Built-in bypass diode
A bypass diode can include a first conductive region of a first conductivity type disposed above a substrate of a solar cell and a second conductive region of a second conductivity type disposed above the first conductive region. The bypass diode can include a thin dielectric region disposed directly between the first and second conductive regions.
1. A solar cell, comprising:
a substrate having a light-receiving surface and a back surface;
a first thin dielectric layer disposed on the back surface of the substrate;
a first conductive region of a first conductivity type disposed on the first thin dielectric layer;
a second thin dielectric layer disposed on the back surface of the substrate;
a first portion of a second conductive region of a second, different, conductivity type disposed on the second thin dielectric layer;
a third thin dielectric layer in lateral contact with the first conductive region and in lateral contact with the first portion of the second conductive region, wherein the third thin dielectric layer laterally separates the first conductive region from the first portion of the second conductive region;
a second portion of the second conductive region disposed on a fourth thin dielectric layer, wherein the second portion of the second conductive region is physically separate from the first portion of the second conductive region, wherein the fourth thin dielectric layer is directly vertically between the first conductive region and the second portion of the second conductive region, wherein the fourth thin dielectric layer is directly on an entirety of a bottommost surface of the second portion of the second conductive region, wherein an entirety of the fourth thin dielectric layer is within a footprint of the bottommost surface of the second portion of the second conductive region, and wherein the fourth thin dielectric layer spaces the bottommost surface of the second portion of the second conductive region apart from an uppermost surface of the first conductive region;
a first conductive contact structure disposed on the second portion of the second conductive region, wherein the first conductive contact structure has an uppermost horizontal surface with respect to the back surface of the substrate, the uppermost horizontal surface of the first conductive contact structure vertically overlapping with and vertically spaced apart from the second portion of the second conductive region; and
a second conductive contact structure disposed on the first conductive region and on the first portion of the second conductive region, wherein the second conductive contact structure has an uppermost horizontal surface with respect to the back surface of the substrate, the uppermost horizontal surface of the second conductive contact structure at a same level as the uppermost horizontal surface of the first conductive contact structure, the uppermost horizontal surface of the second conductive contact structure vertically overlapping with and vertically spaced apart from the first portion of the second conductive region.
2. The solar cell of claim 1 , wherein first conductive region overlaps the first portion of the second conductive region.
3. The solar cell of claim 1 , wherein the first and second conductive contact structures each comprise a metal selected from the group consisting of aluminum, copper and silver.
4. The solar cell of claim 1 , wherein the substrate is an N-type monocrystalline silicon substrate, the first conductivity type is P-type, and the second conductivity type is N-type.
5. The solar cell of claim 1 , wherein the first, second and third thin dielectric layers comprise a tunnel oxide.
6. The solar cell of claim 1 , wherein the first conductive region of the first conductivity type comprises a P-type doped polysilicon.
7. The solar cell of claim 1 , wherein the first portion and the second portion of the second conductive region of the second conductivity type comprise a N-type doped polysilicon.
8. A solar cell, comprising:
a substrate having a light-receiving surface and a back surface;
a first thin dielectric layer disposed on the back surface of the substrate;
a first conductive region of a first conductivity type disposed on the first thin dielectric layer;
a second thin dielectric layer disposed on the back surface of the substrate;
a first portion of a second conductive region of a second, different, conductivity type disposed on the second thin dielectric layer;
a third thin dielectric layer in lateral contact with the first conductive region and in lateral contact with the first portion of the second conductive region, wherein of the third thin dielectric layer laterally separates the first conductive region from the first portion of the second conductive region;
a second portion of the second conductive region disposed on a fourth thin dielectric layer, wherein the second portion of the second conductive region is physically separate from the first portion of the second conductive region, wherein the fourth thin dielectric layer is directly vertically between the first conductive region and the second portion of the second conductive region, wherein the fourth thin dielectric layer is directly on an entirety of a bottommost surface of the second portion of the second conductive region, wherein an entirety of the fourth thin dielectric layer is within a footprint of the bottommost surface of the second portion of the second conductive region, and wherein the fourth thin dielectric layer spaces the bottommost surface of the second portion of the second conductive region apart from an uppermost surface of the first conductive region;
a dielectric region disposed on the first conductive region, wherein the second portion of the second conductive region is disposed through the dielectric region;
a first conductive contact structure disposed on the second portion of the second conductive region, wherein the first conductive contact structure has an uppermost horizontal surface with respect to the back surface of the substrate, the uppermost horizontal surface of the first conductive contact structure vertically overlapping with and vertically spaced apart from the second portion of the second conductive region; and
a second conductive contact structure disposed on the first conductive region and on the first portion of the second conductive region, wherein a portion of the second conductive contact structure is disposed through the dielectric region, wherein the second conductive contact structure has an uppermost horizontal surface with respect to the back surface of the substrate, the uppermost horizontal surface of the second conductive contact structure at a same level as the uppermost horizontal surface of the first conductive contact structure, the uppermost horizontal surface of the second conductive contact structure vertically overlapping with and vertically spaced apart from the first portion of the second conductive region.
9. The solar cell of claim 8 , wherein the first portion of the second conductive region overlaps the dielectric region.
10. The solar cell of claim 8 , wherein the dielectric region comprises silicon dioxide.
11. The solar cell of claim 8 , wherein the first and second conductive contact structures each comprise a metal selected from the group consisting of aluminum, copper and silver.
12. The solar cell of claim 8 , wherein the substrate is an N-type monocrystalline silicon substrate, the first conductivity type is P-type, and the second conductivity type is N-type.
13. The solar cell of claim 8 , wherein the first, second and third thin dielectric layers comprise a tunnel oxide.
14. The solar cell of claim 8 , wherein the first conductive region of the first conductivity type comprises a P-type doped polysilicon.
15. The solar cell of claim 8 , wherein the first portion and the second portion of the second conductive region of the second conductivity type comprise a N-type doped polysilicon.