MOLDED CONTRAST MASK FOR DISPLAY MODULE
A display module comprises a circuit board, a plurality of light-emitting elements coupled to a front surface of the circuit board and arranged in an array configured to produce at least a portion of a display image at the front surface of the circuit board, and a contrast mask directly coupled to the front surface of the circuit board, the contrast mask defining a plurality of windows, with each window surrounding a group of one or more of the plurality of light-emitting elements.
1 . A display module comprising:
a circuit board;
a plurality of light-emitting elements coupled to a front surface of the circuit board, wherein the plurality of light-emitting elements is arranged in an array configured to produce at least a portion of a display image at the front surface of the circuit board; and
a contrast mask directly coupled to the front surface of the circuit board, the contrast mask defining a plurality of windows, with each window surrounding a group of one or more of the plurality of light-emitting elements.
2 . The display module of claim 1 , wherein the contrast mask is molded onto the front surface of the circuit board.
3 . The display module of claim 1 , wherein each group of one or more of the plurality of light-emitting elements comprises a pixel of two or more of the light-emitting elements, wherein a plurality of the pixels is arranged to provide the array.
4 . The display module of claim 3 , wherein the contrast mask reduces occurrence of a halo effect around one or more of the pixels.
5 . The display module of claim 3 , wherein adjacent pixels of the plurality of pixels are spaced apart by a specified pixel pitch.
6 . The display module of claim 5 , wherein the specified pixel pitch is no larger than 4 millimeters.
7 . The display module of claim 5 , wherein the specified pixel pitch is no larger than 2.5 millimeters.
8 . The display module of claim 1 , wherein the contrast mask enhances contrast between light being emitted by the light-emitting elements and an appearance of dark or black in the display image.
9 . The display module of claim 1 , wherein the contrast mask is formed from a moldable material.
10 . The display module of claim 1 , wherein the contrast mask is formed from at least one of: an epoxy-based material, a silicone-based compound, or a black carbon compound.
11 . A method comprising:
providing or receiving a circuit board;
molding a moldable material onto at least a portion of a front surface of the circuit board to form a contrast mask; and
mounting a plurality of light-emitting elements onto the front surface of the circuit board in an array configured to produce at least a portion of a display image at the front surface of the circuit board;
wherein the molding of the moldable material comprises forming a plurality of windows in or through the contrast mask to allow for emission of light from the light-emitting elements to produce a display image at the front surface of the circuit board, wherein each window surrounds a group of one or more of the plurality of light-emitting elements.
12 . The method of claim 11 , wherein each group of one or more of the plurality of light-emitting elements comprises a pixel of two or more of the light-emitting elements, wherein a plurality of the pixels is arranged to provide the array.
13 . The method of claim 12 , wherein the mounting of the plurality of light-emitting elements comprising mounting adjacent pixels of the plurality of pixels so that the adjacent pixels are spaced apart by a specified pixel pitch.
14 . The method of claim 13 , wherein the specified pixel pitch is no larger than 4 millimeters.
15 . The method of claim 13 , wherein the specified pixel pitch is no larger than 2.5 millimeters.
16 . The method of claim 12 , wherein the contrast mask reduces occurrence of a halo effect around one or more of the pixels.
17 . The method of claim 12 , wherein the contrast mask enhances contrast between light being emitted by the light-emitting elements and an appearance of dark or black in the display image.
18 . The method of claim 11 , wherein the step of molding the moldable material onto at least a portion of the front surface of the circuit board precedes the step of mounting the plurality of light-emitting elements onto the front surface of the circuit board.
19 . The method of claim 11 , wherein the step of mounting the plurality of light-emitting elements onto the front surface of the circuit board precedes the step of molding the moldable material onto at least a portion of the front surface of the circuit board.
20 . The method of claim 11 , wherein the moldable material comprises at least one of: an epoxy-based material, a silicone-based compound, or a black carbon compound.