LED module with hermetic seal of wavelength conversion material
An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate, having a high thermal conductivity, is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.
1. A light emitting device comprising:
a substrate having a first thermal conductivity;
a light emitting diode on the substrate;
a wavelength conversion material surrounding the light emitting diode, the wavelength conversion material comprising phosphor powder or quantum dots dispersed in a binder, having a second thermal conductivity substantially lower than the first thermal conductivity, and having a total volume substantially larger than a total volume of the light emitting diode;
a transparent plate disposed on the substrate and having a third thermal conductivity greater than the second thermal conductivity;
the light emitting diode located in a cavity in either the substrate or the transparent plate; and
a sealant forming a hermetic seal between the transparent plate and the substrate.
2. The light emitting device of claim 1 , wherein the cavity is in the substrate.
3. The light emitting device of claim 1 , wherein the cavity is in the transparent plate.
4. The light emitting device of claim 1 , wherein the transparent plate comprises glass and the sealant comprises melted glass affixing the transparent plate to the substrate.
5. The light emitting device of claim 1 , wherein the sealant comprises a metal solder material and the light emitting diode is bonded to an electrode on the substrate with a conductive bond formed from the same metal solder material.
6. The light emitting device of claim 1 , wherein the transparent plate comprises features that redirect light emitted by the light emitting diode or by the wavelength conversion material.
7. The light emitting device of claim 1 , wherein in operation heat generated by the light emitting diode is at least partially removed by thermal conduction through the substrate, the sealant, and the transparent plate, and a temperature of the wavelength conversion material is lower than a temperature of the light emitting diode.
8. The light emitting device of claim 1 , wherein:
the transparent plate comprises flat side wall edges around a periphery of the transparent plate;
the substrate comprises flat side wall edges around a periphery of the substrate; and
the flat side wall edges of the transparent plate coincide with the flat sidewall edges of the substrate.
9. The light emitting device of claim 1 , wherein the wavelength conversion material fills the cavity.
10. The light emitting device of claim 1 , wherein:
the cavity is in the substrate; and
in operation, heat generated by the light emitting diode is at least partially removed by thermal conduction through the substrate, the sealant, and the transparent plate, and a temperature of the wavelength conversion material is lower than a temperature of the light emitting diode.
11. The light emitting device of claim 10 , wherein the transparent plate comprises an opening located over the cavity.
12. The light emitting device of claim 11 , wherein the opening is hermetically sealed.
13. The light emitting device of claim 11 , wherein:
the transparent plate comprises flat side wall edges around a periphery of the transparent plate;
the substrate comprises flat side wall edges around a periphery of the substrate; and
the flat side wall edges of the transparent plate coincide with the flat sidewall edges of the substrate.
14. A light emitting device comprising:
a substrate having a first thermal conductivity comprising a cavity;
a light emitting diode located in the cavity of the substrate;
a wavelength conversion material surrounding the light emitting diode, the wavelength conversion material comprising phosphor quantum dots dispersed in a binder, having a second thermal conductivity substantially lower than the first thermal conductivity, and having a total volume substantially larger than a total volume of the light emitting diode;
a transparent plate disposed on the substrate and having a third thermal conductivity greater than the second thermal conductivity; and
a sealant forming a hermetic seal between the transparent plate and the substrate.
15. The light emitting device of claim 14 , wherein the wavelength conversion material fills the cavity.
16. The light emitting device of claim 14 , wherein in operation heat generated by the light emitting diode is at least partially removed by thermal conduction through the substrate, the sealant, and the transparent plate, and a temperature of the wavelength conversion material is lower than a temperature of the light emitting diode.
17. A light emitting device comprising:
a substrate having a first thermal conductivity;
a light emitting diode on the substrate;
a wavelength conversion material surrounding the light emitting diode, the wavelength conversion material comprising phosphor powder or quantum dots dispersed in a binder, having a second thermal conductivity substantially lower than the first thermal conductivity, and having a total volume substantially larger than a total volume of the light emitting diode;
a transparent plate disposed on the substrate and having a third thermal conductivity greater than the second thermal conductivity, the transparent plate comprising a cavity, the light emitting diode and wavelength conversion material located in the cavity; and
a sealant forming a hermetic seal between the transparent plate and the substrate.
18. The light emitting device of claim 17 , wherein the substrate comprises a flat surface and the light emitting diode is disposed on the flat surface.
19. The light emitting device of claim 17 , wherein in operation heat generated by the light emitting diode is at least partially removed by thermal conduction through the substrate, the sealant, and the transparent plate, and a temperature of the wavelength conversion material is lower than a temperature of the light emitting diode.