Light-emitting device with metal inlay and top contacts

1. A device comprising:

a hybridized device having a top surface and a bottom surface;

a packaging substrate comprising a metal slug in an opening on a light-emitting top surface of the packaging substrate, the metal slug thermally coupled to the bottom surface of the hybridized device;

a plurality of conductive contacts on the light-emitting top surface of the packaging substrate, the plurality of conductive contacts on the light-emitting top surface of the packaging substrate being interfaces to an external control board; and

a plurality of conductive connectors electrically coupled between the top surface of the hybridized device and the light-emitting top surface of the packaging substrate.

2. The device of claim 1 , wherein the hybridized device comprises a silicon backplane and a monolithic array on the silicon backplane, the monolithic array comprising a plurality of light-emitting segments.

3. The device of claim 2 , wherein the silicon backplane comprises a plurality of drivers, one of the plurality of drivers being electrically coupled to provide a drive current to one or a subset of the plurality of light-emitting segments.

4. The device of claim 2 , wherein the plurality of light-emitting segments comprises at least 20,000 light-emitting segments spaced 20 μm or less apart.

5. The device of claim 1 , further comprising a layer of a thermally conductive metal material between a top surface of the metal slug and the bottom surface of the hybridized device.

6. The device of claim 1 , wherein the metal slug comprises a single body of a copper material embedded in the packaging substrate.

7. The device of claim 1 , further comprising a light-blocking encapsulant covering the plurality of conductive connectors.

8. The device of claim 7 , wherein the light-blocking encapsulant is one of silicone or epoxy with a carbon filler.

9. The device of claim 1 , further comprising at least one metallization layer on the top surface of the packaging substrate electrically coupled between the plurality of conductive connectors and the plurality of conductive contacts.

10. A device comprising:

a heat sink having a top surface;

a control board having a top surface and a bottom surface and defining an opening, the bottom surface of the control board being thermally coupled to the top surface of the heat sink;

a light-emitting device package at least partially in the opening in the control board, the light-emitting device package comprising a hybridized device on a light-emitting top surface of a packaging substrate, a metal slug in an opening on the light-emitting top surface of the packaging substrate, and a plurality of conductive contacts on the light-emitting top surface of the packaging substrate, a bottom surface of the packaging substrate being thermally coupled to the top surface of the heat sink; and

a plurality of conductive connectors electrically coupled between the top surface of the control board and the plurality of conductive contacts on the light-emitting top surface of the packaging substrate.

11. The device of claim 10 , wherein:

the heat sink further comprises a metal inlay in an opening on a top surface of the heat sink, and

a bottom surface of the metal slug is thermally coupled to a top surface of the metal inlay.

12. The device of claim 10 , wherein the plurality of conductive connectors are one of wires, ribbon wires and flexible circuits.

13. The device of claim 10 , wherein the hybridized device comprises a silicon backplane and at least one monolithic array on the silicon backplane, the at least one monolithic array comprising 20,000 or more light-emitting segments spaced 20 μm or less apart, and the silicon backplane comprising a separate driver for each of the 20,000 or more light-emitting segments or for each of a subset of the 20,000 or more light-emitting segments.

14. The device of claim 10 , wherein the light-emitting package further comprises a plurality of other conductive connectors electrically coupled between a top surface of the hybridized device and the packaging substrate.

15. A device comprising:

a control board having a top surface and a bottom surface;

a light-emitting device package having a bottom surface on the top surface of the control board, the light-emitting device package comprising a hybridized device on a light-emitting top surface of a packaging substrate, a metal slug in an opening on the light-emitting top surface of the packaging substrate, and a plurality of conductive contacts on the light-emitting top surface of the packaging substrate; and

a plurality of conductive connectors electrically coupled between the top surface of the control board and the plurality of conductive contacts on the light-emitting top surface of the packaging substrate.

16. The device of claim 15 , wherein:

the control board further comprises a metal inlay in an opening on the top surface of the control board, and

a bottom surface of the metal slug is thermally coupled to a top surface of the metal inlay.

17. The device of claim 15 , wherein the plurality of conductive connectors are one of wires, ribbon wires and flexible circuits.

18. The device of claim 15 , wherein the hybridized device comprises a silicon backplane and at least one monolithic array on the silicon backplane, the at least one monolithic array comprising 20,000 or more light-emitting segments spaced 20 μm or less apart, and the silicon backplane comprising a separate driver for each of the 20,000 or more light-emitting segments or for each of a subset of the 20,000 or more light-emitting segments.

19. The device of claim 15 , wherein the light-emitting package further comprises a plurality of other conductive connectors electrically coupled between a top surface of the hybridized device and the packaging substrate.