Semiconductor laser diode on tiled gallium containing material
In an example, the present invention provides a gallium and nitrogen containing structure. The structure has a plurality of gallium and nitrogen containing semiconductor substrates, each of the gallium and nitrogen containing semiconductor substrates having one or more epitaxially grown layers. The structure has a first handle substrate coupled to each of the substrates. The orientation of a reference crystal direction for each of the substrates are parallel to within 10 degrees or less. The structure has a first bonding medium provided between the first handle substrate and each of the substrates.
1. A gallium and nitrogen containing structure comprising:
a plurality of gallium and nitrogen containing semiconductor substrates each having a {11-20}, {10-10}, {10-11}, {20-21} or {30-31} surface orientation, each of the plurality of gallium and nitrogen containing semiconductor substrates having one or more epitaxial regions;
a first handle substrate having a bonding surface with a larger area than a sum of areas of bonding surfaces of the plurality of the gallium and nitrogen containing substrates, wherein each of the plurality of gallium and nitrogen containing semiconductor substrates are coupled to the first handle substrate, and the plurality of gallium and nitrogen containing semiconductor substrates are arranged in a tiled configuration overlying the bonding surface of the first handle substrate, wherein orientations of a reference crystal direction for each of the plurality of gallium and nitrogen containing semiconductor substrates are parallel to within 10 degrees or less;
a first bonding medium provided on the bonding surface between the first handle substrate and each of the plurality of gallium and nitrogen containing semiconductor substrates.
2. The structure of claim 1 wherein a processed region is formed overlying each of the plurality of gallium and nitrogen containing semiconductor substrates bonded to the first handle substrate.
3. The structure of claim 1 wherein the first bonding medium comprises a dielectric material containing oxygen or nitrogen.
4. The structure of claim 1 wherein the reference crystal direction for each of the plurality of gallium and nitrogen containing semiconductor substrates are parallel to within 10 degrees or less of a selected crystal direction of the first handle substrate.
5. The structure of claim 1 wherein each of the plurality of gallium and nitrogen containing semiconductor substrates have a thickness of less than 50 micrometers.
6. A gallium and nitrogen containing structure comprising:
a plurality of gallium and nitrogen containing semiconductor substrates each having a {11-20}, {10-10}, {10-11}, {20-21} or {30-31} surface orientation, each of the plurality of gallium and nitrogen containing semiconductor substrates having one or more epitaxial regions;
a first handle substrate having a bonding surface with a larger area than a sum of areas of bonding surfaces of the plurality of the gallium and nitrogen containing substrates, wherein each of the plurality of gallium and nitrogen containing semiconductor substrates are coupled to the first handle substrate, and the plurality of gallium and nitrogen containing semiconductor substrates are arranged in a tiled configuration overlying the bonding surface of the first handle substrate, wherein orientations of a reference crystal direction for each of the plurality of gallium and nitrogen containing semiconductor substrates are parallel to within 10 degrees or less of a selected crystal direction of the first handle substrate;
a first bonding medium provided between the first handle substrate and each of the plurality of gallium and nitrogen containing semiconductor substrates.
7. The structure of claim 6 wherein a processed region is formed overlying each of the plurality of gallium and nitrogen containing semiconductor substrates bonded to the first handle substrate.
8. The structure of claim 6 wherein the first bonding medium comprises a dielectric material containing oxygen or nitrogen.
9. The structure of claim 6 wherein each of the plurality of gallium and nitrogen containing semiconductor substrates have a thickness of less than 50 micrometers.
10. A gallium and nitrogen containing structure comprising:
a plurality of gallium and nitrogen containing semiconductor substrates each having a {11-20}, {10-10}, {10-11}, {20-21} or {30-31} surface orientation, each of the plurality of gallium and nitrogen containing semiconductor substrates having one or more epitaxial regions;
a first handle substrate having a bonding surface with a larger area than a sum of areas of bonding surfaces of the plurality of the gallium and nitrogen containing substrates, wherein each of the plurality of gallium and nitrogen containing semiconductor substrates are coupled to the bonding surface of the first handle substrate, and the plurality of gallium and nitrogen containing semiconductor substrates are arranged in a tiled configuration overlying the bonding surface of the first handle substrate, wherein orientations of a reference crystal direction for each of the plurality of gallium and nitrogen containing semiconductor substrates are parallel to within 10 degrees or less;
a first bonding medium comprising a dielectric material provided between the bonding surface of the first handle substrate and each of the plurality of gallium and nitrogen containing semiconductor substrates.
11. The structure of claim 10 wherein a processed region is formed overlying each of the plurality of gallium and nitrogen containing semiconductor substrates bonded to the first handle substrate.
12. The structure of claim 10 wherein the first bonding medium comprises oxygen or nitrogen.
13. The structure of claim 10 wherein the reference crystal direction for each of the plurality of gallium and nitrogen containing semiconductor substrates are parallel to within 10 degrees or less of a selected crystal direction of the first handle substrate.
14. The structure of claim 10 wherein each of the plurality of gallium and nitrogen containing semiconductor substrates have a thickness of less than 50 micrometers.