Magnetic connector attachment and heat sinking

1. A co-processor module for use with a set top box, the module comprising:

an enclosure;

a processor assembly contained in the enclosure and including a PCB, a processor, and a USB connector;

one or more magnets extending through a wall of the enclosure and positioned to directly contact a surface of the set top box when the USB connector is connected to the set top box;

a metal plate in direct contact with the one or more magnets; and

a thermal pad in direct contact with and positioned between the processor and the metal plate.

2. The co-processor module of claim 1 , wherein the metal plate is a first metal plate and the thermal pad is a first thermal pad, and further comprising a second thermal pad positioned against the PCB and a second metal plate positioned against the second thermal pad.

3. The co-processor module of claim 1 , wherein the enclosure comprises a first half and a second half, and wherein the one or more magnets and the USB connector extend through the first half of the enclosure.

4. The co-processor module of claim 3 , wherein the first half includes a planar region surrounding each of the one or more magnets and offset from the first half, each planar region being approximately co-planar with an outward facing surface of the corresponding magnet.

5. The co-processor module of claim 3 , wherein the metal plate is attached to the first half, wherein the one or more magnets are captured therebetween.

6. A co-processor module for use with a device, the module comprising:

an enclosure having a first half and a second half;

a processor assembly contained in the enclosure and including a PCB, a processor, and a connector extending through the first half;

one or more magnets extending through the first half and positioned to directly contact a surface of the device when the connector is connected to the device;

a metal plate attached to the first half, wherein the one or more magnets are in direct contact with and captured between the first half and the metal plate; and

a thermal pad in direct contact with and positioned between the processor and the metal plate.

7. The co-processor module of claim 6 , wherein the metal plate is a first metal plate and the thermal pad is a first thermal pad, and further comprising a second thermal pad positioned against the PCB and a second metal plate positioned against the second thermal pad.

8. The co-processor module of claim 7 , wherein the second metal plate is attached to the second half.

9. The co-processor module of claim 6 , wherein the first and second halves include mating features configured for snap together engagement with each other.

10. The co-processor module of claim 6 , wherein the first half includes a planar region surrounding each of the one or more magnets and offset from the first half, each planar region being approximately co-planar with an outward facing surface of the corresponding magnet.

11. The co-processor module of claim 6 , wherein the connector is a USB connector.

12. A method for supplementing the processing capability of an electronic device, the method comprising:

connecting a module containing a processing device to the electronic device via a connector;

retaining the module against a surface of the electronic device with one or more magnets in direct contact with the surface; and

transferring heat from the processing device to the surface of the electronic device via a metal plate in direct contact with the one or more magnets.

13. The method of claim 12 , wherein the processing device if one of a processor or a memory device.

14. The method of claim 12 , wherein the electronic device is a set top box.

15. The method of claim 12 , wherein the connector is a USB connector.