Submersible microphone system with a compressible spacer

1. A camera comprising:

a housing comprising a port configured to allow passage of sound waves from an external area of the camera to an internal area of the camera;

a circuit board comprising an opening;

a microphone coupled to a first surface of the circuit board adjacent to the opening;

a compressible spacer located entirely on a side of the circuit board relative to a second surface and coupled to the second surface of the circuit board, wherein the second surface is diametrically opposite to the first surface, wherein the compressible spacer is a circular structure with an inner radius and an outer radius, and wherein the compressible spacer is coupled directly to the second surface of the circuit board via an adhesive; and

a waterproof membrane disposed between the housing and the compressible spacer;

wherein the compressible spacer is configured to allow the waterproof membrane to compensate for pressure differentials on opposing front and back sides by compressing and decompressing;

wherein the compressible spacer has an original width between the front side and the back side; and

wherein the compressible spacer is configured to be compressed by a compressive force so that the original width between the front side and the back side is reduced by the compressive force.

2. The camera of claim 1 further comprising:

a support structure disposed between the waterproof membrane and the compressible spacer.

3. The camera of claim 2 , wherein the support structure has a mechanical stiffness greater than a mechanical stiffness of the waterproof membrane and the support structure is comprised of plastic, ceramic, or metal.

4. The camera of claim 1 , wherein the port comprises a first radius on an external surface of the housing and a second radius on an internal surface of the housing.

5. The camera of claim 4 , wherein the first radius is greater than the second radius.

6. The camera of claim 1 , wherein the adhesive is a pressure sensitive adhesive.

7. The microphone assembly of claim 1 , wherein the inner radius forms a through hole that extends from a front side of the compressible spacer to a back side of the compressible spacer so that the sound waves are allowed to pass through the compressible spacer.

8. A microphone assembly comprising:

a port configured to allow passage of sound waves from an external area of a camera housing to an internal area of the camera housing;

a microphone coupled to a first surface of a circuit board;

a compressible spacer located entirely on a side of the circuit board relative to a second surface and coupled to the second surface of the circuit board, wherein the second surface is diametrically opposite to the first surface, wherein the compressible spacer is a circular structure with an inner radius and an outer radius, and wherein the compressible spacer is coupled directly to the second surface of the circuit board via an adhesive; and

a waterproof membrane disposed between the port and the compressible spacer;

wherein the compressible spacer is configured to allow the waterproof membrane to compensate for pressure differentials on opposing front and back sides by compressing and decompressing;

wherein the compressible spacer has an original distance between the front side and the back side; and

wherein the compressible spacer is configured to be compressed by a compressive force so that the original distance between the front side and the back side is reduced by the compressive force.

9. The microphone assembly of claim 8 , further comprising:

a support structure disposed between the waterproof membrane and the compressible spacer, and wherein the support structure is comprised of plastic, ceramic, or metal.

10. The microphone assembly of claim 9 , wherein the support structure has a mechanical stiffness greater than a mechanical stiffness of the waterproof membrane.

11. The microphone assembly of claim 9 , wherein the port comprises a first radius and the support structure comprises a second radius.

12. The microphone assembly of claim 11 , wherein the second radius is greater than the first radius.

13. The microphone assembly of claim 8 , wherein the compressible spacer is coupled directly to the second surface of the circuit board via an adhesive.

14. The microphone assembly of claim 13 , wherein the adhesive is a pressure sensitive adhesive.

15. The microphone assembly of claim 13 , wherein the inner radius forms a through hole that extends from a front side of the compressible spacer to a back side of the compressible spacer so that the sound waves are allowed to pass through the compressible spacer.

16. A microphone assembly comprising:

a microphone coupled to a first surface of a circuit board;

a compressible spacer located entirely on a side of the circuit board relative to a second surface and coupled to the second surface of the circuit board, wherein the second surface is diametrically opposite to the first surface, wherein the compressible spacer is a circular structure with an inner radius and an outer radius, and wherein the compressible spacer is coupled directly to the second surface of the circuit board via an adhesive;

a waterproof membrane; and

a support structure disposed between the waterproof membrane and the compressible spacer, wherein the support structure is comprised of a rigid material;

wherein the compressible spacer is configured to allow the waterproof membrane to compensate for pressure differentials on opposing front and back sides by compressing and decompressing;

wherein the compressible spacer has a thickness between the front side and the back side; and

wherein the compressible spacer is configured to be compressed by a compressive force so that the thickness between the front side and the back side is reduced by the compressive force.

17. The microphone assembly of claim 16 , wherein the rigid material is plastic, ceramic, or metal.

18. The microphone assembly of claim 16 , wherein the compressible spacer is directly coupled to the second surface of the circuit board via an adhesive that is a pressure sensitive adhesive.

19. The microphone assembly of claim 18 , wherein the compressible spacer comprises the front side and the back side extend parallel to one another and the compressible spacer comprises a through hole forming the inner radius that extends from the front side to the back side.

20. The microphone assembly of claim 16 , wherein the compressible spacer comprises the front side and the back side extend parallel to one another and the compressible spacer comprises a through hole forming the inner radius that extends from the front side to the back side.