Methods of manufacturing light-emitting devices with metal inlays and bottom contacts

1. A method comprising:

obtaining a packaging substrate comprising an embedded metal inlay, a plurality of vias in the packaging substrate and a plurality of contacts on a bottom surface of the packaging substrate, each electrically coupled to a respective one of the plurality of vias;

forming a hybridized device;

attaching a bottom surface of the hybridized device to a top surface of the metal inlay; and

wire bonding a top surface of the hybridized device to a top surface of the packaging substrate using a plurality of conductive connectors.

2. The method of claim 1 , further comprising dispensing a light-blocking encapsulant over the plurality of conductive connectors.

3. The method of claim 1 , further comprising molding a light-blocking encapsulant over the plurality of conductive connectors.

4. The method of claim 1 , wherein the forming the hybridized die comprises attaching a bottom surface of a segmented monolithic light-emitting array to a top surface of a silicon backplane.

5. The method of claim 4 , wherein the attaching the bottom surface of the segmented monolithic light-emitting array to the top surface of the silicon backplane comprises electrically coupling individual drivers to each of a plurality of light-emitting segments in the segmented monolithic light-emitting array or to each subset of the plurality of light-emitting segments in the segmented monolithic light-emitting array.

6. The method of claim 5 , wherein the electrically coupling comprises copper pillar bump attaching an array of copper pillar bumps on the silicon backplane to the bottom surface of the segmented monolithic light-emitting array.

7. The method of claim 1 , wherein the attaching the bottom surface of the hybridized die to the top surface of the metal inlay comprises:

dispensing a layer of a thermally conductive material on the top surface of the metal inlay, and

die attaching the hybridized die to the layer of the thermally conductive material.

8. The method of claim 1 , further comprising forming at least one metallization layer on the top surface of the packaging substrate, electrically coupled between the plurality of conductive connectors and the vias.

9. A method comprising:

embedding a metal inlay in a packaging substrate;

forming a plurality of vias in the packaging substrate;

forming a plurality of contacts on a bottom surface of the packaging substrate, each electrically coupled to one of the plurality of vias;

forming a hybridized device;

attaching a bottom surface of the hybridized device to a top surface of the metal inlay; and

wire bonding a top surface of the hybridized device to a top surface of the packaging substrate using a plurality of conductive connectors.

10. The method of claim 9 , further comprising dispensing a light-blocking encapsulant over the plurality of conductive connectors.

11. The method of claim 9 , further comprising molding a light-blocking encapsulant over the plurality of conductive connectors.

12. The method of claim 9 , wherein the forming the hybridized die comprises attaching a bottom surface of a segmented monolithic light-emitting array to a top surface of a silicon backplane.

13. The method of claim 12 , wherein the attaching the bottom surface of the segmented monolithic light-emitting array to the top surface of the silicon backplane comprises electrically coupling individual drivers to each of a plurality of light-emitting segments in the segmented monolithic light-emitting array or to each subset of the plurality of light-emitting segments in the segmented monolithic light-emitting array.

14. The method of claim 13 , wherein the electrically coupling comprises copper pillar bump attaching an array of copper pillar bumps on the silicon backplane to the bottom surface of the segmented monolithic light-emitting array.

15. The method of claim 9 , wherein the attaching the bottom surface of the hybridized die to the top surface of the metal inlay comprises:

dispensing a layer of a thermally conductive material on the top surface of the metal inlay, and

die attaching the hybridized die to the layer of the thermally conductive material.

16. The method of claim 9 , further comprising forming at least one metallization layer on the top surface of the packaging substrate, electrically coupled between the plurality of conductive connectors and the vias.

17. A method comprising:

obtaining a light-emitting package comprising a hybridized die mounted on a packaging substrate, the packaging substrate comprising an embedded first metal inlay, a plurality of vias in the packaging substrate and a plurality of contacts on a bottom surface of the packaging substrate and each electrically coupled to a respective one of the plurality of vias;

obtaining a control board having an embedded second metal inlay;

mounting the light-emitting package on a top surface of the control board with the embedded first metal inlay adjacent the embedded second metal inlay; and

wire bonding the plurality of conductive contacts on the top surface of the packaging substrate to a top surface of the control board.

18. The method of claim 17 , wherein the mounting the light-emitting package on the top surface of the control board comprises soldering the first embedded metal inlay to the second embedded metal inlay.

19. The method of claim 17 , wherein the mounting the light-emitting package on the top surface of the control board further comprises soldering the plurality of contacts on the bottom surface of the packaging substrate to a plurality of corresponding contacts on a top surface of the control board.

20. The method of claim 17 , further comprising attaching a bottom surface of the control board to a top surface of a heat sink.