IP Library Granted Patent US 11,313,880
Granted Patent B2
US 11,313,880 · App. 16/882,917 · Granted Apr 26, 2022

Force deflection and resistance testing system and method of use

Inventors: Lynwood Adams (Rockwall, TX); Jack Lewis (Royse City, TX)
Assignee: MODUS TEST, LLC
G01R1/07328G01R1/0466G01R1/07314G01R31/2879G01R31/2886G01R31/2889G01R31/2896
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,313,880
App. No.
16/882,917
Granted
Apr 26, 2022
Kind
B2
Abstract

A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.

Claims (68)

1. A method of testing an electrical interconnect, the steps comprising:

providing an electrical interconnect testing device;

providing an electrical interconnect having a plurality of contact points;

attaching the electrical interconnect to the electrical interconnect testing device;

providing a device under test having a plurality of contact points;

aligning the plurality of contact points of the device under test with the plurality of contact points of the electrical interconnect;

pressing the device under test into the electrical interconnect to a plurality of different positions; and

taking at least one measurement of at least one electrical property at the plurality of different positions.

2. The method of claim 1 , further comprising the step of taking a force measurement at the plurality of different positions.

3. The method of claim 1 , wherein the at least one electrical property is resistance; and

wherein the measurement of the at least one electrical property is taken on one of the plurality of contact points of the electrical interconnect.

4. The method of claim 1 , wherein the measurement of the at least one electrical property is taken on a group of the plurality of contact points of the electrical interconnect.

5. The method of claim 1 , wherein the measurement of the at least one electrical property is taken on all of the contact points of the electrical interconnect.

6. The method of claim 1 , further comprising:

providing an actuator configured to press on the device under test in the electrical interconnect;

moving the actuator in a plurality of increments thereby pressing the device under test into the electrical interconnect to a plurality of different positions;

wherein the actuator is held within a gantry;

wherein the actuator facilitates movement in the Z axis or vertical axis to press down upon the device under test; and

wherein the gantry facilitates movement in the X axis and Y axis.

7. The method of claim 1 , further comprising the step of cycling the device under test through the plurality of different positions multiple times to provide statistically improved results.

8. The method of claim 1 , wherein pressing the device under test into the electrical interconnect to the plurality of different positions includes moving the device under test to a plurality of height increments or pressing the device under test with a plurality of force increments.

9. The method of claim 1 , further comprising the step of providing software associated with the electrical interconnect testing device and creating a testing recipe that specifies the plurality of different positions and specifies the plurality of contact points of the electrical interconnect that are tested.

10. The method of claim 1 , further comprising the step of outputting the results of the test and graphing the results.

11. The method of claim 1 , further comprising the step of selecting an optimum vertical height for testing based on the results of the test.

12. The method of claim 1 , further comprising the step of selecting an optimum force for testing based on the results of the test.

13. The method of claim 1 , wherein the device under test is a shorting device or a reference standard.

14. A method, the steps comprising:

providing an electrical interconnect testing device;

providing an electrical interconnect having a plurality of contact points;

attaching the electrical interconnect to the electrical interconnect testing device;

providing a semiconductor chip device having a plurality of contact points;

aligning the plurality of contact points of the device under test with the plurality of contact points of the electrical interconnect the semiconductor chip device in the electrical interconnect after the electrical interconnect has been attached to the electrical interconnect testing device such that the plurality of contact points of the semiconductor chip device connect with the plurality of contact points of the electrical interconnect;

pressing the device under test into the electrical interconnect to a plurality of different positions; and

wherein the electrical interconnect testing device is capable of taking a resistance measurement on one contact point of the electrical interconnect, or a combination of contact points of the electrical interconnect at the plurality of different positions.

15. The method of claim 14 , further comprising taking a force measurement at the plurality of different positions.

16. The method of claim 14 , wherein the semiconductor chip device is a shorting device or a reference standard.

17. The method of claim 14 , wherein the at least one electrical property is resistance; and

wherein the measurement of the at least one electrical property is taken on one of the plurality of contact points of the electrical interconnect.

