EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

1 . A method of assembling an embedded-bridge substrate connector apparatus, comprising:

patterning a mask onto a conductive foil that is mounted on a carrier;

plating a reference layer through a corridor in the mask and on the conductive foil;

attaching a first semiconductive device to the reference layer at a ball array;

encapsulating the first semiconductive device, both above the device and underfilling the device at the ball array and reference layer, to achieve a die-side module;

attaching a land-side first device to the first device in the die-side module; and

encapsulating the first land-side device to achieve a land-side module.

2 . The method of claim 1 , further including removing the mask before attaching the first semiconductive device.

3 . The method of claim 1 , further including:

removing the mask;

attaching the first device; and

attaching a subsequent device to the reference layer.

4 . The method of claim 1 , further including:

removing the mask;

attaching the first device;

attaching a subsequent device to the reference layer; and

attaching a third device to the reference layer, wherein the first land-side device physically and communicatively bridges between the first device and the third device.

5 . The method of claim 1 , further including attaching a first printed wiring board to the die-side module by coupling to the first device.

6 . The method of claim 1 , further including:

attaching a first printed wiring board to the die-side module by coupling to the first device; and

attaching a subsequent printed wiring board to the die-side module by coupling to the subsequent device.

7 . The method of claim 1 , further including:

attaching a first printed wiring board to the die-side module by coupling to the first device; and

attaching the land-side module to a board through a land-side ball array.

8 . A method of fabricating an embedded-bridge substrate connector apparatus, the method comprising:

forming a patterned reference layer including a die side and a land side, wherein the patterned reference layer is embedded in and each portion of the patterned reference layer is exposed by a die-side encapsulation, wherein the patterned reference layer is coupled to a die-side module, the die-side module including a first device and a subsequent device encapsulated in the die-side encapsulation, wherein each of the first device and the subsequent device is electrically coupled to the patterned reference layer;

coupling a land-side module to the die-side module, the land-side module including a first land-side device encapsulated in a land-side encapsulation and wherein the first land-side device is electrically coupled to the first device through the patterned reference layer, wherein the patterned reference layer is contacted by electrical bumps on the die side and by electrical bumps on the land side, wherein a first one of the electrical bumps contacts a patterned reference layer element and the first device, and wherein a second one of the electrical bumps contacts the patterned reference layer element and the first land-side device; and

wherein one of the first device and the first land-side device is a silicon bridge for electrically communicating through the patterned reference layer between an adjacent device in one or the other of the die-side module and the land-side module.

9 . The method of claim 8 , further including:

coupling a third device to the patterned reference layer, the third device adjacent the first device, wherein the third device is electrically coupled to the patterned reference layer, and wherein the first land-side device physically and communicatively bridges between the first device and the third device.

10 . The method of claim 8 , further including:

coupling a third device to the patterned reference layer, the third device adjacent the first device, wherein the third device is electrically coupled to the patterned reference layer, and wherein the first land-side device physically and communicatively bridges between the first device and the third device; and

coupling a second device to the patterned reference layer, the second device opposite the third device and adjacent the first device, wherein the second device is electrically coupled through the patterned reference layer to a first printed wiring board in the land-side module.

11 . The method of claim 8 , further including:

coupling a third device to the patterned reference layer, the third device adjacent the first device, wherein the third device is electrically coupled to the patterned reference layer, and wherein the first land-side device physically and communicatively bridges between the first device and the third device;

coupling a second device to the patterned reference layer, the second device opposite the third device and adjacent the first device, wherein the second device is electrically coupled through the patterned reference layer to a first printed wiring board in the land-side module; and

wherein the subsequent device is coupled through the patterned reference layer to a subsequent printed wiring board in the land-side module.

12 . The method of claim 8 , further including:

coupling a third device to the patterned reference layer, the third device adjacent the first device, wherein the third device is electrically coupled to the patterned reference layer, and wherein the first land-side device physically and communicatively bridges between the first device and the third device;

coupling a second device to the patterned reference layer, the second device opposite the third device and adjacent the first device, wherein the second device is electrically coupled through the patterned reference layer to a first printed wiring board in the land-side module;

wherein the subsequent device is coupled through the patterned reference layer to a subsequent printed wiring board in the land-side module; and

coupling a board to the first printed wiring board through a land-side ball array.

13 . The method of claim 8 , further including:

coupling a third device to the patterned reference layer, the third device adjacent the first device, wherein the third device is electrically coupled to the patterned reference layer, and wherein the first land-side device physically and communicatively bridges between the first device and the third device;

coupling a second device to the patterned reference layer, the second device opposite the third device and adjacent the first device, wherein the second device is electrically coupled through the patterned reference layer to a first printed wiring board in the land-side module;

wherein the subsequent device is coupled through the patterned reference layer to a subsequent printed wiring board in the land-side module;

coupling a board to the first printed wiring board through a land-side ball array; and

coupling a user interface to the die-side module and electrically coupled to the board by a through-mold via.

14 . The method of claim 13 , wherein the first printed wiring board and the subsequent printed wiring board are integral parts of an open-frame structure.

15 . The method of claim 9 , further including:

coupling a second device to the patterned reference layer, the second device adjacent the first device, wherein the second device is coupled through the patterned reference layer to a first printed wiring board in the land-side module; and

coupling a second land-side device to the patterned reference layer, the second land-side device in the land-side module, wherein the second land-side device is coupled through the patterned reference layer to the die-side module.

16 . The method of claim 9 , further including:

coupling a second device to the patterned reference layer, the second device adjacent the first device, wherein the second device is coupled through the patterned reference layer to a first printed wiring board in the land-side module;

and

coupling a second land-side device to the patterned reference layer, the second land-side device in the land-side module, wherein the second land-side device is coupled through the patterned reference layer to the third device.

17 . The method of claim 9 , further including:

coupling a fourth device to the patterned reference layer, the fourth device adjacent the third device, wherein the fourth device is electrically coupled to the patterned reference layer; and

coupling a second land-side device to the patterned reference layer, the second land-side device in the land-side module, wherein the second land-side device is coupled through the patterned reference layer to the third device and to the fourth device.

18 . The method of claim 9 , further including:

coupling a fourth device to the patterned reference layer, the fourth device adjacent the third device, wherein the fourth device is electrically coupled to the patterned reference layer;

coupling a second land-side device to the patterned reference layer, the second land-side device in the land-side module, wherein the second land-side device is coupled through the patterned reference layer to the third device and to the fourth device; and

coupling a third land-side device to the patterned reference layer, the third land-side device disposed in the land-side module and coupled through the patterned reference layer to the fourth device, wherein the fourth device overlaps the third land-side device.