Process for preparing a processed filament, including interaction of a segment with at least one beam of electromagnetic radiation of a first kind
One aspect relates to a process for preparing a processed filament, including provision of a filament, including a segment. At least in the segment, the filament includes a core, including a first metal, a first layer which is superimposed on the core, and includes a polymer, and a second layer which is superimposed on the first layer, and includes a second metal. The segment of the filament is processed by interaction of the segment with at least one beam of electromagnetic radiation of a first kind. The electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, one aspect relates to a processed filament, obtainable by the process; a filament; an electrical device, including at least a part of the processed filament.
1. A process for preparing a processed filament, the process comprising:
a) providing a filament, comprising a segment,
wherein, at least in the segment, the filament comprises
i) a core, comprising a first metal,
ii) a first layer which
I) is superimposed on the core, and
II) comprises a polymer, and
iii) a second layer which
I) is superimposed on the first layer, and
II) comprises a second metal; and
b) processing the segment of the filament by interaction of the segment with at least one beam of electromagnetic radiation of a first kind;
wherein the electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm, and
wherein a surface of the first layer has an average roughness R a in the range from 0.07 to 4 μm.
2. The process of claim 1 , wherein a surface of the first layer has a root-mean-squared roughness R q in the range from 0.2 to 7 μm.
3. The process of claim 1 , wherein the at least one beam of electromagnetic radiation of the first kind is at least one laser beam of a first kind, wherein the at least one laser beam of the first kind is at least one pulsed laser beam of the first kind.
4. The process of claim 3 , wherein the at least one pulsed laser beam of the first kind is characterised by a pulse duration in a range from 10 fs to 500 ns.
5. The process of claim 3 , wherein a fluence of the at least one pulsed laser beam of the first kind is in the range from 1.0 to 5.0 J/cm 2 per pulse.
6. The process of claim 3 , wherein the at least one pulsed laser beam of the first kind is characterised by an energy per pulse in the range from 2 to 15 μJ.
7. The process of claim 1 , wherein, in the step b), the processing comprises at least partially removing the second layer from the segment of the filament.
8. The process of claim 1 , wherein the process further comprises:
c) further processing the segment of the filament by interaction of the segment with at least one beam of electromagnetic radiation of a further kind.
9. The process of claim 8 , wherein the electromagnetic radiation of the further kind has a spectrum with a peak wavelength in the range from 10 to 430 nm.
10. The process of claim 8 , wherein, in the step c), the further processing comprises at least partially removing the first layer from the segment of the filament.
11. The process of claim 1 , wherein the filament is one selected from a group consisting of a wire, a cable, and a fibre, or a combination of at least two thereof.
12. The process of claim 1 , wherein a surface of the first layer has an average roughness R a in the range from 0.2 to 4 μm.
13. The process of claim 1 , wherein the surface of the first layer faces the second layer.