18. The method of claim 14 , wherein the measurement of the at least one electrical property is taken on a group of the plurality of contact points of the electrical interconnect.

19. The method of claim 14 , wherein the measurement of the at least one electrical property is taken on all of the contact points of the electrical interconnect.

20. The method of claim 14 , further comprising:

providing an actuator configured to press on the device under test in the electrical interconnect;

moving the actuator in a plurality of increments thereby pressing the device under test into the electrical interconnect to a plurality of different positions;

wherein the actuator is held within a gantry;

wherein the actuator facilitates movement in the Z axis or vertical axis to press down upon the device under test; and

wherein the gantry facilitates movement in the X axis and Y axis.

21. The method of claim 14 , wherein pressing the device under test into the electrical interconnect to the plurality of different positions includes moving the device under test to a plurality of height increments or pressing the device under test with a plurality of force increments.

22. The method of claim 14 , further comprising outputting the results of the test and graphing the results.

23. The method of claim 14 , further comprising the step of selecting an optimum vertical height for testing based on the results of the test.

24. The method of claim 14 , further comprising the step of selecting an optimum force for testing based on the results of the test.

25. An apparatus, comprising:

an electrical interconnect testing device;

an electrical interconnect having a plurality of contact points,

one or more connectors, the connectors configured to attach the electrical interconnect to the electrical interconnect testing device;

wherein the electrical interconnect is configured to receive a device under test;

wherein the electrical interconnect includes a raised peripheral edge configured to align the plurality of contact points of the device under test with the plurality of contact points of the electrical interconnect;

an actuator;

wherein the actuator is configured to press the device under test into the electrical interconnect to a plurality of different positions; and

wherein the electrical interconnect testing device is configured to take at least one resistance measurement at the plurality of different positions.

26. The apparatus of claim 25 , wherein the electrical interconnect testing device is configured to take a force measurement at the plurality of different positions.

27. The apparatus of claim 25 , wherein the electrical interconnect testing device is configured to take a resistance measurement on one of the plurality of contact points of the electrical interconnect.

28. The apparatus of claim 25 , wherein the electrical interconnect testing device is configured to take a resistance measurement on a group of the plurality of contact points of the electrical interconnect.

29. The apparatus of claim 25 , wherein the electrical interconnect testing device is configured to take a resistance measurement on all of the contact points of the electrical interconnect.

30. The apparatus of claim 25 , wherein the actuator is held within a gantry, wherein the actuator facilitates movement in the Z axis or vertical axis to press down upon the device under test, and wherein the gantry facilitates movement in the X axis and Y axis.

31. The apparatus of claim 25 , wherein the actuator is configured to cycle through the plurality of different positions multiple times to provide statistically improved results.

32. The apparatus of claim 25 , wherein the electrical interconnect testing device is configured to output the results of the test and graph the results.

33. The apparatus of claim 25 , wherein the electrical interconnect testing device is configured to further comprise the step of selecting an optimum vertical height for testing based on the results of the test.

34. The apparatus of claim 25 , wherein the device under test is a shorting device or a reference standard.

Assignments (3)
SECURITY INTEREST Recorded Nov 17, 2025
From: MODUS TEST, LLC
To: ROGERS, BRUCE D
Reel/Frame 072926/0632 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2020
From: ADAMS, LYNWOOD; LEWIS, JACK
To: MODUS TEST AUTOMATION, LLC
Reel/Frame 052747/0481 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2020
From: MODUS TEST AUTOMATION, LLC
To: MODUS TEST, LLC
Reel/Frame 052747/0590 →
Continuity (5)
Continuation 16181846 · Nov 6, 2018
Continuation 15462383 · Mar 17, 2017
Continuation In Part 14996045 · Jan 14, 2016
Provisional Application 62104117 · Jan 16, 2015
Related Publication 20200319231A1 · Oct 8, 2020
Cited By (3)
US 12,560,643 US 12,571,833 US 12,716,913