Antenna apparatus having adhesive coupling
In one embodiment of the present disclosure, an antenna assembly includes a plurality of layers defining an antenna assembly including a plurality of PCB layers and a plurality of non-PCB layers, the antenna assembly having a top surface and a bottom surface, and adhesive coupling between the PCB layers and the non-PCB layers.
1. An antenna assembly comprising:
a plurality of layers defining the antenna assembly including a plurality of PCB layers and a plurality of non-PCB layers, the antenna assembly having a top surface and a bottom surface; and
adhesive coupling between the PCB layers and the non-PCB layers, wherein the adhesive coupling is in a predetermined pattern to provide intercell venting.
2. The antenna assembly of claim 1 , wherein the adhesive coupling comprises an epoxy.
3. The antenna assembly of claim 1 , wherein each of the plurality of layers defining the antenna assembly are substantially planar and are oriented parallel to one another in a stack assembly.
4. The antenna assembly of claim 1 , wherein the plurality of layers are coupled together via pressure applied by a press.
5. The antenna assembly of claim 1 , wherein the adhesive is cured by heat or UV treatment.
6. The antenna assembly of claim 1 , wherein at least one of the plurality of non-PCB layers comprises a plastic selected from the group consisting of polyethylene (PE), linear low density polyethylene (LLDPE), high density polyethylene (HDPE), medium density polyethylene (MDPE), ultra-high molecular weight polyethylene (UHMWPE), polypropylene (PP), polyethylene terephthalate (PET), and polyvinyl chlorine (PVC).
7. The antenna assembly of claim 1 , wherein the adhesive coupling is in a predetermined pattern between two adjacent layers in the plurality of layers.
8. The antenna assembly of claim 1 , wherein the plurality of layers includes a radome.
9. The antenna assembly of claim 8 , wherein the plurality of layers include a radome spacer, the radome being coupled to the radome spacer by the adhesive coupling.
10. The antenna assembly of claim 9 , wherein the radome spacer comprises a frame structure including a plurality of cell walls having a first end and a second end and defining a plurality of apertures, wherein the adhesive coupling is a pattern aligned with the first and second ends of the plurality of cell walls.
11. The antenna assembly of claim 1 , wherein the plurality of PCB layers includes an upper patch antenna layer and a lower patch antenna layer, each layer having a plurality of antenna patch elements, wherein the adhesive coupling is in a pattern around the antenna elements.
12. The antenna assembly of claim 11 , wherein the plurality of layers include an antenna spacer, the antenna spacer being coupled to the upper and lower patch antenna layers by the adhesive coupling.
13. The antenna assembly of claim 12 , wherein the antenna spacer comprises a frame structure including a plurality of cell walls having a first end and a second end and defining a plurality of apertures, wherein the adhesive coupling is in a pattern aligned with the first and second ends of the plurality of cell walls.
14. The antenna assembly of claim 1 , wherein the plurality of non-PCB layers includes a dielectric spacer, the dielectric spacer coupled to the undersurface of the lower patch antenna by the adhesive coupling.
15. The antenna assembly of claim 1 , the antenna assembly further comprising a PCB assembly, the PCB assembly coupled to the dielectric spacer by the adhesive coupling.
16. The antenna assembly of claim 1 , wherein the adhesive of the adhesive coupling has a durometer value in the range of 25 to 100 (Shore A).
17. The antenna assembly of claim 1 , wherein the amount of adhesive used in the adhesive coupling is greater at the bottom surface of the antenna assembly than the top surface.
18. An antenna assembly comprising:
a plurality of layers defining the antenna assembly including a plurality of PCB layers including a PCB assembly layer, a lower patch antenna layer, and an upper patch antenna layer, and a plurality of non-PCB layers including a dielectric layer, an antenna spacer, a radome spacer, and a radome; and
adhesive coupling between the each of the plurality of layers, wherein the adhesive coupling is in a predetermined pattern to provide intercell venting.