IP Library Granted Patent US 11,676,991
Granted Patent B2
US 11,676,991 · App. 16/930,159 · Granted Jun 13, 2023

Semiconductor light emitting device

Inventors: Nicola Bettina Pfeffer (Eindhoven, NL); Arjen Gerben Van der Sijde (Eindhoven, NL); Pieter Johannes Quintus van Voorst Vader (Son, NL)
Assignee: Lumileds LLC
H01L27/156H01L33/0093H01L33/62H01S5/183H04M1/0264
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Quick Facts
Patent No.
US 11,676,991
App. No.
16/930,159
Granted
Jun 13, 2023
Kind
B2
Abstract

A semiconductor light-emitting device has an emitter matrix with an arrangement of emitter cells interspersed with non-emitter cells. The emitter cell has a semiconductor emitter, and a non-emitter cell does not have a semiconductor emitter. A number of bond pads for connection to a power supply and a plurality of wirebonds are present. Each wirebond extends from a bond pad to the semiconductor emitter of an emitter cell. An imaging arrangement includes a light source for illuminating a scene. The light source has a pair of such semiconductor light-emitting devices. A method of manufacturing such a semiconductor light-emitting device is also described.

Claims (32)

1. A semiconductor light-emitting device configured to illuminate a scene, and comprising:

an emitter matrix comprising an arrangement of emitter cells interspersed with non-emitter cells in a regular matrix array formation in which an emitter cell and a non-emitter cell each have essentially a same area, each emitter cell comprising a semiconductor emitter, and each non-emitter cell being a cell that does not contain any semiconductor emitter, each semiconductor emitter comprising circuitry that, when driven, is configured to emit light, at least one non-emitter cell comprising a switching element;

bond pads for connection to a driver configured to drive at least one of the semiconductor emitters; and

wirebonds each extending from one of the bond pads to provide current of the driver to the semiconductor emitter of one of the emitter cells.

2. The semiconductor light-emitting device of claim 1 , wherein the emitter matrix comprises an alternating arrangement of emitter cells and non-emitter cells.

3. The semiconductor light-emitting device of claim 1 , wherein the emitter cells and non-emitter cells are arranged in a checkerboard pattern.

4. The semiconductor light-emitting device of claim 1 , wherein the emitter cells and non-emitter cells are arranged in stripe pattern.

5. The semiconductor light-emitting device of claim 1 , wherein the emitter matrix comprises an array of at least nine emitter cells.

6. The semiconductor light-emitting device of claim 1 , wherein the emitters of the emitter matrix are infrared light-emitting diodes.

7. The semiconductor light-emitting device of claim 1 , wherein the emitters of the emitter matrix are vertical cavity surface-emitting lasers.

8. The semiconductor light-emitting device of claim 1 , wherein no wirebond extends from any of the bonding pads to any of the non-emitter cells.

9. The semiconductor light-emitting device of claim 1 , wherein:

a number of wirebonds is fewer than a number of cells in the emitter matrix, and

a center cell of the emitter matrix is one of the non-emitter cells.

10. The semiconductor light-emitting device of claim 1 , wherein:

each wirebond extends to a different switching element, and

each switching element is coupled with the semiconductor emitter of an adjacent emitter cell.

11. An imaging arrangement comprising:

a light source for illuminating a scene, the light source comprising a pair of semiconductor light-emitting devices, each semiconductor light-emitting device comprising:

an emitter matrix comprising an arrangement of emitter cells interspersed with non-emitter cells in a regular matrix array formation in which an emitter cell and a non-emitter cell each having essentially a same area, each emitter cell comprising a semiconductor emitter, and each non-emitter cell being a cell that does not contain any semiconductor emitter, each semiconductor emitter comprising circuitry that, when driven, is configured to emit light;

bond pads for connection to a driver configured to drive at least one of the semiconductor emitters; and

wirebonds each extending from one of the bond pads to provide current of the driver to the semiconductor emitter of one of the emitter cells,

the emitter matrix of a first of the semiconductor light-emitting devices arranged to illuminate essentially one half of the scene and the emitter matrix of a second of the semiconductor light-emitting devices arranged to illuminate essentially another half of the scene; and

an image sensor arrangement for capturing an image of the scene illuminated by the light source.

12. The imaging arrangement of claim 11 , further comprising beam-forming optics for shaping light emitted by the emitter matrices of the semiconductor light-emitting devices.

13. The imaging arrangement of claim 11 , wherein the emitter matrix of one of the semiconductor light-emitting devices generates a first illumination pattern, and the emitter matrix of another of the semiconductor light-emitting devices generates a second illumination pattern, the second illumination pattern being an inverse of the first illumination pattern.

14. The imaging arrangement of claim 11 , wherein the imaging arrangement is disposed in a compact mobile device.

15. The imaging arrangement of claim 11 , wherein the emitter matrix of at least one of the first or second of the semiconductor light-emitting devices comprises an alternating arrangement of the emitter cells and non-emitter cells.

16. The imaging arrangement of claim 11 , wherein the emitter cells and non-emitter cells of at least one of the first or second of the semiconductor light-emitting devices are arranged in a checkerboard pattern.

17. The imaging arrangement of claim 11 , wherein the emitter cells and non-emitter cells of at least one of the first or second of the semiconductor light-emitting devices are arranged in stripe pattern.

18. The imaging arrangement of claim 11 , wherein at least one non-emitter cell of at least one of the first or second of the semiconductor light-emitting devices comprises a switching element.

19. The imaging arrangement of claim 11 , wherein the emitter matrix of at least one of the first or second of the semiconductor light-emitting devices comprises an array of at least nine emitter cells.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR VAN VOORST VADER (KEEPING ORIGINNAL EXECUTION DATE) PREVIOUSLY RECORDED AT REEL: 053221 FRAME: 0479. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 28, 2022
From: PFEFFER, NICOLA BETTINA; VAN DER SIJDE, ARJEN GERBEN; VAN VOORST VADER, PIETER JOHANNES QUINTUS
To: LUMILEDS HOLDING B.V.
Reel/Frame 058890/0671 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THRID INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 053221 FRAME: 0479. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Nov 10, 2021
From: PFEFFER, NICOLA BETTINA; VAN DER SIJDE, ARJEN GERBEN; VAN VOORST VADER, PIETER JOHANNES QUINTUS
To: LUMILEDS HOLDING B.V.
Reel/Frame 058705/0698 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2021
From: LUMILEDS HOLDING B.V.
To: LUMILEDS LLC
Reel/Frame 057307/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2020
From: PFEFFER, NICOLA BETTINA; VAN DER SIJDE, ARJEN GERBEN; VAN VOORST-VADER, QUINT
To: LUMILEDS HOLDING B.V.
Reel/Frame 053221/0479 →