LED package structure and carrier thereof
An LED package structure and a carrier thereof are provided. The LED package structure includes a carrier, a plurality of LED chips, and an encapsulating colloid. The carrier includes a substrate, a ring-shaped first wall disposed on the substrate, and a ring-shaped second wall stacked on the first wall. A portion of the substrate surrounded by the first wall is defined as a die-bonding region, and the first wall, the second wall, and the die-bonding region jointly define an accommodating space. The LED chips are mounted on the die-bonding region and are arranged in the accommodating space. The encapsulating colloid is filled within the accommodating space, and the LED chips are embedded in the encapsulating colloid.
1. A light emitting diode (LED) package structure, comprising:
a carrier including:
a substrate having a first board surface and a second board surface that is opposite to the first board surface; and
a multi-layer surrounding dam formed on the first board surface of the substrate and including:
a first wall being in a ring-shape and disposed on the first board surface, wherein a portion of the first board surface surrounded by the first wall is defined as a die-bonding region; and
a second wall being in a ring-shape and stacked on the first wall, wherein the first wall, the second wall, and the die-bonding region jointly define an accommodating space;
a plurality of LED chips mounted on the die-bonding region of the substrate and arranged in the accommodating space; and
an encapsulating colloid filled within the accommodating space, wherein the LED chips are embedded in the encapsulating colloid;
wherein each of the LED chips is in an elongated shape defining a longitudinal direction, and the LED chips are divided into a first chip group and a second chip group, and wherein the longitudinal direction of any one of the LED chips in the first chip group is parallel to a first direction, and the longitudinal direction of any one of the LED chips in the second chip group is parallel to a second direction that is not parallel to the first direction.
2. The LED package structure according to claim 1 , wherein an outer lateral side of the multi-layer surrounding dam has a maximum outer diameter, and an inner lateral side of the multi-layer surrounding dam has a minimum inner diameter that is at least 80% of the maximum outer diameter.
3. The LED package structure according to claim 1 , wherein an outer lateral side and an inner lateral side of the multi-layer surrounding dam have a maximum width there-between that is less than or equal to a height of the multi-layer surrounding dam with respect to the first board surface.
4. The LED package structure according to claim 3 , wherein the maximum width of the multi-layer surrounding dam is within in a range of 70% to 80% of the height of the multi-layer surrounding dam.
5. The LED package structure according to claim 1 , wherein each of the first wall and the second wall is arranged head-tail so as to form a ring-shaped structure, and a head-tail junction of the second wall is not located at the same location as a head-tail junction of the first wall.
6. The LED package structure according to claim 1 , wherein a bottom side of the second wall is in a concave shape and is gaplessly connected to a top side of the first wall, and wherein in a cross section of the multi-layer surrounding dam perpendicular to the substrate, the bottom side and a top side of the second wall are each in an arc shape, and a radius of curvature of the top side of the second wall is less than a radius of curvature of the bottom side of the second wall.
7. The LED package structure according to claim 1 wherein the second chip group is arranged to surround an outer side of the first chip group, and wherein in the second chip group, a minimum distance between the multi-layer surrounding dam and any one of the LED chips is 90% to 110% of a minimum distance between the multi-layer surrounding dam and another one of the LED chips.
8. The LED package structure according to claim 1 , wherein the first direction is perpendicular to the second direction.
9. The LED package structure according to claim 1 , wherein an inner lateral side of the multi-layer surrounding dam has a ring-shaped groove recessed in a connection portion between the first wall and the second wall, a height of the ring-shaped groove with respect to the first board surface is greater than a thickness of any one of the LED chips, and the ring-shaped groove is fully filled with the encapsulating colloid.
10. The LED package structure according to claim 1 , wherein the encapsulating colloid has a plurality of phosphor embedded therein, and wherein in a cross section of the multi-layer surrounding dam perpendicular to the substrate, a top side of the second wall is in an arc shape and has a radius of curvature that is less than or equal to 50% of a maximum width of the second wall.
11. The LED package structure according to claim 1 , wherein the second wall does not contact the first board surface of the substrate, and the die-bonding region of the first board surface is a light reflective surface.
12. A carrier of a light emitting diode (LED) package structure, comprising:
a substrate having a first board surface and a second board surface that is opposite to the first board surface; and
a multi-layer surrounding dam formed on the first board surface of the substrate and including:
a first wall being in a ring-shape and disposed on the first board surface, wherein a portion of the first board surface surrounded by the first wall is defined as a die-bonding region for providing at least one LED chip to be mounted thereon; and
a second wall being in a ring-shape and stacked on the first wall, wherein the first wall, the second wall, and the die-bonding region jointly define an accommodating space;
wherein a bottom side of the second wall is in a concave shape and is gaplessly connected to a top side of the first wall, and wherein in a cross section of the multi-layer surrounding dam perpendicular to the substrate, the bottom side and a top side of the second wall are each in an arc shape, and a radius of curvature of the top side of the second wall is less than a radius of curvature of the bottom side of the second wall.
13. The carrier according to claim 12 , wherein an outer lateral side of the multi-layer surrounding dam has a maximum outer diameter, and an inner lateral side of the multi-layer surrounding dam has a minimum inner diameter that is at least 80% of the maximum outer diameter.
14. The carrier according to claim 12 , wherein an outer lateral side and an inner lateral side of the multi-layer surrounding dam have a maximum width there-between that is less than or equal to a height of the multi-layer surrounding dam with respect to the first board surface.
15. The carrier according to claim 14 , wherein the maximum width of the multi-layer surrounding dam is within in a range of 70% to 80% of the height of the multi-layer surrounding dam.
16. The carrier according to claim 12 , wherein each of the first wall and the second wall is arranged head-tail so as to form a ring-shaped structure, and a head-tail junction of the second wall is not located at the same location as a head-tail junction of the first wall.
17. The carrier according to claim 12 , wherein an inner lateral side of the multi-layer surrounding dam has a ring-shaped groove recessed in a connection portion between the first wall and the second wall.
18. The carrier according to claim 12 , wherein the encapsulating colloid has a plurality of phosphor embedded therein, and wherein in the cross section of the multi-layer surrounding dam perpendicular to the substrate, the radius of the curvature of the top side of the second wall is less than or equal to 50% of a maximum width of the second wall.
19. The carrier according to claim 12 , wherein the second wall does not contact the first board surface of the substrate, and the die-bonding region of the first board surface is a light reflective surface.
20. A light emitting diode (LED) package structure, comprising:
a carrier including:
a substrate having a first board surface and a second board surface that is opposite to the first board surface; and
a multi-layer surrounding dam formed on the first board surface of the substrate and including:
a first wall being in a ring-shape and disposed on the first board surface, wherein a portion of the first board surface surrounded by the first wall is defined as a die-bonding region; and
a second wall being in a ring-shape and stacked on the first wall, wherein the first wall, the second wall, and the die-bonding region jointly define an accommodating space;
a plurality of LED chips mounted on the die-bonding region of the substrate and arranged in the accommodating space; and
an encapsulating colloid filled within the accommodating space, wherein the LED chips are embedded in the encapsulating colloid;
wherein a bottom side of the second wall is in a concave shape and is gaplessly connected to a top side of the first wall, and wherein in a cross section of the multi-layer surrounding dam perpendicular to the substrate, the bottom side and a top side of the second wall are each in an arc shape, and a radius of curvature of the top side of the second wall is less than a radius of curvature of the bottom side of the second wall.