Power delivery system
View Patent ↗A power delivery system includes a first planar power module that is coupled to a power system and that transmits power received from the power system. A first planar power module connector is connected to the first planar power module and transmits the power received from the first planar power module. A second planar power module is connected to the first planar power module connector and transmits the power received from the first planar power module connector. A first power transmission coupling engages at least one of the first planar power module and the second planar power module, and receives the power from the at least one of the first planar power module and the second planar power module to which it is engaged, and transmits the power to a first component via a first power transmission pad coupled to the first component and engaging the first power transmission coupling.
1. A power delivery system, comprising:
a first planar power module that is coupled to a power system and that is configured to transmit power received from the power system;
a first planar power module connector that is connected to the first planar power module and that is configured to transmit the power received from the first planar power module;
a second planar power module that is connected to the first planar power module connector and that is configured to transmit the power received from the first planar power module connector; and
a first power transmission coupling engaging at least one of the first planar power module and the second planar power module, wherein the first power transmission coupling is configured to receive the power from the at least one of the first planar power module and the second planar power module to which the first power transmission coupling is engaged, and transmit the power to a first component via a first power transmission pad that is coupled to the first component and that engages the first power transmission coupling.
2. The system of claim 1 , further comprising:
a second planar power module connector that is connected to the second planar power module and that is configured to transmit the power received from the second planar power module; and
a third planar power module that is connected to the second planar power module connector and that is configured to transmit the power received from the second planar power module connector.
3. The system of claim 2 , further comprising:
a second power transmission coupling engaging the third planar power module, wherein the second power transmission coupling is configured to receive the power from the third planar power module, and transmit the power to a second component via a second power transmission pad that is coupled to the second component and that engages the second power transmission coupling.
4. The system of claim 1 , further comprising:
an insulating layer engaging the first planar power module and the second planar power module.
5. The system of claim 1 , wherein the first power transmission coupling includes a conductive rubber material.
6. The system of claim 1 , wherein the first component is a circuit board.
7. An Information Handling System (IHS), comprising:
a chassis including a chassis inner surface;
a circuit board that is included in the chassis and that includes a first transmission pad that is coupled to a first component on the circuit board;
a first planar power module that is located between the chassis inner surface and the circuit board, coupled to a power system, and configured to transmit power received from the power system;
a first planar power module connector that is located between the chassis inner surface and the circuit board, connected to the first planar power module, and configured to transmit the power received from the first planar power module;
a second planar power module that is located between the chassis inner surface and the circuit board, connected to the first planar power module connector, and configured to transmit the power received from the first planar power module connector; and
a first power transmission coupling engaging the first transmission pad included on the circuit board and at least one of the first planar power module and the second planar power module, wherein the first power transmission coupling is configured to receive the power from the at least one of the first planar power module and the second planar power module to which the first power transmission coupling is engaged, and transmit the power via the first transmission pad to the first component on the circuit board.
8. The IHS of claim 7 , further comprising:
a second planar power module connector that is located between the chassis inner surface and the circuit board, connected to the second planar power module, and configured to transmit the power received from the second planar power module; and
a third planar power module that is located between the chassis inner surface and the circuit board, connected to the second planar power module connector, and configured to transmit the power received from the second planar power module connector.
9. The IHS of claim 8 , wherein the circuit board includes a second transmission pad that is coupled to a second component on the circuit board, and further comprising:
a second power transmission coupling engaging the second transmission pad included on the circuit board and the third planar power module, wherein the second power transmission coupling is configured to receive the power from the third planar power module and transmit the power via the second transmission pad to the second component on the circuit board.
10. The IHS of claim 7 , further comprising:
an insulating layer engaging the chassis inner surface and each of the first planar power module and the second planar power module.
11. The IHS of claim 7 , wherein the first power transmission coupling includes a conductive rubber material.
12. The IHS of claim 7 , further comprising:
an insulating layer located between the circuit board and each of the first planar power module and the second planar power module.
13. The IHS of claim 7 , wherein the circuit board is free of a power layer.
14. A method for delivering power, comprising:
transmitting, by a first planar power module that is located between a chassis inner surface of a chassis and a circuit board that is housed in the chassis, power received from the power system;
transmitting, by a first planar power module connector that is located between the chassis inner surface and the circuit board and that is connected to the first planar power module, the power received from the first planar power module;
transmitting, by a second planar power module that is located between the chassis inner surface and the circuit board and that is connected to the first planar power module connector, the power received from the first planar power module connector;
receiving, by a first power transmission coupling engaging at least one of the first planar power module and the second planar power module, the power from the at least one of the first planar power module and the second planar power module to which the first power transmission coupling is engaged; and
transmitting, by the first power transmission coupling, the power to a first component via a first power transmission pad that is coupled to the first component and that engages the first power transmission coupling.
15. The method of claim 14 , further comprising:
transmitting, by a second planar power module connector that is located between the chassis inner surface and the circuit board and that is connected to the second planar power module, the power received from the second planar power module; and
transmitting, by a third planar power module that is located between the chassis inner surface and the circuit board and that is connected to the second planar power module connector, the power received from the second planar power module connector.
16. The method of claim 14 , further comprising:
receiving, by a second power transmission coupling engaging the third planar power module, the power from the third planar power module; and
transmitting, by the second power transmission coupling, the power to a second component via a second power transmission pad that is coupled to the second component and that engages the second power transmission coupling.
17. The method of claim 14 , further comprising:
insulating, by an insulating layer engaging the chassis inner surface and each of the first planar power module and the second planar power module, the first planar power module and the second planar power module from the chassis.
18. The method of claim 14 , wherein the first power transmission coupling includes a conductive rubber material.
19. The method of claim 14 , further comprising:
insulating, by an insulating layer located between the circuit board and each of the first planar power module and the second planar power module, the first planar power module and the second planar power module from the circuit board.
20. The method of claim 14 , further comprising:
wherein the circuit board is free of a power layer.