IP Library Granted Patent US 12,449,213
Granted Patent B2
US 12,449,213 · App. 16/921,347 · Granted Oct 21, 2025

Systems and methods for employing for forming and patterning flexible material

Inventors: Steven Embleton (Austin, TX); Travis C. North (Cedar Park, TX)
Assignee: Dell Products L.P.
F28F21/02B32B3/30B32B37/0076H05K7/20263H05K7/20772H05K7/20781H05K7/20836B32B2305/02B32B2307/304F28F2255/02Y10T29/4935
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Quick Facts
Patent No.
US 12,449,213
App. No.
16/921,347
Granted
Oct 21, 2025
Kind
B2
Abstract

A member may include a flexible material with thickness significantly smaller than that of other dimensions of the flexible material and at least one localized structure patterned within the flexible material, the at least one localized structure having a negative Poisson's ratio, such that when the member is mechanically coupled to a second structure using mechanical stress, the member conforms to features of the second structure.

Claims (28)

1. A member comprising:

a flexible material with thickness significantly smaller than that of other dimensions of the flexible material;

at least one localized structure patterned within the flexible material prior to mechanically coupling the member to a second structure, the at least one localized structure having a negative Poisson's ratio such that the member is configured to conform to features of the second structure when the member is mechanically coupled to the second structure using mechanical stress; and

a compliant material coupled to the flexible material in order to provide mechanical force to maintain physical contact between the flexible material and the second structure.

2. The member of claim 1 , wherein the flexible material comprises a flexible graphite material.

3. The member of claim 1 , wherein the flexible material is thermally conductive and the compliant material is thermally insulative.

4. The member of claim 1 , wherein the at least one localized structure comprises patterning that does not penetrate through the flexible material.

5. The member of claim 1 , wherein the at least one localized structure comprises patterning that penetrates through the flexible material.

6. The member of claim 1 , wherein the at least one localized structure is formed to correspond to the features of the second structure.

7. A system comprising:

a component; and

heat-rejecting media mechanically and thermally coupled to the component and comprising:

a flexible material with thickness significantly smaller than that of other dimensions of the flexible material; and

at least one localized structure patterned within the flexible material prior to mechanically coupling the heat-rejecting media to a second structure, the at least one localized structure having a negative Poisson's ratio such that the heat-rejecting media is configured to conform to features of the component when the heat-rejecting media is mechanically coupled to the component using mechanical stress; and

a compliant material coupled to the flexible material in order to provide mechanical force to maintain physical contact between the flexible material and the component.

8. The system of claim 7 , wherein the flexible material comprises a flexible graphite material.

9. The system of claim 7 , wherein the flexible material is thermally conductive and the compliant material is thermally insulative.

10. The system of claim 7 , wherein the at least one localized structure comprises patterning that does not penetrate through the flexible material.

11. The system of claim 7 , wherein the at least one localized structure comprises patterning that penetrates through the flexible material.

12. The system of claim 7 , wherein the at least one localized structure is formed to correspond to the features of the component.

13. A method comprising:

patterning at least one localized structure within a flexible material having thickness significantly smaller than that of other dimensions of the flexible material, and the at least one localized structure having a negative Poisson's ratio such that a member comprising the flexible material is configured to conform to features of a second structure when the member is mechanically coupled to the second structure using mechanical stress; and

mechanically coupling a compliant material to the flexible material in order to provide mechanical force to maintain physical contact between the flexible material and the second structure.

14. The method of claim 13 , wherein the flexible material comprises a flexible graphite material.

15. The method of claim 13 , wherein the flexible material is thermally conductive and the compliant material is thermally insulative.

16. The method of claim 13 , wherein the at least one localized structure comprises patterning that does not penetrate through the flexible material.

17. The method of claim 13 , wherein the at least one localized structure comprises patterning that penetrates through the flexible material.

18. The method of claim 13 , wherein the at least one localized structure is formed to correspond to the features of the second structure.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053574/0221) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060333/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053578/0183) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060332/0864 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053573/0535) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060333/0106 →
RELEASE OF SECURITY INTEREST AT REEL 053531 FRAME 0108 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0371 →
SECURITY INTEREST Recorded Aug 21, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 053578/0183 →
SECURITY INTEREST Recorded Aug 21, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 053573/0535 →
SECURITY INTEREST Recorded Aug 21, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 053574/0221 →
SECURITY AGREEMENT Recorded Aug 18, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 053531/0108 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2020
From: EMBLETON, STEVEN; NORTH, TRAVIS C.
To: DELL PRODUCTS L.P.
Reel/Frame 053129/0110 →
Continuity (1)
Related Publication 20220003511A1 · Jan 6, 2022
References Cited (4)
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US 20090288819A1 · Taherian · 2009 [cited by examiner]
US 20140233197A1 · Schwab · 2014 [cited by examiner]
US 20190104645A1 · Paseman · 2019 [cited by examiner]