IP Library Granted Patent US 11,029,772
Granted Patent B1
US 11,029,772 · App. 16/934,215 · Granted Jun 8, 2021

Transparent conductive laminated structure including a first conductive film and first adhesive layer disposed on the first conductive film and touch panel

Inventors: Yung-Cheng Chang (Toufen, TW); Chia-Sheng Liao (Taipei, TW); Chung-Chin Hsiao (Hsinchu County, TW)
Assignee: Cambrios Film Solutions Corporation
G06F3/041G06F2203/04103
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,029,772
App. No.
16/934,215
Granted
Jun 8, 2021
Kind
B1
Abstract

A transparent conductive laminated structure and touch panel are disclosed. The transparent conductive laminated structure comprises a first conductive film including a first surface and a second surface opposing the first surface. A first adhesive layer is disposed on the first surface of the first conductive film, and a protective film is disposed on the first adhesive layer. A peeling strength between the first adhesive layer and the first conductive film is greater than a peeling strength between the first adhesive layer and the protective film.

Claims (30)

1. A transparent conductive laminated structure, comprising:

a first conductive film comprising a first surface and a second surface opposing the first surface;

a first adhesive layer disposed on the first surface of the first conductive film; and

a protective film disposed on the first adhesive layer,

wherein a peeling strength between the first adhesive layer and the first conductive film is greater than a peeling strength between the first adhesive layer and the protective film.

2. The transparent conductive laminated structure claimed in claim 1 , wherein the peeling strength between the first adhesive layer and the first conductive film is 100 times or more greater than the peeling strength between the first adhesive layer and the protective film.

3. The transparent conductive laminated structure claimed in claim 2 , wherein the peeling strength between the first adhesive layer and the protective film is less than 200 mN/25 mm.

4. The transparent conductive laminated structure claimed in claim 1 , wherein the first conductive film comprises a first substrate and a first conductive layer disposed on the first substrate, and wherein the first adhesive layer is disposed between the first substrate and the protective film or between the first conductive layer and the protective film.

5. The transparent conductive laminated structure claimed in claim 1 , wherein the first conductive film comprises a plurality of silver nanowires.

6. The transparent conductive laminated structure claimed in claim 1 , further comprising:

a second adhesive layer disposed on the second surface of the first conductive film; and

a release film disposed on the second adhesive layer,

wherein a peeling strength between the second adhesive layer and the first conductive film is greater than a peeling strength between the second adhesive layer and the release film.

7. The transparent conductive laminated structure claimed in claim 6 , wherein the first conductive film comprises a first substrate and a first conductive layer disposed on the first substrate, wherein the first adhesive layer is disposed between the first substrate and the protective film, and wherein the second adhesive layer is disposed between the first conductive layer and the release film.

8. The transparent conductive laminated structure claimed in claim 6 , wherein the peeling strength between the second adhesive layer and the first conductive film is 100 times or more greater than the peeling strength between the second adhesive layer and the release film.

9. The transparent conductive laminated structure claimed in claim 8 , wherein the peeling strength between the second adhesive layer and the release film is less than 200 mN/25 mm.

10. A touch panel, comprising:

a first conductive film comprising a first substrate and a first conductive layer disposed on the first substrate;

a second conductive film disposed beneath the first conductive film and comprising a second substrate and a second conductive layer disposed on the second substrate; and

a first adhesive layer disposed between the first conductive film and the second conductive film and contacting the first conductive film and the second conductive film,

wherein a peeling strength between the first adhesive layer and the first conductive film is greater than 15000 mN/25 mm.

11. The touch panel claimed in claim 10 , further comprising:

a protective film; and

a second adhesive layer disposed between the second substrate and the protective film,

wherein a peeling strength between the second adhesive layer and the second substrate is greater than a peeling strength between the second adhesive layer and the protective film.

12. The touch panel claimed in claim 11 , wherein the peeling strength between the second adhesive layer and the second substrate is 100 times or more greater than the peeling strength between the second adhesive layer and the protective film.

13. The touch panel claimed in claim 11 , wherein the peeling strength between the second adhesive layer and the protective film is less than 200 mN/25 mm.

14. The touch panel claimed in claim 10 , wherein the first conductive film and the second conductive film respectively comprise a plurality of silver nanowires.

15. The touch panel claimed in claim 10 , wherein the first conductive film and the second conductive film are patterned electrode layers.

16. The touch panel claimed in claim 10 , further includes an optical adhesive layer and a passivation layer, wherein the passivation layer is attached to the first conductive film by the optical adhesive layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2025
From: CAMBRIOS FILM SOLUTIONS CORPORATION
To: PINE CASTLE INVESTMENTS LIMITED
Reel/Frame 070110/0392 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2020
From: CHANG, YUNG-CHENG; LIAO, CHIA-SHENG; HSIAO, CHUNG-CHIN
To: CAMBRIOS FILM SOLUTIONS CORPORATION
Reel/Frame 053262/0475 →