IP Library Granted Patent US 11,313,631
Granted Patent B2
US 11,313,631 · App. 16/921,970 · Granted Apr 26, 2022

Composite heat sink having anisotropic heat transfer metal-graphite composite fins

Inventors: Xiaohua Chen (Hong Kong, HK); Chi Ho Kwok (Hong Kong, HK); Chenmin Liu (Hong Kong, HK); Ai Xiang Sun (Hong Kong, HK); Lanyue Dou (Hong Kong, HK)
Assignee: HFC Industry Limited
F28F3/025F28F3/04F28F21/02F28F21/085F28D2021/0029
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Quick Facts
Patent No.
US 11,313,631
App. No.
16/921,970
Granted
Apr 26, 2022
Kind
B2
Abstract

A composite server heat sink with a metal base having a thermal conductivity of at least 200W/mK. Plural fins extend from the metal base, each fin having an anisotropic thermal conductivity in a range of approximately 300 to 650 W/mK in a longitudinal direction of the fin and less than approximately 30 W/mK in a widthwise direction of the fin. Each fin includes graphite in an amount of approximately 45-70 wt. %, diamond in an amount of approximately 2.5 to 10 wt. % with the balance comprising a metal selected from one or more of copper and aluminum. To create the anisotropic thermal properties, the graphite is aligned along the longitudinal direction of the fin.

Claims (15)

1. An anisotropic composite heat sink comprising:

a base comprising a metal having a thermal conductivity of at least 200 W/mK;

a plurality of anisotropic, pressure-aligned graphite, diamond, and metal composite fins extending from the metal base, each fin having an anisotropic thermal conductivity in a range of approximately 300 to 650 W/mK in a longitudinal direction of the fin with a thermal conductivity less than approximately 30 W/mK in a widthwise direction of the fin, each fin comprising graphite in an amount of approximately 45-70 wt. %, diamond having a diameter of approximately 1.0 to 5.0 microns in an amount of approximately 2.5 to 10 wt. % with the balance comprising a metal selected from one or more of copper and aluminum,

wherein the graphite is aligned along the longitudinal direction of the fin.

2. The composite heat sink of claim 1 , wherein the plurality of fins are bonded to the base by one or more thermally conductive resins with a thermal conductivity of at least 5 W/mK.

3. The composite heat sink of claim 1 , wherein the fins are approximately perpendicular to the metal base.

4. The composite heat sink of claim 1 , wherein the base comprises copper or aluminum.

5. The composite heat sink of claim 1 , wherein the base is a plate with the plurality of fins extending from one or two sides thereof.

6. The composite heat sink of claim 1 , wherein the base is a solid or hollow cylinder with the plurality of fins extending from a circumference of the cylinder.

7. The composite heat sink of claim 1 , wherein the graphite is selected from one or more of natural graphite, synthetic graphite, or graphite fibers.

8. The composite heat sink of claim 1 , wherein the graphite-diamond-metal fin material is formed from powder precursors sintered by a spark plasma sintering process.

9. The composite heat sink of claim 8 , wherein the spark plasma sintering is performed at a temperature of approximately 400-780° C.

10. The composite heat sink of claim 9 , wherein the spark plasma sintering is performed at a temperature of 25-400° C. by increasing the temperature by approximately 100° C/min and at a temperature of 400-780° C. by increasing the temperature by approximately 50° C/min, and maintaining a highest temperature for approximately 7-10 mins under an axial pressure of 30-70 MPa.

11. The composite heat sink of claim 1 , wherein the diamond particles are surface treated with acid treatment with sulfuric acid and nitric acid in a ratio of 3:1 to 1:1 or oxygen plasma treatment to increase bonding to the copper and/or aluminum.

12. The composite heat sink of claim 1 , wherein each of the plurality of fins has a coefficient of thermal expansion of approximately 6×10 −6 /K or less.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2026
From: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
To: HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED
Reel/Frame 075402/0632 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2022
From: HFC INDUSTRY LIMITED
To: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
Reel/Frame 060020/0207 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2020
From: CHEN, XIAOHUA; KWOK, CHI HO; LIU, CHENMIN; SUN, AI XIANG; DOU, LANYUE
To: HFC INDUSTRY LIMITED
Reel/Frame 053286/0216 →
Continuity (1)
Related Publication 20220011059A1 · Jan 13, 2022