Millimeter wave antenna array
An antenna array may include a plurality of printed circuit boards (PCBs) oriented in a stacked arrangement, parallel to and spaced apart from one another. Each of the PCBs may include a linear array of antenna elements, which cooperate with the linear arrays of antenna elements on other PCBs to form a two-dimensional array of antenna elements. The PCBs may be supported at one end by a common backplate in a cantilevered manner, with the linear arrays of antenna elements located near the free end of the PCBs. The PCBs may include a thicker portion and a thinner portion, and the thinner portion may include a heat sink or other thermal dissipation structure.
1. An antenna array, comprising:
a backplane; and
a plurality of printed circuit boards supported at a first edge by the backplane, the plurality of printed circuit boards arranged parallel to and spaced apart from one another, each of the plurality of printed circuit boards including a linear array of dipole antenna elements arranged along a second free edge of the printed circuit board opposite the first edge of the printed circuit board, the linear array of dipole antenna elements on each of the plurality of printed circuit boards cooperating with one another to form a two-dimensional array of printed circuit boards;
wherein each of the plurality of printed circuit boards includes a first portion proximate the backplane and having a first thickness and a second portion proximate the second free edge of the printed circuit board and having a second thickness greater than the first thickness;
wherein each of the plurality of printed circuit boards includes a thermal dissipation structure supported by the first portion of the printed circuit board; and
wherein the thermal dissipation structure includes a plurality of fins.
2. The antenna array of claim 1 , wherein the plurality of printed circuit boards are arranged orthogonal to the backplane.
3. The antenna array of claim 2 , wherein each of the linear array of dipole antenna elements comprises:
a first dipole arm that comprises a proximal section that extends normal to the backplane and a distal section that extends perpendicular from the proximal section in a first direction that is parallel to the backplane; and
a second dipole arm that comprises a proximal section that extends normal to the backplane and a distal section that extends perpendicular from the proximal section in a second direction, that is opposite from the first direction, the second direction also being parallel to the backplane.
4. The antenna array of claim 1 , wherein the linear array of dipole antenna elements is at least partially embedded within the second portion of the printed circuit board.
5. The antenna array of claim 1 , wherein the linear array of dipole antenna elements includes a first subset of dipole antenna elements oriented in a first direction and a second subset of dipole antenna elements oriented in a second direction.
6. The antenna array of claim 5 , wherein the first subset of dipole antenna elements are horizontally oriented and include a pair of parallel, non-coplanar sections, and wherein the second subset of dipole antenna elements are vertically oriented and include a pair of axially aligned vias spaced apart from one another.
7. The antenna array of claim 5 , wherein the dipole antenna elements of the first subset of dipole antenna elements alternate with the dipole antenna elements of the second subset of dipole antenna elements along the length of the linear array of dipole antenna elements.
8. An antenna array, comprising:
a backplane; and
a plurality of printed circuit boards supported at a first edge by the backplane, the plurality of printed circuit boards arranged parallel to and spaced apart from one another, each of the plurality of printed circuit boards including a linear array of dipole antenna elements arranged along a second free edge of the printed circuit board opposite the first edge of the printed circuit board, the linear array of dipole antenna elements on each of the plurality of printed circuit boards cooperating with one another to form a two-dimensional array of printed circuit boards;
wherein each of the plurality of printed circuit boards includes a first portion proximate the backplane and having a first thickness and a second portion proximate the second free edge of the printed circuit board and having a second thickness greater than the first thickness; and
wherein the linear array of dipole antenna elements is at least partially embedded within the second portion of the printed circuit board.
9. The antenna array of claim 8 , wherein the plurality of printed circuit boards are arranged orthogonal to the backplane.
10. The antenna array of claim 9 , wherein each of the linear array of dipole antenna elements comprises:
a first dipole arm that comprises a proximal section that extends normal to the backplane and a distal section that extends perpendicular from the proximal section in a first direction that is parallel to the backplane; and
a second dipole arm that comprises a proximal section that extends normal to the backplane and a distal section that extends perpendicular from the proximal section in a second direction, that is opposite from the first direction, the second direction also being parallel to the backplane.
11. The antenna array of claim 10 , wherein the proximal sections of the first and second dipole arms comprise parallel overlapping striplines.
12. The antenna array of claim 11 , wherein the distal sections of the first and second dipole arms are parallel with one another and extend in opposite directions and do not have substantial overlap.
13. The antenna array of claim 10 , wherein each of the linear array of dipole antenna elements comprises a reflector comprising a strip located outward of the first dipole arm and the second dipole arm proximate the second free edge of the printed circuit board.
14. The antenna array of claim 8 , wherein each of the plurality of printed circuit boards includes a thermal dissipation structure supported by the first portion of the printed circuit board.
15. The antenna array of claim 14 , wherein the thermal dissipation structure includes a plurality of fins.
16. An antenna array, comprising:
a backplane; and
a plurality of printed circuit boards supported at a first edge by the backplane, the plurality of printed circuit boards arranged parallel to and spaced apart from one another, each of the plurality of printed circuit boards including a linear array of dipole antenna elements arranged along a second free edge of the printed circuit board opposite the first edge of the printed circuit board, the linear array of dipole antenna elements on each of the plurality of printed circuit boards cooperating with one another to form a two-dimensional array of printed circuit boards;
wherein each of the plurality of printed circuit boards includes a first portion proximate the backplane and having a first thickness and a second portion proximate the second free edge of the printed circuit board and having a second thickness greater than the first thickness;
wherein the linear array of dipole antenna elements includes a first subset of dipole antenna elements oriented in a first direction and a second subset of dipole antenna elements oriented in a second direction; and
wherein the first subset of dipole antenna elements are horizontally oriented and include a pair of parallel, non-coplanar sections, and wherein the second subset of dipole antenna elements are vertically oriented and include a pair of axially aligned vias spaced apart from one another.
17. The antenna array of claim 16 , wherein the dipole antenna elements of the first subset of dipole antenna elements alternate with the dipole antenna elements of the second subset of dipole antenna elements along the length of the linear array of dipole antenna elements.
18. The antenna array of claim 16 , wherein each of the plurality of printed circuit boards includes a thermal dissipation structure supported by the first portion of the printed circuit board.
19. The antenna array of claim 18 , wherein the thermal dissipation structure includes a plurality of fins.
20. The antenna array of claim 19 , wherein the plurality of printed circuit boards are arranged orthogonal to the backplane.