Electronic circuits with directly integrated electrochemical cells
Provided are electronic circuits, comprising electrochemical cells directly integrated with other devices of the circuits, and methods of manufacturing these circuits. The direct integration occurs during cell manufacturing, which allows sharing components, reducing operation steps and failure points, and reducing cost and size of the circuits. For example, a portion of a cell enclosure may be formed by a circuit board, providing direct mechanical integration. More specifically, the cell is fabricated right on the circuit board. In the same or other examples, one or both cell current collectors extend outside of the cell boundary and used by other devices, providing direct electrical integration without a need for intermediate connections and eliminating additional failure points. Furthermore, printing one or more components of electrochemical cells, such as electrolytes and current collectors, allows achieving higher levels of mechanical and electrical integration that are generally not available in conventional cells.
1. A method of manufacturing a directly integrated electronic circuit, the method comprising:
providing a first packaging layer,
wherein the first packaging layer supports and is directly integrated with a first patterned conductive layer, comprising a positive current collector, a positive tab, and a connecting tab, and
wherein the positive current collector is monolithic with the positive tab while the connecting tab is isolated from the positive current collector; and
forming an electrochemical stack over the positive current collector,
wherein the electrochemical stack comprises a positive active material layer, an electrolyte layer, and a negative active material layer,
wherein at least one of the positive active material layer, the electrolyte layer, and the negative active material layer is printed,
wherein the positive current collector and the positive active material layer for a positive electrode,
wherein the negative active material layer is disposed over and in electronic communication with a negative current collector of a second patterned conductive layer, formed by a metal foil,
wherein the second patterned conductive at least partially overlaps and forms an electrical connection with the connecting tab of the first patterned conductive layer,
wherein the negative current collector and the negative active material layer form a negative electrode, and
wherein the first packaging layer further supports and is directly integrated with a power-consumption device, electrically connected to the connecting tab and to the positive tab of the positive current collector.
2. The method of claim 1 , wherein the second patterned conductive layer is printed over the electrochemical stack and over at least a portion of the connecting tab, thereby forming a direct electrical connection between the negative active material layer and the connecting tab by the second patterned conductive layer.
3. The method of claim 1 , wherein at least one of the connecting tab or the positive tab is electrically connected to the device.
4. The method of claim 1 , wherein:
the directly integrated electronic circuit further comprises a second packaging layer, and
the first packaging layer and the second packaging layer are sealed to each other and isolate the electrochemical stack from an environment.
5. The method of claim 1 , wherein the connecting tab and the positive tab of the positive current collector, connected to the power-consumption device, are laminated to the first packaging layer.
6. The method of claim 1 , wherein the power-consumption device is electrically connected to the positive electrode using a mechanical crimp.
7. The method of claim 6 , wherein the mechanical crimp protrudes through the first packaging layer.
8. The method of claim 1 , wherein a portion of the power-consumption device is stacked with a portion of the positive electrode.
9. The method of claim 8 , wherein the directly integrated electronic circuit further comprises a connector seal, positioned over the portion of the power-consumption device stacked with the portion of the positive electrode.
10. The method of claim 1 , wherein the first packaging layer comprises an opening at a location where the power-consumption device is electrically connected to the positive electrode.
11. The method of claim 10 , wherein the positive electrode comprises an opening, coinciding with the opening in the first packaging layer.
12. The method of claim 1 , wherein the first packaging layer is a flexible printed circuit board.
13. The method of claim 1 , wherein each one of the positive active material layer, the electrolyte layer, and the negative active material layer is printed.
14. The method of claim 1 , wherein the electrolyte layer is printed.
15. The method of claim 1 , wherein the negative active material layer comprises zinc.
16. The method of claim 1 , wherein at least one of the positive electrode, the electrolyte layer, or the negative electrode comprises an ionic liquid.
17. The method of claim 1 , wherein each of the positive electrode, the electrolyte layer, and the negative electrode comprises an ionic liquid.
18. The method of claim 1 , wherein the electrochemical stack is substantially free from organic solvents.
19. The method of claim 1 , wherein the power-consumption device is selected from the group consisting of a sensor, a Bluetooth transmitter, a low power wide area network (LoRa) transmitter, and a narrow-band internet of things (NB-IoT) transmitter.
20. The method of claim 1 , wherein both the connecting tab and the positive tab are electrically connected to the device.