition chamber configured to facilitate polymerization of an ionized monomer gas into a polymer and a protective coating on a substrate.

17 . The system of claim 16 , wherein the plasma generation system is coupled to a plasma generation chamber, wherein the plasm generation chamber is positioned between the pyrolysis chamber and the deposition chamber.

18 . The system of claim 16 , wherein the plasma generation system is a radio frequency plasma generation system.

19 . The system of claim 16 , wherein the plasma generation system is a pulsed direct current plasma generation system.

20 . The system of claim 16 , wherein the plasma generation system is coupled to deposition chamber, wherein the plasma generation system is configured to inject plasma into the deposition chamber.

Assignments (1)
SECURITY INTEREST Recorded Jun 5, 2023
From: HZO, INC.; HZO HONG KONG LIMITED
To: CATHAY BANK
Reel/Frame 063861/0025 →