Method and system of non-destructive testing for composites
Method and system are disclosed for characterizing and quantifying composite laminate structures. The method and system take a composite laminate of unknown ply stack composition and sequence and determine various information about the individual plies, such as ply stack, orientation, microstructure, and type. The method and system can distinguish between weave types that may exhibit similar planar stiffness behaviors, but would produce different failure mechanisms. Individual ply information may then be used to derive the laminate bulk properties from externally provided constitutive properties of the fiber and matrix, including extensional stiffness, bending-extension coupling stiffness, bending stiffness, and the like. The laminate bulk properties may then be used to generate a probabilistic failure envelope for the composite laminate. This provides the ability to perform non-destructive QA to ensure that individual lamina layup was accomplished according to specifications, and results may be used to identify a numerous laminate properties beyond purely structural.
1. A method comprising:
receiving sound property data for a bonding material and a bonded material;
controlling a z-start time and a z-gate time of at least one pulse-wave detector to generate ultrasonic composite scan data as a function of the sound property data for the bonding material and the bonded material;
processing the ultrasonic composite scan data using a processor to identify layer transitions between the bonding material and the bonded material;
generating a user display showing a number of layers of the bonded material and a distance between each layer;
generating a user control to allow a user to select one layer of the number of layers of the bonded material; and
generating a thickness associated with the selected layer.
2. The method of claim 1 , wherein the thickness is a thickness of the bonding material.
3. The method of claim 1 , wherein the bonding material is epoxy resin or a polymer.
4. The method of claim 1 , wherein the bonded material is fiber.
5. The method of claim 1 , wherein processing the ultrasonic composite scan data using the processor to identify the layer transitions between the bonding material and the bonded material comprises processing the ultrasonic composite scan data using the processor to identify the number of layers.
6. The method of claim 1 , wherein processing the ultrasonic composite scan data using the processor to identify the layer transitions between the bonding material and the bonded material comprises processing the ultrasonic composite scan data using the processor to identify a change in the number of layers.
7. The method of claim 1 , wherein processing the ultrasonic composite scan data using the processor to identify the layer transitions between the bonding material and the bonded material further comprises processing the ultrasonic composite scan data using the processor to identify a type of an individual layer.
8. A method comprising:
receiving sound property data for a bonding material and a bonded material;
controlling a z-start time and a z-gate time of at least one pulse-wave detector to generate ultrasonic composite scan data as a function of the sound property data for the bonding material and the bonded material;
processing the ultrasonic composite scan data using a processor to identify layer transitions between the bonding material and the bonded material;
generating a user display showing a number of layers of the bonded material and a distance between each layer;
receiving a user selection of one layer of the number of layers of the bonded material; and
determining a thickness associated with the selected layer.
9. The method of claim 8 , wherein the thickness is a thickness of the bonding material.
10. The method of claim 8 , wherein the bonding material is epoxy resin.
11. The method of claim 8 , wherein the bonded material is fiber.
12. The method of claim 8 , wherein processing the ultrasonic composite scan data using the processor to identify the layer transitions between the bonding material and the bonded material comprises processing the ultrasonic composite scan data using the processor to identify the number of layers.
13. The method of claim 8 , wherein processing the ultrasonic composite scan data using the processor to identify the layer transitions between the bonding material and the bonded material comprises processing the ultrasonic composite scan data using the processor to identify a change in the number of layers.
14. A method comprising:
receiving sound property data for a matrix of bonded material;
controlling a z-start time and a z-gate time of at least one pulse-wave detector to generate ultrasonic composite scan data as a function of the sound property data for the matrix of bonded material;
processing the ultrasonic composite scan data using a processor to identify layer transitions in the matrix of bonded material;
generating a user display showing a number of layers in the matrix of bonded material and a distance between each layer;
generating a user control to allow a user to select one layer of the number of layers in the matrix of bonded material; and
generating a thickness associated with the selected layer.
15. The method of claim 14 , wherein the thickness is a thickness of the bonding material.
16. The method of claim 14 , wherein the matrix of bonded material comprises epoxy resin.
17. The method of claim 14 , wherein the matrix of bonded material comprises fiber.
18. The method of claim 14 , wherein processing the ultrasonic composite scan data using the processor to identify the layer transitions comprises processing the ultrasonic composite scan data using the processor to identify the number of layers.
19. The method of claim 14 , wherein processing the ultrasonic composite scan data using the processor to identify the layer transitions comprises processing the ultrasonic composite scan data using the processor to identify a change in the number of layers.
20. The method of claim 14 , wherein processing the ultrasonic composite scan data using the processor to identify the layer transitions further comprises processing the ultrasonic composite scan data using the processor to identify a type of an individual layer.