IP Library Granted Patent US 11,450,784
Granted Patent B2
US 11,450,784 · App. 16/905,330 · Granted Sep 20, 2022

Light-emitting thyristor, light-emitting element chip, optical print head, and image forming device

Inventors: Hiroto Kawada (Tokyo, JP); Kenichi Tanigawa (Tokyo, JP); Shinya Jyumonji (Tokyo, JP); Takuma Ishikawa (Tokyo, JP); Chihiro Takahashi (Tokyo, JP)
Assignee: Oki Electric Industry Co., Ltd.
H01L33/0016G03G15/04054H01L27/153H01L33/0025H01L33/0062H01L33/025H01L33/305G03G2215/0409
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Quick Facts
Patent No.
US 11,450,784
App. No.
16/905,330
Granted
Sep 20, 2022
Kind
B2
Abstract

A light-emitting thyristor includes a first semiconductor layer of a P type, a second semiconductor layer of an N type arranged adjacent to the first semiconductor layer; a third semiconductor layer of the P type arranged adjacent to the second semiconductor layer; and a fourth semiconductor layer of the N type arranged adjacent to the third semiconductor layer. A part of the first semiconductor layer is an active layer adjacent to the second semiconductor layer. A dopant concentration of the active layer is higher than or equal to a dopant concentration of the third semiconductor layer. A thickness of the third semiconductor layer is thinner than a thickness of the second semiconductor layer. A dopant concentration of the second semiconductor layer is lower than the dopant concentration of the third semiconductor layer.

Claims (47)

1. A light-emitting thyristor comprising:

a first semiconductor layer of a first conductivity type;

a second semiconductor layer of a second conductivity type, the second semiconductor layer being arranged adjacent to the first semiconductor layer;

a third semiconductor layer of the first conductivity type, the third semiconductor layer being arranged adjacent to the second semiconductor layer; and

a fourth semiconductor layer of the second conductivity type, the fourth semiconductor layer being arranged adjacent to the third semiconductor layer, wherein

a part of the first semiconductor layer is an active layer adjacent to the second semiconductor layer,

a dopant concentration of the active layer is higher than or equal to a dopant concentration of the third semiconductor layer,

a thickness of the third semiconductor layer is thinner than a thickness of the second semiconductor layer, and

a dopant concentration of the second semiconductor layer is lower than the dopant concentration of the third semiconductor layer.

2. The light-emitting thyristor according to claim 1 , wherein a band gap of the active layer is narrower than or equal to a band gap of the second semiconductor layer and narrower than or equal to a band gap of the third semiconductor layer.

3. The light-emitting thyristor according to claim 1 , wherein the third semiconductor layer includes a gate layer of the first conductivity type and an etching stop layer.

4. The light-emitting thyristor according to claim 1 , wherein the first conductivity type is a P type and the second conductivity type is an N type.

5. The light-emitting thyristor according to claim 4 , wherein

the thickness of the third semiconductor layer is in a range from 150 nm to 180 nm, and

the thickness of the second semiconductor layer is in a range from 270 nm to 330 nm.

6. The light-emitting thyristor according to claim 4 , wherein

a dopant concentration of the fourth semiconductor layer is in a range from 1.2×10 18 cm −3 to 1.8×10 18 cm −3 ,

the dopant concentration of the third semiconductor layer is in a range from 8×10 17 cm −3 to 1.2×10 18 cm −3 ,

the dopant concentration of the second semiconductor layer is in a range from 4×10 17 cm −3 to 6×10 17 cm −3 , and

the dopant concentration of the active layer is in a range from 1.2×10 18 cm −3 to 1.5×10 19 cm −3 .

7. The light-emitting thyristor according to claim 1 , wherein the first conductivity type is an N type and the second conductivity type is a P type.

8. The light-emitting thyristor according to claim 7 , wherein

the thickness of the third semiconductor layer is in a range from 180 nm to 220 nm, and

the thickness of the second semiconductor layer is in a range from 270 nm to 330 nm.

9. The light-emitting thyristor according to claim 7 , wherein

a dopant concentration of the fourth semiconductor layer is in a range from 4×10 18 cm −3 to 6×10 18 cm −3 ,

the dopant concentration of the third semiconductor layer is in a range from 7×10 17 cm −3 to 1×10 18 cm −3 ,

the dopant concentration of the second semiconductor layer is in a range from 4×10 17 cm −3 to 6×10 17 cm −3 , and

the dopant concentration of the active layer is in a range from 1×10 18 cm −3 to 1.5×10 19 cm −3 .

10. The light-emitting thyristor according to claim 1 , wherein

the first semiconductor layer includes a first layer, the active layer, and a second layer arranged between the first layer and the active layer,

a band gap of the first layer is wider than a band gap of the active layer, and

a band gap of the second layer is wider than the band gap of the first layer and a band gap of the fourth semiconductor layer.

11. The light-emitting thyristor according to claim 10 , wherein

the second semiconductor layer includes a third layer adjacent to the active layer and a fourth layer arranged between the third layer and the third semiconductor layer, and

a band gap of the third layer is wider than the band gap of the first layer and the band gap of the fourth semiconductor layer.

12. The light-emitting thyristor according to claim 1 , further comprising:

a first electrode electrically connected with the first semiconductor layer;

a second electrode electrically connected with the second semiconductor layer or the third semiconductor layer; and

a third electrode electrically connected with the fourth semiconductor layer.

13. A light-emitting element chip comprising:

a substrate part; and

the light-emitting thyristor according to claim 1 arranged on the substrate part.

14. The light-emitting element chip according to claim 13 , wherein the first semiconductor layer is arranged on a side closer to the substrate part than the fourth semiconductor layer.

15. The light-emitting element chip according to claim 13 , wherein the first semiconductor layer is arranged on a side farther from the substrate part than the fourth semiconductor layer.

16. An optical print head comprising the light-emitting element chip according to claim 13 .

17. An image forming device comprising the optical print head according to claim 16 .

Assignments (2)
MERGER Recorded Jun 8, 2021
From: OKI DATA CORPORATION
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 056470/0625 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2020
From: KAWADA, HIROTO; TANIGAWA, KENICHI; JYUMONJI, SHINYA; ISHIKAWA, TAKUMA; TAKAHASHI, CHIHIRO
To: OKI DATA CORPORATION
Reel/Frame 052979/0887 →